KR100866440B1 - 동도금 회로층이 부착된 동 클래드적층판 및 그 동도금회로층이 부착된 동 클래드적층판을 사용한프린트배선판의 제조방법 - Google Patents
동도금 회로층이 부착된 동 클래드적층판 및 그 동도금회로층이 부착된 동 클래드적층판을 사용한프린트배선판의 제조방법 Download PDFInfo
- Publication number
- KR100866440B1 KR100866440B1 KR1020037001479A KR20037001479A KR100866440B1 KR 100866440 B1 KR100866440 B1 KR 100866440B1 KR 1020037001479 A KR1020037001479 A KR 1020037001479A KR 20037001479 A KR20037001479 A KR 20037001479A KR 100866440 B1 KR100866440 B1 KR 100866440B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- circuit layer
- layer
- clad laminated
- copper plating
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/24983—Hardness
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (3)
- 세미 어디티브(semi-additive)법으로 프린트배선판을 제조하기 위한 동도금 회로층을 구비한 동도금 회로층이 부착된 동 클래드적층판에 있어서,특정한 에칭액을 사용한 경우에, 바깥층 동박층을 구성하는 동의 용해속도(Vsc)가 상기 동도금 회로층을 구성하는 석출동의 용해속도(Vsp)와 같거나 그것을 초과하는 관계를 만족하는 동도금 회로층과 바깥층 동박층을 구비하는 것을 특징으로 하는 동도금 회로층이 부착된 동 클래드적층판.
- 세미 어디티브법으로 프린트배선판을 제조하기 위한 동도금 회로층을 구비한 동도금 회로층이 부착된 동 클래드적층판에 있어서,바깥층 동박층을 구성하는 동의 비커스 경도(Hvc)가 상기 동도금 회로층을 구성하는 석출동의 비커스 경도(Hvp)와 같거나 그것보다 낮은 관계를 만족하는 동도금 회로층과 바깥층 동박층을 구비하는 것을 특징으로 하는 동도금 회로층이 부착된 동 클래드적층판.
- 제1항 또는 제2항에 기재된 동도금 회로층이 부착된 동 클래드적층판을 사용하여 세미 어디티브법으로 프린트배선판을 제조하는 방법에 있어서,동도금 회로층이 표면에 형성되어 있지 않아, 노출된 상태의 바깥층 동박층을 에칭 제거하기 위한 플러시에칭에 사용하는 에칭액으로, 염화동계, 염화철계, 황산-과산화수소수계 중 어느 1종의 동에칭액을 사용하는 것을 특징으로 하는 프린트배선판의 제조방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00163743 | 2001-05-31 | ||
JP2001163743A JP4683769B2 (ja) | 2001-05-31 | 2001-05-31 | 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法 |
PCT/JP2002/005255 WO2002098194A1 (en) | 2001-05-31 | 2002-05-30 | Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030017662A KR20030017662A (ko) | 2003-03-03 |
KR100866440B1 true KR100866440B1 (ko) | 2008-10-31 |
Family
ID=19006653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037001479A KR100866440B1 (ko) | 2001-05-31 | 2002-05-30 | 동도금 회로층이 부착된 동 클래드적층판 및 그 동도금회로층이 부착된 동 클래드적층판을 사용한프린트배선판의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6652993B2 (ko) |
EP (2) | EP1392092A4 (ko) |
JP (1) | JP4683769B2 (ko) |
KR (1) | KR100866440B1 (ko) |
CN (1) | CN1222203C (ko) |
TW (1) | TW550982B (ko) |
WO (1) | WO2002098194A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007081214A (ja) * | 2005-09-15 | 2007-03-29 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
JP2007095910A (ja) * | 2005-09-28 | 2007-04-12 | Elna Co Ltd | 配線基板の製造方法 |
KR100685177B1 (ko) * | 2006-03-10 | 2007-02-22 | 삼성전기주식회사 | 보드 온 칩 패키지 및 그 제조 방법 |
JP2012501084A (ja) * | 2008-08-27 | 2012-01-12 | エーエムオー ゲーエムベーハー | 改良型ナノインプリント方法 |
CN101977482B (zh) * | 2010-11-09 | 2012-03-28 | 深圳崇达多层线路板有限公司 | 一种高纵横比的pcb产品外层线路蚀刻方法 |
EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
EP2594662B1 (en) * | 2011-11-21 | 2014-04-09 | Atotech Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
CN103209547B (zh) * | 2012-01-17 | 2015-11-25 | 昆山华扬电子有限公司 | 加成法凸台印制板制作工艺 |
US20140123487A1 (en) * | 2012-11-08 | 2014-05-08 | Boardtek Electronics Corporation | Printed circuit board manufacturing method |
JP2015134953A (ja) | 2014-01-17 | 2015-07-27 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
CN109429434A (zh) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
CN114786365A (zh) * | 2022-04-14 | 2022-07-22 | 扬州华盟电子有限公司 | 一种无线充电用柔性线路板及其制作方法与应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0099631A2 (en) * | 1982-06-23 | 1984-02-01 | Mobil Oil Corporation | Alkyl sulfonates of polyvinyl alcohol as viscosifiers in saline solutions |
US5049244A (en) * | 1989-01-20 | 1991-09-17 | Casio Computer Co., Ltd. | Method of manufacturing double-sided wiring substrate |
JPH07329246A (ja) * | 1994-06-08 | 1995-12-19 | Hitachi Chem Co Ltd | 金属張り積層板及びその製造法 |
US5733468A (en) * | 1996-08-27 | 1998-03-31 | Conway, Jr.; John W. | Pattern plating method for fabricating printed circuit boards |
JPH11302809A (ja) | 1998-04-16 | 1999-11-02 | Mitsui Chem Inc | 銅薄膜基板及びプリント配線板の製造法 |
JP2001111201A (ja) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 配線板の製造方法およびそれを用いて製造された配線板 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4383003A (en) * | 1980-09-22 | 1983-05-10 | General Electric Company | Transfer lamination of copper thin sheets and films, method and product |
US4806200A (en) * | 1986-06-18 | 1989-02-21 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
GB2259812B (en) * | 1991-09-06 | 1996-04-24 | Toa Gosei Chem Ind | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
US5294291A (en) * | 1991-09-20 | 1994-03-15 | Hitachi, Ltd. | Process for the formation of a conductive circuit pattern |
JPH05175640A (ja) * | 1991-12-26 | 1993-07-13 | Hitachi Ltd | プリント基板製造方法 |
US5262041A (en) * | 1992-12-11 | 1993-11-16 | Shipley Company Inc. | Additive plating process |
JP3184485B2 (ja) * | 1997-11-06 | 2001-07-09 | 三井金属鉱業株式会社 | 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板 |
SG101924A1 (en) * | 1998-10-19 | 2004-02-27 | Mitsui Mining & Smelting Co | Composite material used in making printed wiring boards |
US6212769B1 (en) * | 1999-06-29 | 2001-04-10 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
-
2001
- 2001-05-31 JP JP2001163743A patent/JP4683769B2/ja not_active Expired - Lifetime
-
2002
- 2002-04-25 US US10/131,222 patent/US6652993B2/en not_active Expired - Lifetime
- 2002-04-30 TW TW091109036A patent/TW550982B/zh not_active IP Right Cessation
- 2002-05-30 WO PCT/JP2002/005255 patent/WO2002098194A1/ja not_active Application Discontinuation
- 2002-05-30 EP EP02733250A patent/EP1392092A4/en not_active Ceased
- 2002-05-30 KR KR1020037001479A patent/KR100866440B1/ko active IP Right Grant
- 2002-05-30 EP EP11180970A patent/EP2398304A3/en not_active Withdrawn
- 2002-05-30 CN CNB028023013A patent/CN1222203C/zh not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0099631A2 (en) * | 1982-06-23 | 1984-02-01 | Mobil Oil Corporation | Alkyl sulfonates of polyvinyl alcohol as viscosifiers in saline solutions |
US5049244A (en) * | 1989-01-20 | 1991-09-17 | Casio Computer Co., Ltd. | Method of manufacturing double-sided wiring substrate |
JPH07329246A (ja) * | 1994-06-08 | 1995-12-19 | Hitachi Chem Co Ltd | 金属張り積層板及びその製造法 |
US5733468A (en) * | 1996-08-27 | 1998-03-31 | Conway, Jr.; John W. | Pattern plating method for fabricating printed circuit boards |
JPH11302809A (ja) | 1998-04-16 | 1999-11-02 | Mitsui Chem Inc | 銅薄膜基板及びプリント配線板の製造法 |
JP2001111201A (ja) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 配線板の製造方法およびそれを用いて製造された配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN1222203C (zh) | 2005-10-05 |
US20020182434A1 (en) | 2002-12-05 |
CN1465216A (zh) | 2003-12-31 |
KR20030017662A (ko) | 2003-03-03 |
EP2398304A3 (en) | 2012-10-10 |
WO2002098194A1 (en) | 2002-12-05 |
JP2002359454A (ja) | 2002-12-13 |
JP4683769B2 (ja) | 2011-05-18 |
TW550982B (en) | 2003-09-01 |
EP1392092A4 (en) | 2007-05-02 |
EP1392092A1 (en) | 2004-02-25 |
US6652993B2 (en) | 2003-11-25 |
EP2398304A2 (en) | 2011-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100866440B1 (ko) | 동도금 회로층이 부착된 동 클래드적층판 및 그 동도금회로층이 부착된 동 클래드적층판을 사용한프린트배선판의 제조방법 | |
US8143533B2 (en) | Method for forming resist pattern, method for producing circuit board, and circuit board | |
US10104771B1 (en) | Method for making a circuit board | |
JP5097763B2 (ja) | プリント基板 | |
CN104797085A (zh) | 电路板埋铜块盲槽制作方法 | |
CN104780710A (zh) | 印制线路板及其制作方法 | |
JP2005290519A (ja) | 銅箔及びその製造方法 | |
KR100899588B1 (ko) | 인쇄 회로 기판 제조에서 옥사이드 공정을 대체하고 미세라인을 제조하기 위해 구리 포일을 금속 처리하는 인쇄회로 기판 제조 방법 | |
US8074352B2 (en) | Method of manufacturing printed circuit board | |
CN113973440B (zh) | 一种线路板绝缘层处理工艺 | |
JP4730222B2 (ja) | 配線基板の製造方法 | |
JP2009041112A (ja) | 銅のエッチング液およびそれを用いたプリント配線板の製造方法 | |
JP2007111942A (ja) | メタルマスク及びその製造方法 | |
JPH0243356B2 (ko) | ||
JP2008258482A (ja) | プリント配線基板の製造方法 | |
CN116033663B (zh) | 精细柔性线路板及其线路蚀刻补偿方法 | |
GB2087157A (en) | Solder plating printed circuit boards | |
KR101041130B1 (ko) | 니켈 도금을 이용한 인쇄회로기판 제조방법 | |
TWI727715B (zh) | 印刷配線板的製造方法 | |
JP2004218033A (ja) | エッチング製品及びエッチング方法 | |
CN108243571A (zh) | 柔性电路板的制造方法 | |
JP3951938B2 (ja) | エッチング方法とそれを用いたプリント配線板の製造方法 | |
JP2004204251A (ja) | 金属エッチング製品及びその製造方法 | |
JP2005305725A (ja) | メタルマスク、及びその製造方法 | |
JP2007189114A (ja) | 半導体実装基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121002 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20131001 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20141007 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20151001 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20181004 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20191002 Year of fee payment: 12 |