MY148204A - A method and means for measuring positions of contact elements of an electronic components - Google Patents

A method and means for measuring positions of contact elements of an electronic components

Info

Publication number
MY148204A
MY148204A MYPI20082704A MYPI20082704A MY148204A MY 148204 A MY148204 A MY 148204A MY PI20082704 A MYPI20082704 A MY PI20082704A MY PI20082704 A MYPI20082704 A MY PI20082704A MY 148204 A MY148204 A MY 148204A
Authority
MY
Malaysia
Prior art keywords
contact elements
camera
electronic components
image point
measuring positions
Prior art date
Application number
MYPI20082704A
Inventor
Wong Ting Lik
Loh Chee Kit
Yew Chen Chung
Original Assignee
Vitrox Corp Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitrox Corp Bhd filed Critical Vitrox Corp Bhd
Priority to MYPI20082704A priority Critical patent/MY148204A/en
Priority to JP2011520004A priority patent/JP5787258B2/en
Priority to CN2009801278488A priority patent/CN102099653B/en
Priority to PCT/MY2009/000082 priority patent/WO2010011124A1/en
Priority to KR1020117000873A priority patent/KR101633139B1/en
Publication of MY148204A publication Critical patent/MY148204A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/593—Depth or shape recovery from multiple images from stereo images
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A METHOD AND MEANS FOR MEASURING POSITIONS OF CONTACT ELEMENTS (2, 3) OF AN ELECTRONIC COMPONENTS THAT UTILIZES SCALING FACTORS IN X, Y AND Z DIMENSIONS IS DISCLOSED HEREIN. THE SCALING FACTORS ARE DETERMINED DURING CALIBRATION PROCEDURES WHICH ALSO ESTABLISHES THE CAMERA-TO-CAMERA RELATIONSHIP OF THE SYSTEM. THE CALIBRATION MAPS IMAGE POINT RECORDED IN THE FIRST CAMERA (4) FOR EACH POINT OF THE CONTACT ELEMENT TO CORRESPONDING IMAGE POINT RECORDED IN THE SECOND AND THIRD CAMERA (5, 6) AS PART OF THE PROCESS TO OBTAIN THE DISPLACEMENT BETWEEN A FIRST IMAGE POINT AND A SECOND IMAGE POINT TO DETERMINE THE HEIGHT DIFFERENCE BETWEEN DIFFERENT CONTACT ELEMENTS.
MYPI20082704A 2008-07-21 2008-07-21 A method and means for measuring positions of contact elements of an electronic components MY148204A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
MYPI20082704A MY148204A (en) 2008-07-21 2008-07-21 A method and means for measuring positions of contact elements of an electronic components
JP2011520004A JP5787258B2 (en) 2008-07-21 2009-06-26 Method and apparatus for measuring the position of a contact element of an electronic component
CN2009801278488A CN102099653B (en) 2008-07-21 2009-06-26 Method and means for measuring positions of contact elements of an electronic components
PCT/MY2009/000082 WO2010011124A1 (en) 2008-07-21 2009-06-26 A method and means for measuring positions of contact elements of an electronic components
KR1020117000873A KR101633139B1 (en) 2008-07-21 2009-06-26 A method and means for measuring positions of contact elements of an electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20082704A MY148204A (en) 2008-07-21 2008-07-21 A method and means for measuring positions of contact elements of an electronic components

Publications (1)

Publication Number Publication Date
MY148204A true MY148204A (en) 2013-03-15

Family

ID=41570469

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20082704A MY148204A (en) 2008-07-21 2008-07-21 A method and means for measuring positions of contact elements of an electronic components

Country Status (5)

Country Link
JP (1) JP5787258B2 (en)
KR (1) KR101633139B1 (en)
CN (1) CN102099653B (en)
MY (1) MY148204A (en)
WO (1) WO2010011124A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102213581B (en) * 2010-04-08 2016-06-08 财团法人工业技术研究院 object measuring method and system
US8691916B2 (en) 2012-05-07 2014-04-08 Dow Global Technologies Llc Retortable easy opening seals for film extrusion
WO2015181974A1 (en) * 2014-05-30 2015-12-03 ヤマハ発動機株式会社 Component-data-generating device, surface-mounting machine, and method for generating component data
JP6457295B2 (en) * 2015-02-19 2019-01-23 株式会社Ｆｕｊｉ Parts judgment device
DE102016112197B4 (en) * 2016-07-04 2018-05-24 Asm Assembly Systems Gmbh & Co. Kg A method and apparatus for stereoscopically determining information regarding the elevation of the front of a port

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3266429B2 (en) * 1994-11-08 2002-03-18 松下電器産業株式会社 Pattern detection method
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6538750B1 (en) * 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
WO2000062012A1 (en) * 1999-04-13 2000-10-19 Icos Vision Systems N.V. Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
JP3915033B2 (en) * 2003-05-15 2007-05-16 株式会社テクノホロン Measuring method and measuring apparatus using stereo optical system
US7428329B2 (en) * 2003-05-28 2008-09-23 Fuji Machine Mfg. Co., Ltd. Pickup image processing device of electronic part mounting device and pickup image processing method
CN101189487B (en) * 2005-03-11 2010-08-11 形创有限公司 Auto-referenced system and apparatus for three-dimensional scanning
US7400417B2 (en) * 2005-05-23 2008-07-15 Federal Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart
KR20070099398A (en) * 2006-04-03 2007-10-09 삼성전자주식회사 Apparatus for inspecting substrate and method of inspecting substrate using the same
JP2009139285A (en) * 2007-12-07 2009-06-25 Univ Nihon Solder ball inspection device, its inspection method, and shape inspection device

Also Published As

Publication number Publication date
KR20110043593A (en) 2011-04-27
WO2010011124A1 (en) 2010-01-28
JP2011528800A (en) 2011-11-24
JP5787258B2 (en) 2015-09-30
CN102099653A (en) 2011-06-15
CN102099653B (en) 2012-11-14
KR101633139B1 (en) 2016-06-23

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