KR100932815B1 - 저온 폴리-실리콘 박막 트랜지스터를 위한 다층 고품질게이트 유전체 - Google Patents
저온 폴리-실리콘 박막 트랜지스터를 위한 다층 고품질게이트 유전체 Download PDFInfo
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- KR100932815B1 KR100932815B1 KR1020077012560A KR20077012560A KR100932815B1 KR 100932815 B1 KR100932815 B1 KR 100932815B1 KR 1020077012560 A KR1020077012560 A KR 1020077012560A KR 20077012560 A KR20077012560 A KR 20077012560A KR 100932815 B1 KR100932815 B1 KR 100932815B1
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- plasma processing
- dielectric layer
- chamber
- plasma
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- Expired - Fee Related
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0209—Pretreatment of the material to be coated by heating
- C23C16/0218—Pretreatment of the material to be coated by heating in a reactive atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/990,185 US20060105114A1 (en) | 2004-11-16 | 2004-11-16 | Multi-layer high quality gate dielectric for low-temperature poly-silicon TFTs |
| US10/990,185 | 2004-11-16 | ||
| PCT/US2005/041231 WO2006073568A2 (en) | 2004-11-16 | 2005-11-15 | MULTI-LAYER HIGH QUALITY GATE DIELECTRIC FOR LOW-TEMPERATURE POLY-SILICON TFTs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070085708A KR20070085708A (ko) | 2007-08-27 |
| KR100932815B1 true KR100932815B1 (ko) | 2009-12-22 |
Family
ID=36386668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077012560A Expired - Fee Related KR100932815B1 (ko) | 2004-11-16 | 2005-11-15 | 저온 폴리-실리콘 박막 트랜지스터를 위한 다층 고품질게이트 유전체 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060105114A1 (enExample) |
| JP (2) | JP5419354B2 (enExample) |
| KR (1) | KR100932815B1 (enExample) |
| CN (1) | CN101310036B (enExample) |
| TW (1) | TWI301646B (enExample) |
| WO (1) | WO2006073568A2 (enExample) |
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| US7013834B2 (en) * | 2002-04-19 | 2006-03-21 | Nordson Corporation | Plasma treatment system |
| US7273638B2 (en) * | 2003-01-07 | 2007-09-25 | International Business Machines Corp. | High density plasma oxidation |
| US20060024451A1 (en) * | 2004-07-30 | 2006-02-02 | Applied Materials Inc. | Enhanced magnetic shielding for plasma-based semiconductor processing tool |
| US8318554B2 (en) * | 2005-04-28 | 2012-11-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming gate insulating film for thin film transistors using plasma oxidation |
| US20070084564A1 (en) * | 2005-10-13 | 2007-04-19 | Varian Semiconductor Equipment Associates, Inc. | Conformal doping apparatus and method |
| KR100684910B1 (ko) * | 2006-02-02 | 2007-02-22 | 삼성전자주식회사 | 플라즈마 처리 장치 및 그의 클리닝 방법 |
| US20080118663A1 (en) * | 2006-10-12 | 2008-05-22 | Applied Materials, Inc. | Contamination reducing liner for inductively coupled chamber |
| WO2008106542A1 (en) * | 2007-02-28 | 2008-09-04 | Applied Materials, Inc. | Apparatus and method for deposition over large area substrates |
| KR101358779B1 (ko) | 2007-07-19 | 2014-02-04 | 주식회사 뉴파워 프라즈마 | 멀티 코어 플라즈마 발생 플레이트를 구비한 플라즈마반응기 |
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| KR101469026B1 (ko) * | 2007-12-11 | 2014-12-05 | 삼성디스플레이 주식회사 | 표시 장치 및 그 표시판의 제조 방법 |
| KR101166988B1 (ko) * | 2007-12-25 | 2012-07-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마 챔버의 전극에 대한 비대칭 rf 구동 |
| CN101469414B (zh) * | 2007-12-26 | 2010-09-29 | 中国科学院微电子研究所 | 平板式等离子体增强化学汽相淀积设备的反应室结构 |
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| KR20130089102A (ko) * | 2012-02-01 | 2013-08-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
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| KR101813497B1 (ko) * | 2016-06-24 | 2018-01-02 | (주)제이하라 | 플라즈마 발생장치 |
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| KR102126208B1 (ko) * | 2019-04-05 | 2020-06-24 | 김광석 | 포토마스크 세정조건에 따라 마스크 고정예열부와 포토마스크가 동시에 승하강되는 포토마스크 표면 이물질 세정용 플라즈마 장치 |
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- 2005-11-15 KR KR1020077012560A patent/KR100932815B1/ko not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2006073568A3 (en) | 2007-12-27 |
| WO2006073568A2 (en) | 2006-07-13 |
| US20060105114A1 (en) | 2006-05-18 |
| TWI301646B (en) | 2008-10-01 |
| CN101310036A (zh) | 2008-11-19 |
| JP2012248855A (ja) | 2012-12-13 |
| KR20070085708A (ko) | 2007-08-27 |
| JP2008521218A (ja) | 2008-06-19 |
| JP5419354B2 (ja) | 2014-02-19 |
| CN101310036B (zh) | 2014-08-06 |
| TW200625448A (en) | 2006-07-16 |
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