KR101005043B1 - 프로파일측정방법 - Google Patents

프로파일측정방법 Download PDF

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Publication number
KR101005043B1
KR101005043B1 KR1020080118622A KR20080118622A KR101005043B1 KR 101005043 B1 KR101005043 B1 KR 101005043B1 KR 1020080118622 A KR1020080118622 A KR 1020080118622A KR 20080118622 A KR20080118622 A KR 20080118622A KR 101005043 B1 KR101005043 B1 KR 101005043B1
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KR
South Korea
Prior art keywords
dresser
polishing pad
polishing
dressing
profile
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KR1020080118622A
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English (en)
Korean (ko)
Other versions
KR20090055494A (ko
Inventor
데츠지 도가와
게이스케 나미키
사토루 야마키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication date
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Publication of KR20090055494A publication Critical patent/KR20090055494A/ko
Application granted granted Critical
Publication of KR101005043B1 publication Critical patent/KR101005043B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020080118622A 2007-11-28 2008-11-27 프로파일측정방법 KR101005043B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007307458 2007-11-28
JPJP-P-2007-307458 2007-11-28
JPJP-P-2008-288107 2008-11-10
JP2008288107A JP4658182B2 (ja) 2007-11-28 2008-11-10 研磨パッドのプロファイル測定方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100093696A Division KR101059935B1 (ko) 2007-11-28 2010-09-28 폴리싱패드의 드레싱방법과 장치, 기판폴리싱장치, 및 기판폴리싱방법

Publications (2)

Publication Number Publication Date
KR20090055494A KR20090055494A (ko) 2009-06-02
KR101005043B1 true KR101005043B1 (ko) 2010-12-30

Family

ID=40918660

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020080118622A KR101005043B1 (ko) 2007-11-28 2008-11-27 프로파일측정방법
KR1020100093696A KR101059935B1 (ko) 2007-11-28 2010-09-28 폴리싱패드의 드레싱방법과 장치, 기판폴리싱장치, 및 기판폴리싱방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020100093696A KR101059935B1 (ko) 2007-11-28 2010-09-28 폴리싱패드의 드레싱방법과 장치, 기판폴리싱장치, 및 기판폴리싱방법

Country Status (3)

Country Link
JP (3) JP4658182B2 (zh)
KR (2) KR101005043B1 (zh)
TW (3) TWI565561B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220091841A (ko) 2020-12-24 2022-07-01 동명대학교산학협력단 스윙 암과 통합된 패드 프로파일 측정 시스템

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5263099B2 (ja) * 2009-09-14 2013-08-14 トヨタ自動車株式会社 研磨ブラシの成形方法及び装置
TWI492288B (zh) * 2010-02-11 2015-07-11 聯華電子股份有限公司 控制晶圓研磨製程之方法
JP5511600B2 (ja) 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
JP6193623B2 (ja) * 2012-06-13 2017-09-06 株式会社荏原製作所 研磨方法及び研磨装置
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
JP5927083B2 (ja) 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP5964262B2 (ja) * 2013-02-25 2016-08-03 株式会社荏原製作所 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
KR101415982B1 (ko) * 2013-03-29 2014-07-08 주식회사 케이씨텍 화학 기계적 연마 시스템의 컨디셔너 및 컨디셔닝 방법
KR101498507B1 (ko) * 2013-06-05 2015-03-04 주식회사 브러쉬텍 반도체 웨이퍼 세척용 브러쉬 에이징 장치
KR101527769B1 (ko) * 2013-10-24 2015-06-11 주식회사 케이씨텍 화학 기계적 연마 시스템의 저압 컨디셔너
JP6263445B2 (ja) * 2014-06-06 2018-01-17 株式会社荏原製作所 研磨装置および研磨方法
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
TWI574778B (zh) * 2015-02-11 2017-03-21 國立勤益科技大學 硏磨拋光機
US9669514B2 (en) 2015-05-29 2017-06-06 Taiwan Semiconductor Manufacturing Co., Ltd System and method for polishing substrate
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
US9835449B2 (en) 2015-08-26 2017-12-05 Industrial Technology Research Institute Surface measuring device and method thereof
JP6649073B2 (ja) * 2015-12-16 2020-02-19 株式会社荏原製作所 基板処理装置およびその品質保証方法
US10365987B2 (en) 2017-03-29 2019-07-30 Google Llc Synchronous hardware event collection
US9875167B1 (en) * 2017-03-29 2018-01-23 Google Inc. Distributed hardware tracing
JP6971664B2 (ja) * 2017-07-05 2021-11-24 株式会社荏原製作所 基板研磨装置及び方法
JP7169769B2 (ja) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 基板裏面研磨部材のドレッシング装置及びドレッシング方法
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
US10792783B2 (en) 2017-11-27 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. System, control method and apparatus for chemical mechanical polishing
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
US20200130136A1 (en) * 2018-10-29 2020-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7209344B2 (ja) * 2019-02-01 2023-01-20 スピードファム株式会社 両面研磨機用のドレッシング装置
JP7378944B2 (ja) * 2019-03-12 2023-11-14 株式会社東京精密 研削装置
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN112476243A (zh) * 2020-11-26 2021-03-12 华虹半导体(无锡)有限公司 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置
CN115972061A (zh) * 2022-12-15 2023-04-18 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093296A (ja) * 2004-09-22 2006-04-06 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2896657B2 (ja) * 1996-06-28 1999-05-31 旭ダイヤモンド工業株式会社 ドレッサ及びその製造方法
JPH1044024A (ja) * 1996-07-26 1998-02-17 Nippon Steel Corp 研磨布の目立て装置
JPH11170155A (ja) * 1997-12-09 1999-06-29 Hitachi Ltd 研磨装置
JPH11254294A (ja) * 1998-03-13 1999-09-21 Speedfam Co Ltd 定盤修正用ドレッサーの洗浄装置
JPH11277405A (ja) * 1998-03-31 1999-10-12 Nkk Corp Ｃｍｐ装置の研磨パッド調整装置
JP4440237B2 (ja) * 1999-05-17 2010-03-24 株式会社荏原製作所 ドレッシング装置
JP2000343407A (ja) * 1999-06-08 2000-12-12 Ebara Corp ドレッシング装置
JP2001079752A (ja) * 1999-09-08 2001-03-27 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
JP2001088008A (ja) * 1999-09-16 2001-04-03 Toshiba Corp 研磨方法とその装置
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP4349752B2 (ja) * 2000-10-24 2009-10-21 株式会社荏原製作所 ポリッシング方法
KR20020044737A (ko) * 2000-12-06 2002-06-19 윤종용 컨디셔닝 클리너를 포함하는 씨엠피 설비
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
JP3922887B2 (ja) * 2001-03-16 2007-05-30 株式会社荏原製作所 ドレッサ及びポリッシング装置
JP4259048B2 (ja) * 2002-06-28 2009-04-30 株式会社ニコン コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法
JP2004047876A (ja) * 2002-07-15 2004-02-12 Tokyo Seimitsu Co Ltd 研磨装置及び研磨方法
JP4817687B2 (ja) * 2005-03-18 2011-11-16 株式会社荏原製作所 研磨装置
CN101934491B (zh) * 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093296A (ja) * 2004-09-22 2006-04-06 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220091841A (ko) 2020-12-24 2022-07-01 동명대학교산학협력단 스윙 암과 통합된 패드 프로파일 측정 시스템

Also Published As

Publication number Publication date
KR101059935B1 (ko) 2011-08-26
JP2010162688A (ja) 2010-07-29
TWI458589B (zh) 2014-11-01
JP4658182B2 (ja) 2011-03-23
JP5325831B2 (ja) 2013-10-23
KR20090055494A (ko) 2009-06-02
KR20100120625A (ko) 2010-11-16
JP2013163262A (ja) 2013-08-22
TWI572447B (zh) 2017-03-01
TWI565561B (zh) 2017-01-11
TW201700216A (zh) 2017-01-01
TW201438845A (zh) 2014-10-16
JP2009148877A (ja) 2009-07-09
JP5530002B2 (ja) 2014-06-25
TW200936316A (en) 2009-09-01

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