KR100975088B1 - 이중 단계 웨이퍼 적용 언더필 - Google Patents

이중 단계 웨이퍼 적용 언더필 Download PDF

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Publication number
KR100975088B1
KR100975088B1 KR1020067009637A KR20067009637A KR100975088B1 KR 100975088 B1 KR100975088 B1 KR 100975088B1 KR 1020067009637 A KR1020067009637 A KR 1020067009637A KR 20067009637 A KR20067009637 A KR 20067009637A KR 100975088 B1 KR100975088 B1 KR 100975088B1
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South Korea
Prior art keywords
underfill
acrylate
unsaturated
wafer
methacrylate
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KR1020067009637A
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English (en)
Korean (ko)
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KR20070000399A (ko
KR20060136369A (ko
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도리안 에이. 카네라스
카이란 고쉬
아만다 더블유. 키레스
에드워드 이. 코렐
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로드코포레이션
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Publication of KR20070000399A publication Critical patent/KR20070000399A/ko
Publication of KR20060136369A publication Critical patent/KR20060136369A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
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    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
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    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020067009637A 2003-11-21 2004-06-02 이중 단계 웨이퍼 적용 언더필 KR100975088B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52400703P 2003-11-21 2003-11-21
US60/524,007 2003-11-21

Publications (3)

Publication Number Publication Date
KR20070000399A KR20070000399A (ko) 2007-01-02
KR20060136369A KR20060136369A (ko) 2007-01-02
KR100975088B1 true KR100975088B1 (ko) 2010-08-11

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Country Link
EP (1) EP1694769A4 (fr)
JP (1) JP2007515785A (fr)
KR (1) KR100975088B1 (fr)
CN (1) CN1946795B (fr)
WO (1) WO2005056675A1 (fr)

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US7326369B2 (en) 2005-03-07 2008-02-05 National Starch And Chemical Investment Holding Corporation Low stress conductive adhesive
JP4699189B2 (ja) * 2005-12-01 2011-06-08 日東電工株式会社 半導体装置の製造方法及び電子部品
JP4846406B2 (ja) * 2006-03-28 2011-12-28 リンテック株式会社 チップ用保護膜形成用シート
DE102006042032A1 (de) * 2006-09-07 2008-03-27 Infineon Technologies Ag Halbleiterbauelement
WO2009079122A1 (fr) * 2007-12-18 2009-06-25 3M Innovative Properties Company Procédé de revêtement de fils fins et composition durcissable à cet effet
KR20110095384A (ko) * 2008-11-21 2011-08-24 헨켈 코포레이션 상이 분리된 경화성 조성물
CN101768316B (zh) * 2010-03-04 2011-09-14 陕西科技大学 一种聚苯胺/p(mma-ba-hea)导电复合材料的制备方法
WO2011114935A1 (fr) * 2010-03-18 2011-09-22 新日鐵化学株式会社 Composition de résine époxyde et substance durcie
CN102408679B (zh) * 2011-08-29 2012-12-26 天威新能源控股有限公司 一种环氧树脂复合材料
US20150147533A1 (en) * 2012-05-25 2015-05-28 Soken Chemical & Engineering Co., Ltd. Photocurable Resin Composition for Imprinting, Production Method and Structure Thereof
WO2014113931A1 (fr) * 2013-01-23 2014-07-31 Henkel IP & Holding GmbH Composition de matière de remplissage entre composants empilés et procédé d'encapsulation faisant intervenir celle-ci
JP6492628B2 (ja) * 2014-12-22 2019-04-03 日立化成株式会社 アンダーフィル材、電子部品装置の製造方法及び電子部品装置
JP6879690B2 (ja) * 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
CN106995584B (zh) * 2016-10-27 2019-08-23 武汉市三选科技有限公司 电容膜组成物和电容膜及该电容膜之制备和封装方法
JP2020105253A (ja) * 2018-12-26 2020-07-09 スリーエム イノベイティブ プロパティズ カンパニー シール材形成用組成物、シール材、シール材の熱硬化物及び接着構造体の製造方法
CN111635493B (zh) * 2019-06-26 2022-09-20 苏州太湖电工新材料股份有限公司 一种高导热的改性环氧树脂的制备方法
IT202000023443A1 (it) 2020-10-05 2022-04-05 Prolab Mat S R L Rete sequenziale polimerica compenetrante o semi-compenetrante e processo per ottenerla

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US6287745B1 (en) 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
US20030141592A1 (en) 2001-12-14 2003-07-31 Bodan Ma Dual cure B-stageable underfill for wafer level

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