KR100859401B1 - 히터 및 히터를 구비한 가열 장치 - Google Patents

히터 및 히터를 구비한 가열 장치 Download PDF

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Publication number
KR100859401B1
KR100859401B1 KR1020060009885A KR20060009885A KR100859401B1 KR 100859401 B1 KR100859401 B1 KR 100859401B1 KR 1020060009885 A KR1020060009885 A KR 1020060009885A KR 20060009885 A KR20060009885 A KR 20060009885A KR 100859401 B1 KR100859401 B1 KR 100859401B1
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KR
South Korea
Prior art keywords
lamp unit
heater
filament
filaments
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020060009885A
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English (en)
Korean (ko)
Other versions
KR20060096275A (ko
Inventor
요이치 미즈카와
게이타 가나즈
마사키 요시오카
신지 스즈키
교헤이 세키
Original Assignee
우시오덴키 가부시키가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36481395&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100859401(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 우시오덴키 가부시키가이샤 filed Critical 우시오덴키 가부시키가이샤
Publication of KR20060096275A publication Critical patent/KR20060096275A/ko
Application granted granted Critical
Publication of KR100859401B1 publication Critical patent/KR100859401B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K7/00—Lamps for purposes other than general lighting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K9/00—Lamps having two or more incandescent bodies separately heated
    • H01K9/08—Lamps having two or more incandescent bodies separately heated to provide selectively different light effects, e.g. for automobile headlamp
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Resistance Heating (AREA)
  • Control Of Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020060009885A 2005-03-02 2006-02-02 히터 및 히터를 구비한 가열 장치 Expired - Fee Related KR100859401B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00057803 2005-03-02
JP2005057803 2005-03-02
JP2005191222A JP2006279008A (ja) 2005-03-02 2005-06-30 ヒータ及びヒータを備えた加熱装置
JPJP-P-2005-00191222 2005-06-30

Publications (2)

Publication Number Publication Date
KR20060096275A KR20060096275A (ko) 2006-09-11
KR100859401B1 true KR100859401B1 (ko) 2008-09-22

Family

ID=36481395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060009885A Expired - Fee Related KR100859401B1 (ko) 2005-03-02 2006-02-02 히터 및 히터를 구비한 가열 장치

Country Status (6)

Country Link
US (1) US7656079B2 (enExample)
EP (1) EP1699071B1 (enExample)
JP (1) JP2006279008A (enExample)
KR (1) KR100859401B1 (enExample)
DE (1) DE602006007049D1 (enExample)
TW (1) TW200633166A (enExample)

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JP4692249B2 (ja) * 2005-11-30 2011-06-01 ウシオ電機株式会社 フィラメントランプ
JP4893159B2 (ja) 2006-08-24 2012-03-07 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
ITMI20061648A1 (it) * 2006-08-29 2008-02-29 Star Progetti Tecnologie Applicate Spa Dispositivo di irraggiamento di calore tramite infrarossi
JP2008135313A (ja) * 2006-11-29 2008-06-12 Matsushita Electric Ind Co Ltd 発熱体ユニット及び加熱装置
JP4894511B2 (ja) * 2006-12-27 2012-03-14 ウシオ電機株式会社 フィラメントランプ及び光照射式加熱装置
JP4935417B2 (ja) * 2007-02-26 2012-05-23 ウシオ電機株式会社 光照射式加熱処理装置
EP2003677A3 (en) 2007-05-29 2009-08-26 Ushiodenki Kabushiki Kaisha Filament lamp and light irradiation type heat treatment device
JP4893474B2 (ja) * 2007-05-29 2012-03-07 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
JP5041332B2 (ja) * 2007-05-29 2012-10-03 ウシオ電機株式会社 フィラメントランプ
JP4915532B2 (ja) * 2007-05-29 2012-04-11 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
KR20090005736A (ko) * 2007-07-10 2009-01-14 주성엔지니어링(주) 기판 가열 장치
JP5041149B2 (ja) * 2007-10-10 2012-10-03 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
JP5282393B2 (ja) * 2007-11-06 2013-09-04 ウシオ電機株式会社 光照射式加熱処理装置
JP5267765B2 (ja) * 2007-11-08 2013-08-21 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
JP5282409B2 (ja) * 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
KR100918103B1 (ko) * 2008-03-25 2009-09-22 강병호 전기 발열관
JP2009238552A (ja) 2008-03-27 2009-10-15 Ushio Inc フィラメントランプ
KR101103180B1 (ko) 2008-03-27 2012-01-04 우시오덴키 가부시키가이샤 필라멘트 램프
JP4670886B2 (ja) 2008-03-31 2011-04-13 ウシオ電機株式会社 フィラメントランプ
JP5315833B2 (ja) 2008-07-28 2013-10-16 ウシオ電機株式会社 フィラメントランプ
JP5151773B2 (ja) * 2008-07-29 2013-02-27 ウシオ電機株式会社 フィラメントランプ
JP5120132B2 (ja) * 2008-08-01 2013-01-16 ウシオ電機株式会社 フィラメントランプ
JP4821819B2 (ja) * 2008-08-26 2011-11-24 ウシオ電機株式会社 フィラメントランプおよび光照射式加熱処理装置
JP5125933B2 (ja) 2008-09-22 2013-01-23 ウシオ電機株式会社 フィラメントランプ
JP5251398B2 (ja) 2008-09-26 2013-07-31 ウシオ電機株式会社 フィラメントランプ
KR20110131292A (ko) * 2009-03-16 2011-12-06 알타 디바이씨즈, 인크. 증기 증착용 샤워헤드
KR101031226B1 (ko) * 2009-08-21 2011-04-29 에이피시스템 주식회사 급속열처리 장치의 히터블록
WO2013096748A1 (en) * 2011-12-23 2013-06-27 Applied Materials, Inc. Methods and apparatus for cleaning substrate surfaces with atomic hydrogen
US8970110B2 (en) * 2012-10-17 2015-03-03 Elwha Llc Managed multiple-filament incandescent lighting system
US9049758B2 (en) * 2012-10-17 2015-06-02 Elwha Llc Multiple-filament tungsten-halogen lighting system having managed tungsten redeposition
KR102475565B1 (ko) * 2013-09-05 2022-12-08 어플라이드 머티어리얼스, 인코포레이티드 감소된 코일 가열을 위한 램프 단면
JP6219227B2 (ja) 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
TWI674071B (zh) 2014-12-15 2019-10-11 瑞士商菲利浦莫里斯製品股份有限公司 氣溶膠產生系統及用於在電熱式氣溶膠產生系統內導引氣流的方法
WO2016126381A1 (en) * 2015-02-05 2016-08-11 Applied Materials, Inc. Rapid thermal processing chamber with linear control lamps
JP2016206484A (ja) * 2015-04-24 2016-12-08 株式会社リコー ヒータ、定着装置及び画像形成装置
JP6473659B2 (ja) * 2015-05-13 2019-02-20 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
CN107526269A (zh) * 2016-06-20 2017-12-29 株式会社东芝 加热器以及加热装置
JP6982446B2 (ja) * 2017-09-21 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP7082514B2 (ja) * 2018-04-04 2022-06-08 株式会社Kelk 流体加熱装置
CN114126101B (zh) * 2021-11-02 2024-01-26 Tcl华星光电技术有限公司 石英红外加热装置及其对基板加热的方法

Citations (1)

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KR20010050917A (ko) * 1999-10-07 2001-06-25 다나카 아키히로 광조사식 급속 가열처리장치의 제어장치

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JPH0652674B2 (ja) * 1985-02-05 1994-07-06 ミノルタカメラ株式会社 加熱装置用ハロゲン発熱体
JPH0730355B2 (ja) * 1986-01-17 1995-04-05 オリザ油化株式会社 粗油脂類から脂肪酸を分離する方法
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JPH0737833A (ja) 1993-07-22 1995-02-07 Dainippon Screen Mfg Co Ltd 基板の光照射式熱処理装置
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JP2000036469A (ja) * 1998-07-21 2000-02-02 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP3528042B2 (ja) * 2000-01-24 2004-05-17 ウシオ電機株式会社 光加熱装置
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Patent Citations (1)

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KR20010050917A (ko) * 1999-10-07 2001-06-25 다나카 아키히로 광조사식 급속 가열처리장치의 제어장치

Also Published As

Publication number Publication date
TW200633166A (en) 2006-09-16
US20060197454A1 (en) 2006-09-07
EP1699071A1 (en) 2006-09-06
DE602006007049D1 (de) 2009-07-16
US7656079B2 (en) 2010-02-02
JP2006279008A (ja) 2006-10-12
TWI348208B (enExample) 2011-09-01
EP1699071B1 (en) 2009-06-03
KR20060096275A (ko) 2006-09-11

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