KR101009825B1 - 동장적층판 및 그 제조방법 - Google Patents
동장적층판 및 그 제조방법 Download PDFInfo
- Publication number
- KR101009825B1 KR101009825B1 KR1020060052691A KR20060052691A KR101009825B1 KR 101009825 B1 KR101009825 B1 KR 101009825B1 KR 1020060052691 A KR1020060052691 A KR 1020060052691A KR 20060052691 A KR20060052691 A KR 20060052691A KR 101009825 B1 KR101009825 B1 KR 101009825B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- micrometers
- insulating layer
- copper
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 127
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 97
- 229920001721 polyimide Polymers 0.000 claims abstract description 30
- 239000013078 crystal Substances 0.000 claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 21
- 230000003746 surface roughness Effects 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000009719 polyimide resin Substances 0.000 claims abstract description 15
- 239000002243 precursor Substances 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 abstract description 18
- 239000000126 substance Substances 0.000 abstract description 17
- 238000010438 heat treatment Methods 0.000 abstract description 16
- 238000005452 bending Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 43
- 238000000034 method Methods 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 13
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 7
- 229920005575 poly(amic acid) Polymers 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 6
- 239000005457 ice water Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- JTERLNYVBOZRHI-RIIGGKATSA-N [(2r)-3-[2-aminoethoxy(hydroxy)phosphoryl]oxy-2-[(5e,8e,11e,14e)-icosa-5,8,11,14-tetraenoyl]oxypropyl] (5e,8e,11e,14e)-icosa-5,8,11,14-tetraenoate Chemical compound CCCCC\C=C\C\C=C\C\C=C\C\C=C\CCCC(=O)OC[C@H](COP(O)(=O)OCCN)OC(=O)CCC\C=C\C\C=C\C\C=C\C\C=C\CCCCC JTERLNYVBOZRHI-RIIGGKATSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000000543 intermediate Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- XFDUHJPVQKIXHO-UHFFFAOYSA-N 3-aminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1 XFDUHJPVQKIXHO-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- ZNVDOKOOMPHOSP-UHFFFAOYSA-N 4-amino-n-(4-amino-2-methoxyphenyl)benzamide Chemical compound COC1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 ZNVDOKOOMPHOSP-UHFFFAOYSA-N 0.000 description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241000989747 Maba Species 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- UNIBAJHMJGXVHL-UHFFFAOYSA-N 3-phenylbenzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C=2C=CC=CC=2)=C1C(O)=O UNIBAJHMJGXVHL-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- KHYXYOGWAIYVBD-UHFFFAOYSA-N 4-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N)C=C1 KHYXYOGWAIYVBD-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- -1 diglim Chemical compound 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005172060A JP4804806B2 (ja) | 2005-06-13 | 2005-06-13 | 銅張積層板及びその製造方法 |
| JPJP-P-2005-00172060 | 2005-06-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060129965A KR20060129965A (ko) | 2006-12-18 |
| KR101009825B1 true KR101009825B1 (ko) | 2011-01-19 |
Family
ID=37518512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060052691A Active KR101009825B1 (ko) | 2005-06-13 | 2006-06-12 | 동장적층판 및 그 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4804806B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101009825B1 (enrdf_load_stackoverflow) |
| CN (1) | CN1880061B (enrdf_load_stackoverflow) |
| TW (1) | TW200700221A (enrdf_load_stackoverflow) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009084412A1 (ja) * | 2007-12-27 | 2009-07-09 | Nippon Mining & Metals Co., Ltd. | ２層銅張積層板の製造方法及び２層銅張積層板 |
| KR100958976B1 (ko) * | 2008-02-01 | 2010-05-20 | 엘에스엠트론 주식회사 | 고굴곡성을 갖는 전해 동박 및 그 제조 방법 |
| KR100965327B1 (ko) * | 2008-02-28 | 2010-06-22 | 엘에스엠트론 주식회사 | 진동특성이 개선된 연성 동장적층판 |
| TW201037105A (en) * | 2009-03-23 | 2010-10-16 | Nippon Mining Co | Double layered flexible board, and copper electrolytic liquid for making the same |
| JP2010221586A (ja) * | 2009-03-24 | 2010-10-07 | Asahi Kasei E-Materials Corp | 金属箔ポリイミド積層体 |
| CN102298998A (zh) * | 2010-06-23 | 2011-12-28 | 比亚迪股份有限公司 | 一种绝缘材料及其制备方法 |
| JP6782561B2 (ja) | 2015-07-16 | 2020-11-11 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6006445B1 (ja) * | 2015-07-27 | 2016-10-12 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6058182B1 (ja) | 2015-07-27 | 2017-01-11 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6200042B2 (ja) | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6190500B2 (ja) | 2015-08-06 | 2017-08-30 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6339636B2 (ja) | 2015-08-06 | 2018-06-06 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| CN108133886A (zh) * | 2017-12-11 | 2018-06-08 | 上海申和热磁电子有限公司 | 一种dbc基板背面研磨的方法 |
| KR102288594B1 (ko) | 2021-02-26 | 2021-08-11 | 주식회사 이송이엠씨 | 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법 |
| CN115179638B (zh) * | 2022-06-29 | 2024-02-27 | 厦门爱谱生电子科技有限公司 | 一种柔性覆铜板的制作方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232553A (ja) * | 1993-01-29 | 1994-08-19 | Hitachi Chem Co Ltd | 積層用片面フレキシブル銅張板 |
| JPH09272994A (ja) * | 1996-04-05 | 1997-10-21 | Furukawa Electric Co Ltd:The | ファインパターン用電解銅箔 |
| JP2000212661A (ja) | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP2004017571A (ja) | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | ポリイミド銅張積層板及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2985325B2 (ja) * | 1991-02-18 | 1999-11-29 | 三菱瓦斯化学株式会社 | 薄銅張回路基板の製造法 |
| JP3210796B2 (ja) * | 1993-12-28 | 2001-09-17 | 株式会社日鉱マテリアルズ | 印刷回路用高高温伸び銅箔 |
| JP3271757B2 (ja) * | 1999-03-01 | 2002-04-08 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP3964073B2 (ja) * | 1999-04-27 | 2007-08-22 | 株式会社フジクラ | フレキシブルプリント基板及びその製造方法 |
| JP2003193211A (ja) * | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
| JP4219721B2 (ja) * | 2003-03-31 | 2009-02-04 | 新日鐵化学株式会社 | 積層体の製造方法 |
| JP4325337B2 (ja) * | 2003-09-19 | 2009-09-02 | 日立化成工業株式会社 | 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板 |
-
2005
- 2005-06-13 JP JP2005172060A patent/JP4804806B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-11 TW TW095116743A patent/TW200700221A/zh unknown
- 2006-06-06 CN CN2006100935743A patent/CN1880061B/zh active Active
- 2006-06-12 KR KR1020060052691A patent/KR101009825B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232553A (ja) * | 1993-01-29 | 1994-08-19 | Hitachi Chem Co Ltd | 積層用片面フレキシブル銅張板 |
| JPH09272994A (ja) * | 1996-04-05 | 1997-10-21 | Furukawa Electric Co Ltd:The | ファインパターン用電解銅箔 |
| JP2000212661A (ja) | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP2004017571A (ja) | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | ポリイミド銅張積層板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200700221A (en) | 2007-01-01 |
| KR20060129965A (ko) | 2006-12-18 |
| CN1880061B (zh) | 2011-07-20 |
| CN1880061A (zh) | 2006-12-20 |
| TWI342827B (enrdf_load_stackoverflow) | 2011-06-01 |
| JP4804806B2 (ja) | 2011-11-02 |
| JP2006346874A (ja) | 2006-12-28 |
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