CN102099653B - Method and means for measuring positions of contact elements of an electronic components - Google Patents
Method and means for measuring positions of contact elements of an electronic components Download PDFInfo
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- CN102099653B CN102099653B CN2009801278488A CN200980127848A CN102099653B CN 102099653 B CN102099653 B CN 102099653B CN 2009801278488 A CN2009801278488 A CN 2009801278488A CN 200980127848 A CN200980127848 A CN 200980127848A CN 102099653 B CN102099653 B CN 102099653B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/55—Depth or shape recovery from multiple images
- G06T7/593—Depth or shape recovery from multiple images from stereo images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A method and means for measuring positions of contact elements (2, 3) of an electronic component that utilizes scaling factors in x, y and z dimensions is disclosed herein. The scaling factors are determined during calibration procedures which also establish the camera-to-camera relationship of the system. The calibration maps image point recorded in the first camera (4) for each point of the contact element to corresponding image point recorded in the second and third camera (5, 6) as part of the process to obtain the displacement between a first image point and a second image point to determine the height difference between different contact elements.
Description
Invention field
The present invention relates to the Machine Vision Detection field with and electronic component on the location survey of osculating element.
Background of invention
In the prior art; The positioning method of osculating element and device are generally on the electronic component: adopt two cameras to become certain triangulation angle; Take respectively and obtain first image and second image, thereby measure osculating element position with respect to the electronic equipment bottom surface on Z-direction.The degree of accuracy of the osculating element position of said determination is benefited from the influence of triangulation angle between two cameras taking first and second images.The restrictive condition that also has a trigonometric calculations degree of accuracy is because employed data are to get from two-dimensional signal.The degree of accuracy of triangulation angle in addition also receives the influence of optical distortion, and non-uniform lighting also can cause equation derivation mistake.Therefore, the location of osculating element needs effectively a kind of and does not receive the three-dimensional positioning method that uncertain factor influences in calibration and measuring process.
Summary of the invention
The present invention relates to a kind of method of measuring each osculating element position on the electronic component, this method may further comprise the steps: said osculating element is put into aligned spaces; Said osculating element throws light on; Through having a camera on the first picture plane that extends in parallel with calibration plane, take first image of the said osculating element of record; Write down second image of said osculating element through No. two camera; Handle first picture point that said first image is determined at each said osculating element on each said osculating element, wherein said each first picture point is meant the location point on each said osculating element; Handle second picture point that said second image is determined at each said osculating element on each said osculating element; Wherein said second picture point of each said osculating element and the said first picture point correspondence are same point on each said osculating element; Measure the 3rd picture point on second image through the location map algorithm; And being determined at the displacement between the above second picture point of said second image and the 3rd picture point, wherein said the 3rd picture point is the point of the said first picture point rectangular projection on said calibration plane.
The present invention also relates to a kind of device of measuring each osculating element position on the electronic component, this device comprises: being used to throw light on is placed on the lighting source of osculating element described in the normed space in advance; A camera and No. two cameras; A said camera and No. two cameras are respectively applied for first and second images of taking the said osculating element of record; One treating apparatus; This device is connected with No. two cameras with a said camera; In order to the position that obtains first picture point of each osculating element on said first image and on second image position of second picture point; Said first picture point of each said osculating element and the second picture point correspondence are same point on each said osculating element; On said second image, obtain the position of the 3rd picture point through the location map algorithm, said the 3rd picture point is by the said first picture point rectangular projection gained, and the displacement of measuring said second picture point and the 3rd picture point.
Can also comprise No. three extra cameras, be used to compensate a camera record and No. two unwritten picture point of camera, the increase of No. three cameras can be shortened the required time of whole detection.
The accompanying drawing summary
In conjunction with the illustrative example of describing in detail below the advantages, can be easily aware of and understand above-mentioned and others, feature and advantage of the present invention fully, similar characteristics is represented by same parts in institute's drawings attached,
Wherein:
Figure 1A and 1B are the distribution schematic diagrams of camera and illumination among the present invention;
Fig. 2 A, 2B, 2C are respectively first, second and the 3rd images through the BGA element of No., No. two and No. three camera record;
Fig. 3 is a kind of layered mask version that is used to calibrate;
Fig. 4 A, 4B, 4C are the calibration that obtains through No. one, No. two and No. three camera images with mask;
Fig. 5 is the mapping algorithm of the coordinate of from first to second calibration image;
Fig. 6 is a location principle of the present invention.
Detailed Description Of The Invention
The inventive method is designed for the three-dimensional position of osculating element on the automatic calculating electronic component; Above-mentioned electronic component can be BGA (Ball Grid Array, BGA)/CSP (Chip Scale Packaging, chip-scale package); The inverse bonding chip device; Leaded device (the small-sized square planar package of QFP, the encapsulation of TSOP thin-type small-size) and unleaded device (MLP 24 pin mold Lead-free in Electronic Packaging, QFN quad flat non-pin package).The present invention can calculate the three-dimensional position of osculating element combination on the individual devices, the BGA/CSP assembling device (1) with leaded device for example as shown in Figure 1 automatically.
With this mode that shows among Fig. 1, electronic component (1) is placed in the aligned spaces in advance, throw light on through lighting source (7) and (8) in the osculating element on it (2) and (3).A camera (4) is used to take first image of the element bottom shown in Fig. 2 A perpendicular to the calibration plane setting.The second and the 3rd side perspective projection image that No. two cameras (5) and No. three cameras (6) are used to take the electronic component shown in Fig. 2 B and 2C is set.First kind of embodiment of the present invention only needs 2 cameras to measure the three-dimensional position of osculating element on the electronic component.Osculating element on the electronic component that second image can't observe then uses the 3rd camera to take its image.The use of the 3rd camera also can be shortened the whole Image Acquisition time.When using the 3rd camera, be recorded in respectively No. one with No. three cameras in first with the 3rd image on other osculating element position measuring method and install and the method for No. one and No. two camera of use and install identical.Therefore, the embodiment of the invention is only described and is used first and second cameras to carry out the method for operating of location.
Preferably; Location between the camera 1 and 2 is according to the mode shown in Figure 1A and the 1B; All directly towards the electronic component setting, in addition, camera 1,2 abides by the principle with 3 placement: all osculating elements on the whole electronic component can be observed by 2 different cameras at least.For example, Figure 1A has shown that with 1B three cameras are located at different x, y, z coordinate, and the position that all thus osculating elements possibly be in all can be observed by at least 2 different cameras.
, need calibrate the osculating element location before beginning the equipment of measuring three-dimensional osculating element.This calibration is in order to obtain position X1 and the relation between the position X3 in corresponding second image in first image, for example by a picture point rectangular projection in the calibration plane gained.The mask that is used to calibrate (9) as shown in Figure 3.It comprises many predetermined marks, and these marks can adopt the square of accurately knowing its position to represent.Mask (9) comprises the substrate that is used for placing in advance tested electronic component, and this substrate comprises the glassy layer that multilayer is treated, and is arranged on the glass-base with the mode of array.Adopt high-precision screen printing that square is printed on the every glassy layer.The thickness of all glassy layers all is accurately known, and all marks of accurately printing all can be detected by camera easily simultaneously.Though indicate in the drawings, previous described calibration also can similarly be calibrated by other with mask and substituted with mask, for example from pinpoint aspect projection, have the mask of vertical structure.
In order to obtain accurate calibration, be printed on the position and the size of calibrating and all need be accurate to 0.1 micron with the mask upper block.The calibration with mask across scope and volume be defined as calibrated space on x, y and z direction.Therefore, when calibrating with mask when x, y and z direction have covered bigger space and scope, measure bigger electronic component and need adopt bigger space.In the measuring process of carrying out then, the residing plane of osculating element needn't be positioned on the calibration plane (11) fully, as long as the residing plane of osculating element can be measured within the aligned spaces of being set up.
The calibration that Fig. 4 A, 4B and 4C have shown respectively No. one, No. two and No. three cameras are taken separately is with first, second and the 3rd image of mask.Because single as calibration can be identified with the square mark on the mask, so can measure mapping algorithm in the calibration process, can be used for the mapping between the image further as shown in Figure 5.Fig. 4 A and 4B are respectively the calibration image of the calibration of No. (4) and No. two cameras (5) record with mask.Shown in Fig. 4 A and 4B, calibration steps comprises that identical square (10) (11) is perhaps in first image of being taken by No. (4) and No. two cameras (5) (Fig. 4 A) and the mensuration of similar characteristics (Fig. 4 A) present position in second image (Fig. 4 B).Derive the location map algorithm from the position of each corresponding characteristic of measuring first and second images.As shown in Figure 5, at the coordinate of the first image mid point (111), map to its corresponding point (111 ') in second image.Therefore, this plane (11) are calibration plane, because its lip-deep marker characteristic is pixel mapping to the second image that is used on first plane of delineation.
With reference to figure 5, utilize the bilinear interpolation technology to measure the coordinate of all positions between any two marks.The position that for example X1 is ordered in first image is represented with dx and dy, with reference to the coordinate (111), (112), (221) and (222) that are become by rectangle formation on first image.X3 point on second image is the point that X1 rectangular projection obtains on first image, uses dx ' and dy ' expression.Obtain the location map algorithm between first picture point and the second image epigraph point on first image through measuring relation between related dx and dx ' and related dy and the dy ', wherein the second image epigraph point is the point that on standard flat, is obtained by the first picture point rectangular projection.For example, on related first plane of delineation on X1 and second plane of delineation location map algorithm of X 3 and the related dx of x-coordinate and dx ' and the related dy of y-coordinate and dy ' be associated.The use location mapping algorithm is measured the point that is positioned at second plane of delineation in measuring process then, and this point is that the first picture point rectangular projection is in the calibration plane gained.
With reference to figure 3,4A, 4B and 5 at first passes through pixel coordinate X1 separately in first and second images, and X2 measures the z axis scale factor, such as calibrating with the square on the mask (10).X3 obtains being mapped in the point on the calibration plane from X1 point quadrature through the location map algorithm.Because the z of X2 and X3 is known to distance, can measure the z axis scale factor on second image (4B) and the 3rd image (4C) thus.For example, if the distance of X2 and X3 is 10mm, their corresponding distance on second image is 25 pixels, and that z axis scale factor is 10mm/25 pixel=0.4mm/ pixel.
After accomplishing calibration steps, the position of osculating element on first image that the x-y coordinate position mapping algorithm that usefulness obtains and the z axis scale factor are come measuring element and second image.In addition, the X of osculating element, the distance of Y and Z axle can be through x separately, and the y and the z scaling factor calculate.Because can accurately locate with mask through calibration, so the position finding of osculating element also can be accurate to micron.Calibration operation also is applicable to the calibration of camera camera, concerns with the position between clear and definite No. (4) and No. two cameras (5).The position relation of No. three cameras and a camera also can be measured through this method.
Since calibrate in the space that is used to measure, the placement of No. one and No. two camera is also explained, can help to understand measuring principle of the present invention with reference to figure 6.No. two cameras of placement reference of No. three cameras (6) are with respect to the placement of a camera.If an electronic component is put into aligned spaces, the position of an osculating element above it is decided to be the P point with reference to calibration plane p.First image of a camera osculating element is chosen P point simultaneously.Measure the position of the first corresponding picture point X1 of the P point of osculating element on first image.
No. two cameras (5) are taken second image with osculating element that P order, measure the second picture point X2 on second image of P point correspondence.Utilize the location map algorithm with the rectangular projection of P point on calibration plane p, obtain the 2nd P ' point, in second image, P ' images of positions point is the 3rd picture point X3.If osculating element P localization is in calibration plane p, then X3 then thinks to be in the position of expectation.The position that X3 is ordered in second image obtains through the location map algorithm computation.Displacement between X2 and the X3 is based on such fact: in fact, osculating element can not be accurately positioned on the calibration plane usually, but has one section to need the difference in height Δ Z that measures.According to noted earlier, displacement Z can calculate gained through the product between the scale factor of Z axle in the distance (for example Δ Z ') between X3 and the X2 and second image.
Because the present invention measures the point in the aligned spaces, obviously, those skilled in the art the present invention capable of using measures the distance between any 2, as long as these two is to be positioned at aligned spaces.
The method and system of distance between distance and osculating element and the calibration plane between the osculating element on the measuring sensor in aligned spaces that the present invention relates to; Be very practical and effective to those skilled in the art, wherein said element can be the integrated circuit that is provided with osculating element.Therefore above embodiment only supplies to explain the present invention's usefulness, but not limitation of the present invention, category of the present invention and embodiment are limited each claim.
Claims (8)
1. the positioning method of osculating element (2,3) on the electronic component may further comprise the steps:
Said osculating element (2,3) is placed in the aligned spaces;
Said osculating element (2,3) throws light on;
Through having a camera (4) on the first picture plane that extends in parallel with calibration plane, take first image of said osculating element (2,3);
Take second image of said osculating element through No. two cameras (5);
Handle said first image and be determined at first picture point that each said osculating element (2,3) is gone up each said osculating element (2,3), wherein, said each first picture point is the point that is positioned on each said osculating element (2,3);
Handle said second image and be determined at second picture point that each said osculating element (2,3) is gone up each said osculating element (2,3); Wherein, second picture point on said each said osculating element (2,3) and the first picture point correspondence are on the same point of each said osculating element (2,3);
Measure the 3rd picture point on second image through the location map algorithm; It is characterized in that,
Through measuring calibration with first picture point on mask (9) calibration plane and the second picture point pixel coordinate separately z axis scale factor of deriving; Said calibration comprises basic unit that which is provided with treated signature and the multilayer that which is provided with signature with mask (9); The thickness of said multilayer is accurately known, and is pinpoint with respect to the signature in the said basic unit; And
Be determined at the displacement between the above second picture point of said second image and the 3rd picture point; Wherein said the 3rd picture point is obtained on said calibration plane by the said first picture point rectangular projection, and said displacement obtains through the product of the coordinate difference of the z axis scale factor and said second picture point and the 3rd picture point.
2. method according to claim 1 is characterized in that, the inventive method also comprise derive be used to calculate said No. one with No. two cameras (5) between the said location map algorithm of accurate relative position.
3. method according to claim 1 is characterized in that, also comprises measuring the displacement between any two points in the aligned spaces.
4. positioning apparatus that is used for osculating element on the electronic component (2,3) comprises:
Be used for the lighting source (7,8) that illumination is placed on osculating element described in the normed space (2,3) in advance;
A camera (4) and No. two cameras (5);
A said camera (4) and No. two cameras (5) are respectively applied for first and second images of taking said osculating element (2,3);
One treating apparatus, this device is connected with No. two cameras (5) with a said camera (4), in order to obtain each osculating element (2; 3) position of first picture point and each osculating element (2 on said first image; 3) position of second picture point on second image, said first picture point of each said osculating element (2,3) and the second picture point correspondence are at each said osculating element (2; 3) on the same point; On said second image, obtain the position of the 3rd picture point through the location map algorithm, said the 3rd picture point is by the said first picture point rectangular projection gained, and the displacement of measuring said second picture point and the 3rd picture point; It is characterized in that,
Calibration is with mask (9); The image of this mask is by first and second cameras (4; 5) shooting obtains, and said treating apparatus is used to calculate said No. one and No. two cameras (4 from calibrating the image with mask, deriving; 5) the location map algorithm of accurate relative position between; Said calibration comprises that with mask (9) basic unit that which is provided with treated signature and the multilayer that which is provided with signature, the thickness of said multilayer are accurately known, and is pinpoint with respect to the signature in the said basic unit.
5. one kind like the said positioning apparatus that is used for osculating element on the electronic component (2,3) of claim 4, it is characterized in that said treating apparatus obtains said displacement through the product of the coordinate difference of the z axis scale factor and said second picture point and the 3rd picture point.
6. one kind like the said positioning apparatus that is used for osculating element on the electronic component (2,3) of claim 4, it is characterized in that, said treating apparatus is derived the z axis scale factor that is used to measure displacement between said second picture point and the 3rd picture point.
7. one kind like the said positioning apparatus that is used for osculating element on the electronic component (2,3) of claim 5, it is characterized in that said treating apparatus is determined at the displacement between any 2 in the aligned spaces.
8. one kind is used for osculating element (2 on the electronic component as claim 4 is said; 3) positioning apparatus; It is characterized in that said positioning apparatus also comprises No. three cameras (6) that link to each other with said treating apparatus, this camera is used to take the 3rd image of said osculating element; Said the 3rd image has the 4th picture point and the 5th picture point; Wherein said the 5th picture point is the point of the said first picture point rectangular projection gained and is not arranged in said second image that simultaneously, said treating apparatus is measured the displacement between said the 4th picture point and said the 5th picture point.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20082704A MY148204A (en) | 2008-07-21 | 2008-07-21 | A method and means for measuring positions of contact elements of an electronic components |
| MYPI20082704 | 2008-07-21 | ||
| PCT/MY2009/000082 WO2010011124A1 (en) | 2008-07-21 | 2009-06-26 | A method and means for measuring positions of contact elements of an electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102099653A CN102099653A (en) | 2011-06-15 |
| CN102099653B true CN102099653B (en) | 2012-11-14 |
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| CN2009801278488A Active CN102099653B (en) | 2008-07-21 | 2009-06-26 | Method and means for measuring positions of contact elements of an electronic components |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5787258B2 (en) |
| KR (1) | KR101633139B1 (en) |
| CN (1) | CN102099653B (en) |
| MY (1) | MY148204A (en) |
| WO (1) | WO2010011124A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102213581B (en) * | 2010-04-08 | 2016-06-08 | 财团法人工业技术研究院 | object measuring method and system |
| US8691916B2 (en) | 2012-05-07 | 2014-04-08 | Dow Global Technologies Llc | Retortable easy opening seals for film extrusion |
| WO2015181974A1 (en) * | 2014-05-30 | 2015-12-03 | ヤマハ発動機株式会社 | Component-data-generating device, surface-mounting machine, and method for generating component data |
| JP6457295B2 (en) * | 2015-02-19 | 2019-01-23 | 株式会社Ｆｕｊｉ | Parts judgment device |
| DE102016112197B4 (en) * | 2016-07-04 | 2018-05-24 | Asm Assembly Systems Gmbh & Co. Kg | A method and apparatus for stereoscopically determining information regarding the elevation of the front of a port |
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| JP3915033B2 (en) * | 2003-05-15 | 2007-05-16 | 株式会社テクノホロン | Measuring method and measuring apparatus using stereo optical system |
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- 2009-06-26 CN CN2009801278488A patent/CN102099653B/en active Active
- 2009-06-26 WO PCT/MY2009/000082 patent/WO2010011124A1/en active Application Filing
- 2009-06-26 KR KR1020117000873A patent/KR101633139B1/en active IP Right Grant
- 2009-06-26 JP JP2011520004A patent/JP5787258B2/en active Active
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| US5912985A (en) * | 1994-11-08 | 1999-06-15 | Matsushita Electric Industrial Co., Ltd. | Pattern detection method |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20110043593A (en) | 2011-04-27 |
| WO2010011124A1 (en) | 2010-01-28 |
| JP2011528800A (en) | 2011-11-24 |
| MY148204A (en) | 2013-03-15 |
| JP5787258B2 (en) | 2015-09-30 |
| CN102099653A (en) | 2011-06-15 |
| KR101633139B1 (en) | 2016-06-23 |
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