KR100849653B1 - 전자 컴포넌트의 콘택트 엘리먼트의 위치를 측정하기 위한방법 및 장치 - Google Patents
전자 컴포넌트의 콘택트 엘리먼트의 위치를 측정하기 위한방법 및 장치 Download PDFInfo
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- KR100849653B1 KR100849653B1 KR1020037008892A KR20037008892A KR100849653B1 KR 100849653 B1 KR100849653 B1 KR 100849653B1 KR 1020037008892 A KR1020037008892 A KR 1020037008892A KR 20037008892 A KR20037008892 A KR 20037008892A KR 100849653 B1 KR100849653 B1 KR 100849653B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
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- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
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Claims (15)
- 전자 컴포넌트의 한 셋트의 N개 콘택트 엘리먼트의 각각의 위치를 측정하기 위한 방법에 있어서, 상기 방법은,- 상기 셋트의 콘택트 엘리먼트를 측정 플레인에 가져다 놓는 단계;- 동질적인 제1 및 제2 광원으로 상기 측정 플레인을 조명하는 단계;- 상기 제1 광원 및 하나 이상의 상기 콘택트 엘리먼트에서의 반사에 의해 산출된 제1 광 빔에 의해 생성된 제1 광 경로를 제1 뷰잉 각도 방향으로 형성하는 단계로서, 상기 제1 광 경로는 상기 하나 이상의 콘택트 엘리먼트에서 시작하여 카메라의 이미지 플레인에서 종료하는, 단계;- 상기 제2 광원 및 하나 이상의 상기 콘택트 엘리먼트에서의 반사에 의해 산출된 제2 광 빔에 의해 생성된 제2 광 경로를 상기 제1 뷰잉 각도와 상이한 값을 갖는 제2 뷰잉 각도 방향으로 형성하는 단계로서, 상기 제2 광 경로는 상기 하나 이상의 콘택트 엘리먼트에서 시작하여 상기 카메라의 상기 이미지 플레인에서 종료하고, 상기 제1 및 제2 광 경로는 각각이 측정 플레인으로부터 뻗고 서로에 대해 20°≤α≤80°범위의 각도를 이루는 제1 섹션을 갖는, 단계;- 상기 제1 광 경로를 선택적으로 개방함에 의해 그리고 상기 카메라에 의해 상기 콘택트 엘리먼트의 제1 이미지를 형성하고, 상기 제2 광 경로를 선택적으로 개방함에 의해 그리고 상기 카메라에 의해 상기 콘택트 엘리먼트의 제2 이미지를 형성하는 단계; 및- 상기 제1 이미지 및 제2 이미지를 사용하여 상기 위치를 측정하는 단계를 포함하는 것을 특징으로 하는 방법.
- 제1 항에 있어서, 상기 제1 광원 및 제2 광원은 비중첩 파장을 갖춘 광을 산출하는 것을 특징으로 하는 방법.
- 제1 항 또는 제2항에 있어서, 상기 제1 광 경로 및 제 2 광 경로는 실질적으로 동일한 평균 광학 길이를 갖는 것을 특징으로 하는 방법.
- 제1 항 또는 제2 항에 있어서, 상기 제1 광원은 상기 엘리먼트상에 최대 20°인 입사각을 갖춘 상기 제1 광 빔을 산출하는 것을 특징으로 하는 방법.
- 제1 항 또는 제2 항에 있어서, 상기 제1 광 경로는 상기 콘택트 엘리먼트로부터 시작하여 상기 측정 플레인에 대해 실질적으로 수직으로 뻗는 초기 섹션을 갖는 것을 특징으로 하는 방법.
- 전자 컴포넌트의 한 셋트의 N개 콘택트 엘리먼트의 각각의 위치를 측정하기 위한 장치에 있어서, 상기 장치는,동질적인 광 빔을 발생시키고 상기 콘택트 엘리먼트가 배치된 측정 플레인을 조명하기 위해 제공된 제1 광원; 상기 제1 광원 및 하나 이상의 상기 콘택트 엘리먼트에서의 반사에 의해 산출된 제1 광 빔에 의해 생성된 제1 광 경로를 제1 뷰잉 각도 방향으로 형성하기 위해 제공된 제1 광학 수단 및 카메라; 제2 광원 및 하나 이상의 상기 콘택트 엘리먼트에서의 반사에 의해 산출된 제2 광 빔에 의해 생성된 제2 광 경로를 상기 제1 뷰잉 각도와 상이한 값을 갖는 제2 뷰잉 각도 방향으로 형성하기 위해 제공된 제2 광학 수단; 및 상기 제1 및 2 광 경로에 장착되고 상기 제1 또는 2 광 경로 중 하나를 선택적으로 개방시키기 위해 제공된 선택수단을 포함하고, 상기 제1 광 경로는 상기 하나 이상의 콘택트 엘리먼트에서 시작하여 상기 카메라의 이미지 플레인에서 종료하고, 상기 제2 광 경로는 상기 하나 이상의 콘택트 엘리먼트에서 시작하고, 상기 카메라는 상기 카메라에 의해 기록된 이미지로부터 상기 위치를 측정하기 위해 제공된 처리수단에 연결되고, 상기 제1 및 제2 광 경로는 각각이 측정 플레인으로부터 뻗고 서로에 대해 20°≤α≤80°범위의 각도를 이루는 제1 섹션을 갖고, 상기 제2 광 경로는 상기 카메라의 상기 이미지 플레인에서 종료하는 것을 특징으로 하는 장치.
- 제6 항에 있어서, 상기 제1 및 제2 광원은 광을 중첩하지 않는 파장 범위로 산출하는 것을 특징으로 하는 장치.
- 제6 항에 있어서, 상기 제1 및 제2 광원을 순차적으로 스위칭 온/오프시키기 위한 수단이 더 구비된 것을 특징으로 하는 장치.
- 제6 항 내지 제8 항 중 어느 한 항에 있어서, 상기 선택수단은 다이크로익 미러에 의해 형성되는 것을 특징으로 하는 장치.
- 제6 항 내지 제8 항 중 어느 한 항에 있어서, 상기 선택수단은 반투과성 미러 및 셔터에 의해 형성되는 것을 특징으로 하는 장치.
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00204761.1 | 2000-12-29 | ||
EP00204761A EP1220596A1 (en) | 2000-12-29 | 2000-12-29 | A method and an apparatus for measuring positions of contact elements of an electronic component |
PCT/BE2002/000001 WO2002054849A1 (en) | 2000-12-29 | 2002-01-02 | A method and an apparatus for measuring positions of contact elements of an electronic component |
Publications (2)
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KR20040029316A KR20040029316A (ko) | 2004-04-06 |
KR100849653B1 true KR100849653B1 (ko) | 2008-08-01 |
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KR1020037008892A KR100849653B1 (ko) | 2000-12-29 | 2002-01-02 | 전자 컴포넌트의 콘택트 엘리먼트의 위치를 측정하기 위한방법 및 장치 |
Country Status (9)
Country | Link |
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US (1) | US7423743B2 (ko) |
EP (2) | EP1220596A1 (ko) |
JP (1) | JP2004516491A (ko) |
KR (1) | KR100849653B1 (ko) |
CN (1) | CN1266994C (ko) |
AT (1) | ATE298973T1 (ko) |
DE (1) | DE60204849T2 (ko) |
HK (1) | HK1062106A1 (ko) |
WO (1) | WO2002054849A1 (ko) |
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- 2002-01-02 KR KR1020037008892A patent/KR100849653B1/ko active IP Right Grant
- 2002-01-02 JP JP2002555602A patent/JP2004516491A/ja active Pending
- 2002-01-02 AT AT02726974T patent/ATE298973T1/de not_active IP Right Cessation
- 2002-01-02 US US10/465,933 patent/US7423743B2/en not_active Expired - Lifetime
- 2002-01-02 WO PCT/BE2002/000001 patent/WO2002054849A1/en active IP Right Grant
- 2002-01-02 DE DE60204849T patent/DE60204849T2/de not_active Expired - Lifetime
- 2002-01-02 EP EP02726974A patent/EP1354505B1/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
EP1220596A1 (en) | 2002-07-03 |
CN1502220A (zh) | 2004-06-02 |
WO2002054849A8 (en) | 2003-12-24 |
US7423743B2 (en) | 2008-09-09 |
DE60204849T2 (de) | 2006-05-11 |
WO2002054849A1 (en) | 2002-07-11 |
EP1354505B1 (en) | 2005-06-29 |
HK1062106A1 (en) | 2004-10-15 |
KR20040029316A (ko) | 2004-04-06 |
ATE298973T1 (de) | 2005-07-15 |
EP1354505A1 (en) | 2003-10-22 |
DE60204849D1 (de) | 2005-08-04 |
JP2004516491A (ja) | 2004-06-03 |
US20040085549A1 (en) | 2004-05-06 |
CN1266994C (zh) | 2006-07-26 |
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