KR100884498B1 - 적층형 전자부품 및 적층 세라믹 콘덴서 - Google Patents

적층형 전자부품 및 적층 세라믹 콘덴서 Download PDF

Info

Publication number
KR100884498B1
KR100884498B1 KR1020060048641A KR20060048641A KR100884498B1 KR 100884498 B1 KR100884498 B1 KR 100884498B1 KR 1020060048641 A KR1020060048641 A KR 1020060048641A KR 20060048641 A KR20060048641 A KR 20060048641A KR 100884498 B1 KR100884498 B1 KR 100884498B1
Authority
KR
South Korea
Prior art keywords
component
ceramic
ceramic layer
layer
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020060048641A
Other languages
English (en)
Korean (ko)
Other versions
KR20060125536A (ko
Inventor
아키노리 이와사키
다츠야 고지마
도루 도노가이
소고 무로사와
라이타로 마사오카
쿄타로 아베
아키라 야마구치
Original Assignee
티디케이가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티디케이가부시기가이샤 filed Critical 티디케이가부시기가이샤
Publication of KR20060125536A publication Critical patent/KR20060125536A/ko
Application granted granted Critical
Publication of KR100884498B1 publication Critical patent/KR100884498B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020060048641A 2005-05-31 2006-05-30 적층형 전자부품 및 적층 세라믹 콘덴서 Active KR100884498B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005160136A JP4293553B2 (ja) 2005-05-31 2005-05-31 積層型電子部品及び積層セラミックコンデンサ
JPJP-P-2005-00160136 2005-05-31

Publications (2)

Publication Number Publication Date
KR20060125536A KR20060125536A (ko) 2006-12-06
KR100884498B1 true KR100884498B1 (ko) 2009-02-18

Family

ID=37484280

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060048641A Active KR100884498B1 (ko) 2005-05-31 2006-05-30 적층형 전자부품 및 적층 세라믹 콘덴서

Country Status (5)

Country Link
US (1) US20060285274A1 (https=)
JP (1) JP4293553B2 (https=)
KR (1) KR100884498B1 (https=)
CN (1) CN100570772C (https=)
TW (1) TW200705483A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5429067B2 (ja) * 2010-06-17 2014-02-26 株式会社村田製作所 セラミック電子部品およびその製造方法
CN103296344B (zh) * 2012-03-01 2017-11-10 深圳光启高等理工研究院 一种介质滤波器的介质及其连接方法
KR101452079B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
KR101462746B1 (ko) * 2013-01-02 2014-11-17 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR101462767B1 (ko) * 2013-03-14 2014-11-20 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP7197985B2 (ja) 2018-02-21 2022-12-28 太陽誘電株式会社 セラミックコンデンサおよびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835656A (en) 1987-04-04 1989-05-30 Mitsubishi Mining And Cement Co., Ltd. Multi-layered ceramic capacitor
KR20010100835A (ko) * 2000-03-30 2001-11-14 가와다 미쓰구 적층 세라믹 콘덴서 및 그 제조 방법
JP2003026472A (ja) 2001-07-13 2003-01-29 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法、積層セラミック電子部品および積層セラミック電子部品製造用の生の複合積層体
KR20040076596A (ko) * 2003-02-25 2004-09-01 쿄세라 코포레이션 적층 세라믹 콘덴서 및 그 제조방법
US6846693B2 (en) 1999-10-19 2005-01-25 Murata Manufacturing Co., Ltd. Chip-type composite electronic component and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3417911B2 (ja) * 2000-08-21 2003-06-16 ティーディーケイ株式会社 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法
GB2376207B (en) * 2001-05-25 2005-03-30 Kyocera Corp Method of producing ceramic laminates,laminated electronic parts and method of producing the same
US6639221B2 (en) * 2002-01-18 2003-10-28 Nikon Corporation Annular illumination method for charged particle projection optics
JP3988533B2 (ja) * 2002-05-23 2007-10-10 株式会社村田製作所 ガラスセラミック組成物、ガラスセラミック、およびセラミック多層基板
US6829134B2 (en) * 2002-07-09 2004-12-07 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for manufacturing the same
JP3908715B2 (ja) * 2003-10-24 2007-04-25 Ｔｄｋ株式会社 積層セラミックコンデンサ
JP4182007B2 (ja) * 2004-01-30 2008-11-19 Ｔｄｋ株式会社 積層セラミックコンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835656A (en) 1987-04-04 1989-05-30 Mitsubishi Mining And Cement Co., Ltd. Multi-layered ceramic capacitor
US6846693B2 (en) 1999-10-19 2005-01-25 Murata Manufacturing Co., Ltd. Chip-type composite electronic component and manufacturing method thereof
KR20010100835A (ko) * 2000-03-30 2001-11-14 가와다 미쓰구 적층 세라믹 콘덴서 및 그 제조 방법
JP2003026472A (ja) 2001-07-13 2003-01-29 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法、積層セラミック電子部品および積層セラミック電子部品製造用の生の複合積層体
KR20040076596A (ko) * 2003-02-25 2004-09-01 쿄세라 코포레이션 적층 세라믹 콘덴서 및 그 제조방법

Also Published As

Publication number Publication date
CN100570772C (zh) 2009-12-16
TWI333663B (https=) 2010-11-21
US20060285274A1 (en) 2006-12-21
KR20060125536A (ko) 2006-12-06
JP4293553B2 (ja) 2009-07-08
JP2006339285A (ja) 2006-12-14
CN1873863A (zh) 2006-12-06
TW200705483A (en) 2007-02-01

Similar Documents

Publication Publication Date Title
US10622157B2 (en) Multilayer ceramic structure
KR101496814B1 (ko) 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터의 실장 기판
KR101845701B1 (ko) 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조방법
KR101523630B1 (ko) 적층형 세라믹 전자부품
KR101070151B1 (ko) 적층 세라믹 커패시터
KR102004773B1 (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장 기판
KR20190011219A (ko) 적층 세라믹 콘덴서
KR20120133716A (ko) 적층 세라믹 커패시터
KR20120133717A (ko) 적층 세라믹 커패시터
KR20120133696A (ko) 적층 세라믹 전자부품
JP6980873B2 (ja) 積層セラミックコンデンサ
JP2020053577A (ja) 電子部品
KR101719838B1 (ko) 도전성 수지 조성물 및 이를 포함하는 적층 세라믹 전자 부품
KR101434103B1 (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장 기판
KR20170077542A (ko) 적층 세라믹 전자부품 및 이의 제조방법
KR20190116146A (ko) 적층 세라믹 전자부품 및 그 제조방법
KR102737550B1 (ko) 적층형 커패시터 및 그 실장 기판
KR20170112381A (ko) 세라믹 조성물 및 이를 포함하는 적층형 커패시터
KR20140024584A (ko) 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR20190121138A (ko) 적층 세라믹 전자부품의 제조방법
KR100884498B1 (ko) 적층형 전자부품 및 적층 세라믹 콘덴서
JP7209072B2 (ja) 積層セラミックコンデンサ
KR101539852B1 (ko) 적층 세라믹 전자부품
KR20150012075A (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장 기판
JP4335178B2 (ja) 積層型電子部品及び積層セラミックコンデンサ

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20130118

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140117

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20150119

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20160119

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20170119

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20180202

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20190130

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20200205

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 18

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 18