CN1465216A - 附有镀铜电路层的覆铜层压板及使用该附有镀铜电路层的覆铜层压板制造印刷电路板的方法 - Google Patents
附有镀铜电路层的覆铜层压板及使用该附有镀铜电路层的覆铜层压板制造印刷电路板的方法 Download PDFInfo
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Abstract
本发明的目的是提供一种附有镀铜电路层的覆铜层压板及印刷电路板的制造方法。使用该覆铜层压板制造含有微细电路的印刷电路板时,其电路形状的纵横比可比迄今为止的形状更优良。一种附有镀铜电路层的覆铜层压板,它具有用于通过半添加法制造印刷电路板的镀铜电路层(6),其特征在于,它具有满足下述条件镀铜电路层(6)和外层铜箔层(3),在使用特定的浸蚀液的情况下,上述构成镀铜电路层(6)的析出铜的溶解速度(Vsp)与上述构成外层铜箔层(3)的铜的溶解速度(Vsc)之比Rv值=(Vsc/Vsp)为1.0以上,使用具有该特征的附有镀铜电路层的覆铜层压板制造印刷电路板。
Description
技术领域
本发明涉及附有镀铜电路层的覆铜层压板及使用该附有镀铜电路层的覆铜层压板制造印刷电路板的方法。
背景技术
制造包含有微细电路的印刷电路板时,要求形成的电路的纵横比要良好。即,从电路的截面观察时其形状一般为所说的梯形,与电路的下端部相比,上端部的宽度变窄,则纵横比变差。这样的上端部的宽度变窄,则表示部件在实际安装时部件实际安装面积变窄,实际安装工作的困难上升。
因此,作为制得包含有纵横比优良的微细电路的印刷电路板的方法,利用了半添加法进行印刷电路板的制造。
这时的半添加法为,①在位于覆铜层压板外层的铜箔表面,使用镀层保护膜,经过曝光、显像的过程,将形成电路部位的镀层保护层剥离除去,暴露外层铜箔的表面,只将不形成电路部位的镀层保护层保留在外层铜箔上。然后,②通过在外层铜箔的表面进行镀铜,在剥离除去了镀层保护膜暴露的外层铜箔的表面形成镀铜电路层,并且形成电路形状。③电镀结束后,剥离保留的镀层保护膜,将存在于所形成电路之间的底部的铜箔通过冲蚀溶解除去,从而完成印刷电路板。如上述形成微细电路的印刷电路板一直在市场上有供应。
但是,如上述半添加法,通过冲蚀除去铜箔层时,镀铜电路层的上端边缘部也同时被浸蚀,最终产品的印刷电路板的电路形状变坏,这就不可避免地出现电路截面形状的纵横比变坏的现象。
因此,要求有一种覆铜层压板及印刷电路板的制造方法。使用该覆铜层压板加工包含有微细电路的印刷电路板时,其电路形状的纵横比可比迄今为止的形状更优良。
附图的简单说明
图1为本发明所述的附有镀铜电路层的覆铜层压板的截面示意图。图2为由本发明得到的电路截面形状与迄今为止所使用的方法得到的电路截面形状之间的差异对比示意图。图3表示铜的溶解速度与硬度的关系。图4~图6为印刷电路板的制造流程示意图。
发明的概要
为此,本发明者进行了深入的研究,结果发现,通过考虑贴在覆铜层压板上的铜箔及该处所形成的镀铜电路层的特性和形状,设计一种覆铜层压板,则可解决上述课题。即,通过着眼于镀铜电路层与铜箔层在浸蚀液中的溶解速度的差,将双方的溶解速度保持在有一定程度以上的差异,通过使用特定的浸蚀液,利用半添加法可制得迄今为止所没有的高品质的印刷电路板。
权利要求为一种附有镀铜电路层的覆铜层压板,它具有用于通过半添加法制造印刷电路板的镀铜电路层,其特征在于,它具有满足下述条件的镀铜电路层和外层铜箔层,即,在使用特定的浸蚀液的情况下,上述构成镀铜电路层的析出铜的溶解速度(Vsp)与上述构成外层铜箔层的铜的溶解速度(Vsc)之比Rv值=(Vsc/Vsp)为1.0以上。
图1为上述的附有镀铜电路层的覆铜层压板的截面示意图。该附有镀铜电路层的覆铜层压板表示,使用上述现有的半添加法到第二阶段的加工完成后的状态。
如权利要求所述,如果附有镀铜电路层的覆铜层压板满足下述条件,即,构成上述镀铜电路层的析出铜的溶解速度(Vsp)与构成上述外层铜箔层的铜的溶解速度(Vsc)之比Rv值=(Vsc/Vsp)为1.0以上,则在下述工序中用冲蚀法除去铜箔层时,即可防止镀铜电路层的上端边缘部的浸蚀,从而避免作为最终制品的印刷电路板的电路形状变坏。
即,迄今为止使用的方法如图2所示,形成的电路截面上部的边缘部受到浸蚀,角被浸蚀掉变为圆形。其结果是电路上部的平坦区域变窄。与此相对应,如果使用与本发明相关的附有镀铜电路层的覆铜层压板,则可防止所形成的电路截面上部的边缘部的浸蚀,如图2(a)所示保留了成锐角的形状。其结果是电路上部的平坦区域变宽,因此比较容易得到如最初设计的电路宽度,成品的精密度变得优良。并且,在进行部件实际安装时的接续面积也增大,从而容易进行工程管理。
这种情况下,构成上述镀铜电路层的析出铜的溶解速度(Vsp)如果不慢于构成上述外层铜箔层的铜的溶解速度(Vsc),则很显然不能达到目的。并且,如果严密考虑,则此溶解速度根据浸蚀液的种类不同也有所差异,另外,由浸蚀液的种类来决定是否能增大Vsp与Vsc之间的差值。
换句话说,不能使用不增大Vsp与Vsc之间差值的浸蚀液,只要是能增大Vsp与Vsc之间差值的浸蚀液都可以使用。而且,必须为使Vsp与Vsc之间的差Rv值=(Vsc/Vsp)在1.0以上的浸蚀液。经过深入的研究,结果发现,Rv值不满该值,则对镀铜电路层的浸蚀大,电路截面的纵横比发生急剧变化。因此,当然该差值越大,则越可防止用上述半添加法进行冲蚀时的镀铜电路层的浸蚀。因此,在本发明的权利要求中,使用了「使用特定的浸蚀液情况下」这样的表达形式。关于该浸蚀液,在下述制造方法的说明中详述。
如上述在浸蚀溶液中的溶解速度,如果对每个制品组进行测定则较麻烦,明显要花费相当长的检查时间,为此,本发明者对是否有与溶解速度相关联的物性值、要素等进行了研究。其结果表明,铜的溶解速度与铜的硬度有非常良好的关联性,图3表示铜的溶解速度与铜的硬度之间的关系。该图3清楚地表示铜的硬度越高,在浸蚀液中的溶解速度越慢。该理论的根据现阶段还不清楚。
权利要求为一种附有镀铜电路层的覆铜层压板,它具有用于通过半添加法制造印刷电路板的镀铜电路层,其特征在于,它具有镀铜电路层和外层铜箔层,该镀铜电路层和外层铜箔层满足下述条件,即,在使用特定的浸蚀液的情况下,上述构成镀铜电路层的析出铜的维氏硬度(Hvp)与上述构成外层铜箔层的铜的溶解速度(Hvc)之比Rhv值=(Hvc/Hvp)为1.0以下。
本发明者将上述RV值=(Vsc/Vsp)为1.0值以上的范围用维氏硬度值进行替换,结果表明,如果满足构成镀铜电路层的析出铜的维氏硬度(Hvp)与构成外层铜箔层的铜的维氏硬度(Hvc)之比Rhv值=(Hvc/Hvp)为1.0以下这样的条件,则符合要求。
然后,在此对于浸蚀液进行说明。本发明者在上述铜的溶解速度的研究过程中,作为浸蚀液使用了多种溶液。代表性的例子有氯化铁系溶液、氯化铜系溶液、硫酸-过氧化氢系溶液等。还有一般常识可以考虑的范围内的添加剂等同时使用的情况,因此称「…系溶液|。
此结果表明,只有氯化铁系、氯化铜系、硫酸-过氧化氢系的任何一种溶液根据铜的性质,可使铜在溶液中的溶解速度大不相同。这种情况反过来考虑,则表示如果能控制铜的物性,即可控制浸蚀时的溶解速度。因此,本发明者设想到在使用上述权利要求1或权利要求2中所述的附有镀铜电路层的覆铜层压板,通过半添加法制造具有微细电路的印刷电路板时,将氯化铁系、氯化铜系、硫酸-过氧化氢系溶液作为浸蚀液使用。
权利要求为一种制造印刷电路板的方法,它使用上述权利要求所述的附有镀铜电路层的覆铜层压板,并采用半添加法,其特征在于,将表面不形成镀铜电路层而处于暴露状态的外层铜箔层通过冲蚀加以除去时所使用的浸蚀液为氯化铁系、氯化铜系、硫酸-过氧化氢系中的任一种铜浸蚀液。
实施发明的最佳方式
以下,对本发明的实施方式进行说明。本实施方式为制造附有镀铜电路层的覆铜层压板,通过冲蚀制成印刷电路板。然后,对形成的电路截面进行观察。
对于本实施方式,最简单化的事例为使用半添加法制造双面印刷电路板1。以下,一边参照图4~图6所表示的制造程序,一边进行说明。这里使用了一种双面覆铜层压板4,它是将标称厚度为5μm的电解铜箔3贴在图4(a)表示的FR-4半固化片2的两面,成为外层。然后如图4(b)所示,在位于该双面覆铜层压板4外层的电解铜箔3的两个表面制成镀层保护膜5。镀层保护膜5是将25μm厚的干胶片(正片型),用干胶片层压机经过加热辊压而成。
然后,将对应于形成的电路图形的照片遮光膜放置于在外层铜箔的表面形成的镀层保护层5上,通过紫外线照射进行曝光处理。这时的紫外线曝光量为约40mJ/cm2,这里与负片型相比,使用曝光析像度优良的正片型的干胶片,受到紫外线照射的镀层保护层5的部位在显像时溶解,没有受到紫外线照射的镀层保护层5的部位显像后依然保留着。
曝光结束后进行显像处理。显像液使用含有表面活性剂的1wt%的氢氧化钠溶液。显像的结果是, 剥离除去了在下述镀铜处理中形成电路部位的镀层保护层5,暴露了外层铜箔的表面,处于只有不形成电路部位的镀层保护层5保留在外层铜箔表面的状态。图5(c)为表示该状态的模式截面图。
此后,将显像结束后的双面覆铜层压板4的外层铜箔层3作为阴极,在镀铜溶液中进行电解,在剥离除去了镀层保护层5的外层铜箔的表面暴露部位进行铜的析出,这样就形成了电路形状的约20μm厚的镀铜电路层6。图5(d)为表示此状态的截面示意图。并且,使用氢氧化钠溶液将保留的镀层保护层5膨胀剥离,从而变为附有镀铜电路层的覆铜层压板7,图6(e)为该覆铜层压板7的模式截面图。
使用浸蚀液,即,硫酸40m/l、过氧化氢水32m/l,温度为30℃的溶液,将图6(e)中截面示意图所示的附有镀铜电路层的覆铜层压板7进行冲蚀,其结果是得到截面如图6(f)所示的双面印刷电路板1。
如果从截面观察上述方法得到的双面印刷电路板的电路形状,则能清楚地看到构成电路截面上部的镀铜电路层6其边缘部的浸蚀得到了防止,保持着成锐角的形状。另外,对此电路截面形状进行观察发现,几乎完全成为四角形状。
产业上利用的可能性
使用本发明的附有镀铜电路层的覆铜层压板,通过本发明的制造方法制得印刷电路板的电路,能够得到包含有非常优良的纵横比的截面形状,容易得到正如设计的电路宽度,从而制得迄今为止没有过的包含有优良精度的制品。并且,在进行部件实际安装的过程中,也可确保增大部件实际安装面积,可降低工程管理成本,从而可有助于降低制造成本的总额。
Claims (3)
1.一种附有镀铜电路层的覆铜层压板,它具有用于通过半添加法制造印刷电路板的镀铜电路层,其特征在于,它具有满足下述条件的镀铜电路层和外层铜箔层,即,在使用特定的浸蚀液的情况下,构成上述镀铜电路层的析出铜的溶解速度(Vsp)与构成上述外层铜箔层的铜的溶解速度(Vsc)之比Rv值=(Vsc/Vsp)为1.0以上。
2.一种附有镀铜电路层的覆铜层压板,它具有用于通过半添加法制造印刷电路板的镀铜电路层,其特征在于,它具有满足下述条件的镀铜电路层和外层铜箔层,即,在使用特定的浸蚀液的情况下,构成上述镀铜电路层的析出铜的维氏硬度(Hvp)与构成上述外层铜箔层的铜的维氏硬度(Hvc)之比Rhv值=(Hvc/Hvp)为1.0以下。
3.一种制造印刷电路板的方法,它使用权利要求1或2所述的附有镀铜电路层的覆铜层压板,并采用半添加法,其特征在于,将表面上没有形成镀铜电路层而处于暴露状态的外层铜箔层通过冲蚀加以除去时所使用的浸蚀液为氯化铁系、氯化铜系、硫酸-过氧化氢系中的任一种铜浸蚀液。
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JP2001163743A JP4683769B2 (ja) | 2001-05-31 | 2001-05-31 | 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法 |
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US (1) | US6652993B2 (zh) |
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JP (1) | JP4683769B2 (zh) |
KR (1) | KR100866440B1 (zh) |
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CN103209547A (zh) * | 2012-01-17 | 2013-07-17 | 昆山华扬电子有限公司 | 加成法凸台印制板制作工艺 |
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JP2007081214A (ja) * | 2005-09-15 | 2007-03-29 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
JP2007095910A (ja) * | 2005-09-28 | 2007-04-12 | Elna Co Ltd | 配線基板の製造方法 |
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CN109429434A (zh) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
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CN101977482A (zh) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | 一种高纵横比的pcb产品外层线路蚀刻方法 |
CN101977482B (zh) * | 2010-11-09 | 2012-03-28 | 深圳崇达多层线路板有限公司 | 一种高纵横比的pcb产品外层线路蚀刻方法 |
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CN105188271B (zh) * | 2012-01-17 | 2017-12-05 | 江苏普诺威电子股份有限公司 | 加成法凸台印制板制作工艺 |
CN105282984B (zh) * | 2012-01-17 | 2018-08-31 | 江苏普诺威电子股份有限公司 | 加成法凸台印制板制作工艺 |
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US20020182434A1 (en) | 2002-12-05 |
JP4683769B2 (ja) | 2011-05-18 |
EP2398304A3 (en) | 2012-10-10 |
EP1392092A4 (en) | 2007-05-02 |
CN1222203C (zh) | 2005-10-05 |
US6652993B2 (en) | 2003-11-25 |
TW550982B (en) | 2003-09-01 |
EP1392092A1 (en) | 2004-02-25 |
EP2398304A2 (en) | 2011-12-21 |
KR100866440B1 (ko) | 2008-10-31 |
WO2002098194A1 (en) | 2002-12-05 |
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JP2002359454A (ja) | 2002-12-13 |
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