JP4804806B2 - 銅張積層板及びその製造方法 - Google Patents

銅張積層板及びその製造方法 Download PDF

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Publication number
JP4804806B2
JP4804806B2 JP2005172060A JP2005172060A JP4804806B2 JP 4804806 B2 JP4804806 B2 JP 4804806B2 JP 2005172060 A JP2005172060 A JP 2005172060A JP 2005172060 A JP2005172060 A JP 2005172060A JP 4804806 B2 JP4804806 B2 JP 4804806B2
Authority
JP
Japan
Prior art keywords
copper foil
copper
laminate
thickness
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005172060A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006346874A (ja
Inventor
茂顕 田内
浩行 森田
大輔 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP2005172060A priority Critical patent/JP4804806B2/ja
Priority to TW095116743A priority patent/TW200700221A/zh
Priority to CN2006100935743A priority patent/CN1880061B/zh
Priority to KR1020060052691A priority patent/KR101009825B1/ko
Publication of JP2006346874A publication Critical patent/JP2006346874A/ja
Application granted granted Critical
Publication of JP4804806B2 publication Critical patent/JP4804806B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2005172060A 2005-06-13 2005-06-13 銅張積層板及びその製造方法 Expired - Fee Related JP4804806B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005172060A JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法
TW095116743A TW200700221A (en) 2005-06-13 2006-05-11 Copper clad laminated sheet and its manufacturing method
CN2006100935743A CN1880061B (zh) 2005-06-13 2006-06-06 覆铜叠层板及其制造方法
KR1020060052691A KR101009825B1 (ko) 2005-06-13 2006-06-12 동장적층판 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005172060A JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2006346874A JP2006346874A (ja) 2006-12-28
JP4804806B2 true JP4804806B2 (ja) 2011-11-02

Family

ID=37518512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005172060A Expired - Fee Related JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法

Country Status (4)

Country Link
JP (1) JP4804806B2 (enrdf_load_stackoverflow)
KR (1) KR101009825B1 (enrdf_load_stackoverflow)
CN (1) CN1880061B (enrdf_load_stackoverflow)
TW (1) TW200700221A (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009084412A1 (ja) * 2007-12-27 2009-07-09 Nippon Mining & Metals Co., Ltd. ２層銅張積層板の製造方法及び２層銅張積層板
KR100958976B1 (ko) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 고굴곡성을 갖는 전해 동박 및 그 제조 방법
KR100965327B1 (ko) * 2008-02-28 2010-06-22 엘에스엠트론 주식회사 진동특성이 개선된 연성 동장적층판
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP2010221586A (ja) * 2009-03-24 2010-10-07 Asahi Kasei E-Materials Corp 金属箔ポリイミド積層体
CN102298998A (zh) * 2010-06-23 2011-12-28 比亚迪股份有限公司 一种绝缘材料及其制备方法
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) * 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108133886A (zh) * 2017-12-11 2018-06-08 上海申和热磁电子有限公司 一种dbc基板背面研磨的方法
KR102288594B1 (ko) 2021-02-26 2021-08-11 주식회사 이송이엠씨 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985325B2 (ja) * 1991-02-18 1999-11-29 三菱瓦斯化学株式会社 薄銅張回路基板の製造法
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JP3210796B2 (ja) * 1993-12-28 2001-09-17 株式会社日鉱マテリアルズ 印刷回路用高高温伸び銅箔
JPH09272994A (ja) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The ファインパターン用電解銅箔
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3271757B2 (ja) * 1999-03-01 2002-04-08 日本電気株式会社 半導体装置の製造方法
JP3964073B2 (ja) * 1999-04-27 2007-08-22 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2004017571A (ja) 2002-06-19 2004-01-22 Mitsui Chemicals Inc ポリイミド銅張積層板及びその製造方法
JP4219721B2 (ja) * 2003-03-31 2009-02-04 新日鐵化学株式会社 積層体の製造方法
JP4325337B2 (ja) * 2003-09-19 2009-09-02 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板

Also Published As

Publication number Publication date
TW200700221A (en) 2007-01-01
KR20060129965A (ko) 2006-12-18
CN1880061B (zh) 2011-07-20
CN1880061A (zh) 2006-12-20
TWI342827B (enrdf_load_stackoverflow) 2011-06-01
KR101009825B1 (ko) 2011-01-19
JP2006346874A (ja) 2006-12-28

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