CN101310036B - 低温聚硅tft用的多层高质量栅介电层 - Google Patents
低温聚硅tft用的多层高质量栅介电层 Download PDFInfo
- Publication number
- CN101310036B CN101310036B CN200580039023.2A CN200580039023A CN101310036B CN 101310036 B CN101310036 B CN 101310036B CN 200580039023 A CN200580039023 A CN 200580039023A CN 101310036 B CN101310036 B CN 101310036B
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- China
- Prior art keywords
- plasma processing
- substrate
- plasma
- transmitting component
- chamber
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- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0209—Pretreatment of the material to be coated by heating
- C23C16/0218—Pretreatment of the material to be coated by heating in a reactive atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/990,185 US20060105114A1 (en) | 2004-11-16 | 2004-11-16 | Multi-layer high quality gate dielectric for low-temperature poly-silicon TFTs |
| US10/990,185 | 2004-11-16 | ||
| PCT/US2005/041231 WO2006073568A2 (en) | 2004-11-16 | 2005-11-15 | MULTI-LAYER HIGH QUALITY GATE DIELECTRIC FOR LOW-TEMPERATURE POLY-SILICON TFTs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101310036A CN101310036A (zh) | 2008-11-19 |
| CN101310036B true CN101310036B (zh) | 2014-08-06 |
Family
ID=36386668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200580039023.2A Expired - Fee Related CN101310036B (zh) | 2004-11-16 | 2005-11-15 | 低温聚硅tft用的多层高质量栅介电层 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060105114A1 (enExample) |
| JP (2) | JP5419354B2 (enExample) |
| KR (1) | KR100932815B1 (enExample) |
| CN (1) | CN101310036B (enExample) |
| TW (1) | TWI301646B (enExample) |
| WO (1) | WO2006073568A2 (enExample) |
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| US7013834B2 (en) * | 2002-04-19 | 2006-03-21 | Nordson Corporation | Plasma treatment system |
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| US20060024451A1 (en) * | 2004-07-30 | 2006-02-02 | Applied Materials Inc. | Enhanced magnetic shielding for plasma-based semiconductor processing tool |
| US8318554B2 (en) * | 2005-04-28 | 2012-11-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming gate insulating film for thin film transistors using plasma oxidation |
| US20070084564A1 (en) * | 2005-10-13 | 2007-04-19 | Varian Semiconductor Equipment Associates, Inc. | Conformal doping apparatus and method |
| KR100684910B1 (ko) * | 2006-02-02 | 2007-02-22 | 삼성전자주식회사 | 플라즈마 처리 장치 및 그의 클리닝 방법 |
| US20080118663A1 (en) * | 2006-10-12 | 2008-05-22 | Applied Materials, Inc. | Contamination reducing liner for inductively coupled chamber |
| WO2008106542A1 (en) * | 2007-02-28 | 2008-09-04 | Applied Materials, Inc. | Apparatus and method for deposition over large area substrates |
| KR101358779B1 (ko) | 2007-07-19 | 2014-02-04 | 주식회사 뉴파워 프라즈마 | 멀티 코어 플라즈마 발생 플레이트를 구비한 플라즈마반응기 |
| US8008166B2 (en) * | 2007-07-26 | 2011-08-30 | Applied Materials, Inc. | Method and apparatus for cleaning a substrate surface |
| US7645709B2 (en) * | 2007-07-30 | 2010-01-12 | Applied Materials, Inc. | Methods for low temperature oxidation of a semiconductor device |
| KR101469026B1 (ko) * | 2007-12-11 | 2014-12-05 | 삼성디스플레이 주식회사 | 표시 장치 및 그 표시판의 제조 방법 |
| KR101166988B1 (ko) * | 2007-12-25 | 2012-07-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마 챔버의 전극에 대한 비대칭 rf 구동 |
| CN101469414B (zh) * | 2007-12-26 | 2010-09-29 | 中国科学院微电子研究所 | 平板式等离子体增强化学汽相淀积设备的反应室结构 |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2006073568A3 (en) | 2007-12-27 |
| WO2006073568A2 (en) | 2006-07-13 |
| US20060105114A1 (en) | 2006-05-18 |
| TWI301646B (en) | 2008-10-01 |
| CN101310036A (zh) | 2008-11-19 |
| JP2012248855A (ja) | 2012-12-13 |
| KR20070085708A (ko) | 2007-08-27 |
| KR100932815B1 (ko) | 2009-12-22 |
| JP2008521218A (ja) | 2008-06-19 |
| JP5419354B2 (ja) | 2014-02-19 |
| TW200625448A (en) | 2006-07-16 |
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