KR100847535B1 - The cover of the vacuum chamber in semiconductor process - Google Patents

The cover of the vacuum chamber in semiconductor process Download PDF

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Publication number
KR100847535B1
KR100847535B1 KR1020070128719A KR20070128719A KR100847535B1 KR 100847535 B1 KR100847535 B1 KR 100847535B1 KR 1020070128719 A KR1020070128719 A KR 1020070128719A KR 20070128719 A KR20070128719 A KR 20070128719A KR 100847535 B1 KR100847535 B1 KR 100847535B1
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South Korea
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cover
vacuum chamber
fastening
coupling
wafer
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KR1020070128719A
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Korean (ko)
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이정용
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세미테크 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A cover opening/closing apparatus of a wafer sensing vacuum chamber for semiconductor process is provided to secure a working space effectively by opening easily and safely a cover with a hinge operation member. A vacuum chamber(100) checks a normal loading state of a wafer and performs a gas removal process. A cover(200) is installed on a sealing part of the top part of the vacuum chamber, in which a packing member is installed and an outer wall is formed. A hinge operation member(300) is formed to lift up and rotate the cover at a certain height. A coupling supporter(210) is installed at the front and rear ends of the cover. A coupling section(211) is protruded horizontally from the outside of the cover. A plurality of coupling grooves(212) are formed at both sides of the coupling section. A coupling member(150), which is rotated by an axis pin formed at an upper side of the vacuum chamber, is coupled with the coupling grooves. A laser transmission member(400) is installed at an intermediate part of the coupling section of the coupling supporter in order to be integrated with the cover.

Description

반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치{THE COVER OF THE VACUUM CHAMBER IN SEMICONDUCTOR PROCESS}Cover opening and closing device for wafer sensing vacuum chamber for semiconductor process {THE COVER OF THE VACUUM CHAMBER IN SEMICONDUCTOR PROCESS}

본 발명은 반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치에 관한 것으로, 더욱 구체적으로는 캐리어 등에 의해 운반 되어진 카세트 내의 웨이퍼를 정렬 및 가스를 제거하는 공정을 수행하는 진공챔버에서 진공챔버내의 진공상태를 유지하기 위한 구성으로 설치되는 덮개를 챔버 내부의 수리 및 청소가 용이하도록 개폐할 수 있게 한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lid opening and closing apparatus for a wafer sensing vacuum chamber for a semiconductor process, and more particularly to a vacuum chamber in a vacuum chamber which performs a process of aligning and removing gas from a wafer in a cassette carried by a carrier or the like. The cover installed in a configuration for maintaining the opening and closing to facilitate the repair and cleaning of the inside of the chamber.

일반적으로 반도체 제조 공정에서 웨이퍼가 해당 공정 작업을 수행하기 위하여 로봇이나 캐리어 등의 운반수단에 의해 운반되어진 웨이퍼가 정상적으로 놓여 있는지 여부를 확인하고 가스를 제거하는 공정을 진공챔버에 의해 수행하고 있다.In general, in a semiconductor manufacturing process, a vacuum chamber performs a process of checking whether a wafer carried by a robot or a carrier, such as a robot or a carrier, is normally placed in the semiconductor manufacturing process and removing gas.

상기 진공챔버(Degas Chamber)는 웨이퍼가 해당 공정 작업을 수행하기 전에공정 예비 환경을 조성시키기 위한 일종의 진공 예비실에 해당된다.The vacuum chamber (Degas Chamber) corresponds to a kind of vacuum preliminary chamber for creating a process preliminary environment before the wafer performs the process operation.

이러한 진공챔버에는 복수의 출입구가 나란히 구비되고 내부에는 웨이퍼를 반입 및 반출시킬 수 있도록 작동되는 로봇 핸들러(Robot Handler)가 각 각 설치되어 있다. 즉, 상기 로봇 핸들러의 이송대 위에 웨이퍼를 올려놓고 핸들러의 작동에 따라 여러 공정 챔버 쪽으로 각 출입구를 통하여 이송대 위에 올려진 웨이퍼가 반입 및 반출될 수 있도록 이송된다. In the vacuum chamber, a plurality of entrances and exits are provided side by side, and a robot handler which is operated to carry in and take out a wafer is provided inside the vacuum chamber. That is, the wafer is placed on the transfer table of the robot handler, and the wafer placed on the transfer table can be carried in and out through each entrance and exit toward the various process chambers according to the operation of the handler.

즉, 도 1 내지 도 4에 도시된 바와 같이 통상의 진공챔버(1) 위에는 덮개(2)가 장착되고, 상기 덮개(2)에 송출수단의 감지센서 및 램프가 각각 장착되는바, 상기 감지센서는 웨이퍼의 이송 상태를 감지하여 반입을 원하는 소정의 공정 챔버 내부로 이송시키는 중요한 역할을 하게 되는 것으로, 상기 감지센서는 레이저 송출부재(3)에서 방출되어 빔(Beam)으로 투과되는 송신센서와 이를 수신하는 수신센서가 한 조를 이루는 구성으로 웨이퍼의 정렬상태를 판단하게 되며, 상기 램프는 웨이퍼가 적정온도를 유지할 수 있도록 되어 있다.That is, as shown in FIGS. 1 to 4, a cover 2 is mounted on the normal vacuum chamber 1, and a detection sensor and a lamp of a sending means are mounted on the cover 2, respectively. Is to play an important role of sensing the transfer state of the wafer into a predetermined process chamber desired to be carried in. The detection sensor is a transmission sensor which is emitted from the laser transmitting member 3 and transmitted through a beam. The receiving sensor is configured to receive a pair of the configuration to determine the alignment of the wafer, the lamp is configured to maintain the wafer at an appropriate temperature.

상기와 같은 진공챔버(1)에서 덮개(2)를 개폐하기 위한 구성은 진공챔버(1) 내부의 진공상태를 유지하기 위하여 진공챔버(1)의 상단부에 패킹부재(4)가 설치되고 외벽(5)이 구비된 밀착단부(6)로 구성되어 덮개(2)를 볼트(7)로 장착하되 덮개를 수직으로 들어올려 장착하거나 개방하는 형태로 되어 있다.In the vacuum chamber 1 as described above for opening and closing the cover 2, the packing member 4 is installed at the upper end of the vacuum chamber 1 in order to maintain the vacuum state inside the vacuum chamber 1 and the outer wall ( 5) is provided with a close end (6) is equipped with a cover (2) with a bolt (7) is to form the form of lifting or mounting the cover vertically.

종래에는 이를 감안하여 덮개(2)에 구비된 손잡이(8)를 작업자가 직접 잡고 수직으로 들어올리는 작업을 수행해야 하는 번거로움이 있고 진공챔버(1)의 내부를 수리 및 청소하기 위해서는 개방된 덮개(2)를 진공챔버(1)의 일측에 직립되게 거치시키게 되므로 작업공간이 협소해지고 안정성이 떨어지게 되었으며, 진공챔버(1)의 상부에 설치되는 레이저 송출부재(3)는 진공챔버(1)의 상단 일측과 덮개에 걸쳐 감지센서의 송출수단인 레이저 송출부재가 직립되게 설치된 구성으로 덮개의 장착 및 개방시에 많은 볼트를 풀거나 조여야 되므로 작업생산성이 크게 떨어지는 문제점이 있었다. Conventionally, in view of this, the worker has to manually grasp the handle 8 provided on the cover 2 and lifts it vertically, and the cover opened to repair and clean the interior of the vacuum chamber 1. Since (2) is mounted upright on one side of the vacuum chamber (1), the working space becomes narrow and the stability is reduced, the laser sending member (3) installed on the upper portion of the vacuum chamber (1) of the vacuum chamber (1) The laser transmitting member, which is the transmitting means of the sensor, is installed upright across the upper side and the cover, so that a lot of bolts need to be loosened or tightened at the time of mounting and opening of the cover.

본 발명은 상술한 문제점을 해소하기 위하여 창작된 것으로서, 본 발명의 목적은 진공챔버 상단의 밀착단부에 재치되는 덮개를 수직으로 장착 및 개방되게함과 아울러 개방된 덮개가 진공챔버 외측으로 안정되게 거치될 수 있도록 하는 덮개 개폐수단이 진공챔버 일측에 설치된 힌지작동부재에 의해 간편하게 이루어지되 진공챔버의 상측에 직립되게 설치되는 레이저 송출부재는 덮개에 일체로 부착시킨 구성으로 덮개의 장착 및 개방을 간편하고 신속하게 할 수 있도록 한 반도체 제조 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치를 제공하는 데 있다.The present invention has been created to solve the above-mentioned problems, the object of the present invention is to mount and open the cover vertically mounted on the close end of the upper end of the vacuum chamber, and the open cover is stably mounted to the outside of the vacuum chamber The cover opening and closing means is easily made by a hinge operating member installed on one side of the vacuum chamber, but the laser transmitting member installed upright on the upper side of the vacuum chamber is attached to the cover and is easy to mount and open. The present invention provides a lid opening and closing device for a wafer sensing vacuum chamber for a semiconductor manufacturing process.

삭제delete

본 발명은 반도체 제조 공정에서 웨이퍼가 해당 공정 작업을 수행하기 위하여 로봇이나 캐리어 등의 운반수단에 의해 운반되어진 웨이퍼가 정상적으로 놓여 있는지 여부를 확인하고 가스를 제거하는 공정을 수행하는 진공챔버와, 상기 진공챔버 선단부 양측과 덮개의 선단부 양측은 덮개를 수직으로 들어올림과 아울러 일정높이에서 측부로 회전시켜 거치시킬수 있도록 하는 힌지작동부재와, 상기 덮개의 선,후단부에 각각 부착된 체결지지대에는 진공챔버의 상면과 일정간극을 두고 덮개의 외측으로 수평돌출된 체결편에는 일측이 개구된 체결홈이 양측에 형성되어 진공챔버 상측에 체결부재가 축핀으로 회전가능하게 설치되어 체결되는 구성과, 상기 덮개 후단부에 부착된 체결지지대의 체결편 중간부에 레이저 송출부재가 장착되어 덮개와 일체로 구성된 반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치를 특징으로 한다.The present invention provides a vacuum chamber for performing a process of removing gas and checking whether or not a wafer normally carried by a robot or a carrier such as a carrier is placed in a semiconductor manufacturing process to perform a corresponding process. Both sides of the chamber tip and both ends of the cover are hinged operation members that allow the cover to be lifted vertically and rotated to a side at a predetermined height, and fastening supports attached to the front and rear ends of the cover respectively include a vacuum chamber. The fastening piece horizontally projected to the outside of the cover with a predetermined gap between the upper surface and the fastening groove having one side is formed on both sides, and the fastening member is rotatably installed on the upper side of the vacuum chamber by the shaft pin, and the rear end of the cover. Laser sending member is installed in the middle of the fastening piece attached to the Detecting wafer composed of a semiconductor process is characterized in a cover opening and closing device of the vacuum chamber.

본 발명에 따른 반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치는 진공챔버 상단의 밀착단부에 재치되는 덮개를 수직으로 장착 및 개방되게함과 아울러 개방된 덮개가 진공챔버 외측으로 안정되게 거치될 수 있도록 하는 덮개 개폐수단이 진공챔버 일측에 설치된 힌지작동부재에 의해 덮개를 간편하고 안전하게 개방할 수 있게 되고 작업공간을 효과적으로 확보할 수 있게 되며, 진공챔버의 상측에 직립되게 설치되는 레이저 송출부재는 별도의 볼트 체결작업을 하지않고 덮개의 개폐작용에 의해 덮개의 장착 및 개방을 간편하고 신속하게 할 수 있는 효과가 있다.The cover opening and closing device of the wafer sensing vacuum chamber for a semiconductor process according to the present invention allows the cover mounted on the close end of the vacuum chamber to be vertically mounted and opened, and the open cover can be stably mounted to the outside of the vacuum chamber. The cover opening and closing means can be easily and safely open the cover by a hinge operating member installed on one side of the vacuum chamber to effectively secure the working space, the laser transmitting member is installed upright on the upper side of the vacuum chamber By opening and closing the cover without bolting work, there is an effect that can be easily and quickly installed and opened the cover.

이하 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다. 그리고 본 발명을 설명함에 있어서, 관련된 공지기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

본 발명의 반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치는, 반도체 제조 공정에서 웨이퍼가 해당 공정 작업을 수행하기 위하여 로봇이나 캐리어 등의 운반수단에 의해 운반되어진 웨이퍼가 정상적으로 놓여 있는지 여부를 확인하고 가스를 제거하는 공정을 수행하는 진공챔버(100)와, 상기 진공챔버(100) 상부에는 덮개(200)가 장착되되 상기 진공챔버(100) 내부의 진공상태를 유지하기 위하여 진공챔버(100)의 상단에 패킹부재(110)가 설치되고 외벽(120)이 구비된 밀착단부(130)에 덮개(200)에 구비된 손잡이(220)를 잡고 수직으로 들어올려 장착하거나 개방하는 것에 있어서, 상기 진공챔버(100)의 선단부 양측과 덮개(200)의 선단부 양측은 덮개(200)를 수직으로 들어올림과 아울러 일정높이에서 측부로 회전시켜 거치시킬수 있도록 하는 힌지작동부재(300)가 설치된 것을 특징으로 한다.The cover opening and closing apparatus of the wafer sensing vacuum chamber for a semiconductor process of the present invention checks whether the wafer conveyed by a conveying means, such as a robot or a carrier, is normally placed in the semiconductor manufacturing process so that the wafer can perform the process work. The vacuum chamber 100 performing the process of removing the cover, and the cover 200 is mounted on the vacuum chamber 100, the upper end of the vacuum chamber 100 to maintain the vacuum state inside the vacuum chamber 100 In the holding member (110) is installed and the outer wall 120 is provided with a grip 220 provided on the cover 200 to the close end 130 is provided in the vertical lifting and mounting or opening, the vacuum chamber ( Hinge operating member 300 to allow both sides of the front end portion 100 and the front end portion of the cover 200 to lift the cover 200 vertically and to rotate the side at a predetermined height to be mounted. Characterized in that installed.

상기 힌지작동부재(300)는; 진공챔버(100)의 양측에 수직으로 설치되며 상부에 장방형의 승강안내구멍(311)이 형성되고 하부에는 축구멍(도시되지 않음)이 형성된 지지대(310)와, 덮개(200)의 상단 양측에 수평으로 부착되며 중간부는 축구멍이 형성된 연결편(323)이 결합되고 선단은 덮개(200)의 외측으로 돌출되고 하향 절곡된 연장부(321)가 구비되며 연장부(321)의 하단 부분은 상기 승강안내구멍(311)에 지지축핀(322)으로 연결되는 작동간(320)과, 상기 지지대(310)의 하부와 작동간(320)의 연결편(323)에 각각 형성되는 축구멍(도시되지 않음)에 고정축핀(331)으로 서로 연결되어 길이가 신축되고 미는작용을 하는 가변완충부재(330)로 이루어져 있다.The hinge operating member 300; Vertically installed on both sides of the vacuum chamber 100, the rectangular lifting guide hole 311 is formed on the upper side and the support 310, the shaft hole (not shown) formed on the lower side, and the upper side of the cover 200 Attached horizontally, the intermediate portion is coupled to the connecting piece 323 is formed with a shaft hole, the front end is provided with an extension portion 321 protruding outwardly of the cover 200, the lower portion of the extension portion 321 is the lifting Shaft holes (not shown) respectively formed in the operation section 320 connected to the guide hole 311 by the support shaft pins 322, and the connecting pieces 323 of the lower portion of the support 310 and the operation section 320, respectively. Is connected to each other by a fixed shaft pin 331 is made of a variable buffer member 330 is stretched and pushed in length.

또, 상기 덮개(200)의 선,후단부는 체결지지대(210)가 각각 부착되고 체결지지대(210)에는 진공챔버(100)의 상면과 일정간극을 두고 덮개(200)의 외측으로 수평돌출된 체결편(211)이 형성되고 체결편(211)에는 일측이 개구된 체결홈(212)이 형성되어 체결부재(150)에 의해 체결이 이루어지게 하되 상기 체결홈(212)에 각각 끼워질 수 있는 위치의 진공챔버(100)상측에 볼트(151)와 너트(152)로 이루어진 체결부재(150)가 축핀(153)으로 회전가능하게 설치되어 체결부재(150)의 볼트(151)를 상기 체결홈(212)방향으로 회전하여 끼우는 수단으로 체결하도록 되어 있으며, 덮개(200)의 체결시에 별도의 보강볼트(160)를 더 사용하여 진공챔버(100)에 체결할 수 있음은 물론이다.In addition, the front and rear ends of the cover 200 are fastened to the fastening support 210 is attached to each of the fastening support 210 is horizontally protruded to the outside of the cover 200 with a predetermined gap with the upper surface of the vacuum chamber 100 on the fastening support 210. A piece 211 is formed and a fastening groove 212 formed at one side thereof is formed in the fastening piece 211 to be fastened by the fastening member 150, but may be fitted into the fastening grooves 212, respectively. A fastening member 150 made of a bolt 151 and a nut 152 is rotatably installed on the vacuum chamber 100 of the axial pin 153 so as to fasten the bolt 151 of the fastening member 150 to the fastening groove ( 212) is rotated in the direction to be fastened by the means, and can be fastened to the vacuum chamber 100 by using a separate reinforcement bolt 160 when the cover 200 is fastened.

상기 덮개(200)의 선단부에 부착되는 체결지지대(210)는 덮개()중간지점에 소폭으로 부착되어 그 양측에 부착되는 작동간(320)의 부착 및 작동에 지장을 주지 않도록 하고, 덮개(200)의 후단부에 부착되는 체결지지대(210)는 장방형으로 구성되어 체결홈(212)이 양측에 형성되도록 함이 바람직하다.Fastening support 210 is attached to the front end of the cover 200 is attached to the cover () middle point slightly so as not to interfere with the attachment and operation of the operation 320 attached to both sides, the cover 200 Fastening support 210 is attached to the rear end of the) is preferably composed of a rectangular fastening groove 212 is formed on both sides.

또, 진공챔버(200)의 상측에 레이저 송출부재(400)가 직립되게 설치되되 송출부재(400)의 하부는 덮개(200)후단에 부착된 체결지지대(210)의 체결편(211)중간부에 레이저 송출부재(400)가 장착되어 덮개(200)와 일체로 구성되도록 한다.In addition, the laser sending member 400 is installed upright on the upper side of the vacuum chamber 200, the lower portion of the sending member 400, the middle portion of the fastening piece 211 of the fastening support 210 attached to the rear end of the cover 200 The laser transmitting member 400 is mounted on the cover 200 so as to be integrated with the cover 200.

이와 같이 된 발명은 진공챔버(100) 내부의 진공상태를 유지하기 위하여 진 공챔버(100)의 상단에 패킹부재(110)가 설치되고 외벽(120)이 구비된 밀착단부(130)에 덮개(200)를 수직으로 들어올려 장착하거나 개방을 하되 본 발명의 개폐수단은 진공챔버(100)의 선단부 양측과 덮개(200)의 선단부 양측을 서로 연결되게 설치된 힌지작동부재(300)에 의해 덮개(200)를 수직으로 들어올림과 아울러 일정높이에서 측부로 회전시켜 거치시킬수 있게 된다.In order to maintain the vacuum state inside the vacuum chamber 100, the present invention has a packing member 110 installed on an upper end of the vacuum chamber 100 and an outer wall 120 provided with a cover (130). 200 is mounted vertically by lifting or opening, but the opening and closing means of the present invention is the cover 200 by the hinge operating member 300 is installed to connect both ends of the front end of the vacuum chamber 100 and both ends of the cover 200 are connected to each other. ) Can be lifted vertically and rotated to a side at a certain height.

즉, 본 발명에서는 진공챔버(100)상단의 밀착단부(130)에 장착되어 있는 덮개(200)를 개방하고자 하는 경우에, 먼저 덮개(200)의 선,후단부에 각각 부착된 체결지지대(210)의 체결편(211)에 체결되어 있는 체결부재(150)의 너트(152)를 풀고 체결홈(212)의 일측 개구부위를 통해 체결상태가 분리되게 회전시켜 장착상태를 해제한 다음 덮개(200)를 수직으로 들어올리게 되면 덮개(200)의 상단 양측에 수평으로 부착된 작동간(320)도 함께 수직상승이 이루어지도록 작동간(320) 선단에 연결된 연장부(321)의 축핀(322)은 지지대(310)의 승강안내구멍(311)상측으로 이동되고 작동간(320)의 중간부의 연결편(323)에 연결된 가변완충부재(330)도 함께 신장(伸長)되어 덮개(200)가 진공챔버(100)상면의 밀착단부(130)에서 이격되어 외벽()높이를 벗어나는 소정높이까지 들어올려지게 되며 이어서 진공챔버(100)의 지지대(310) 상하 에 축설되는 축핀을 축으로 하여 덮개(200)를 외측으로 회전시켜 거치시키는 수단으로 덮개(200)의 개방이 된다.That is, in the present invention, when opening the cover 200 mounted on the close end 130 of the upper end of the vacuum chamber 100, first, the fastening support 210 attached to the line and the rear end of the cover 200, respectively. Loosen the nut 152 of the fastening member 150 fastened to the fastening piece 211 of the) and rotate the fastening state to be separated through an opening on one side of the fastening groove 212 to release the mounting state, and then cover 200 ) Vertically lifts the shaft pin 322 of the extension part 321 connected to the tip of the operation 320 so that the vertical rise is also made between the operation 320 attached to the upper both sides of the top of the cover 200 vertically. The variable shock absorbing member 330 which is moved above the lifting guide hole 311 of the support 310 and connected to the connecting piece 323 of the middle part of the operation 320 is also extended, and the lid 200 is vacuum chamber ( 100) is spaced apart from the close end 130 of the upper surface is lifted up to a predetermined height outside the height of the outer wall () Standing is the opening of the means by which the chukpin chukseol to the support 310, the top and bottom of the vacuum chamber 100 through the shaft to rotate the cover 200 in the outer cover 200.

이때, 가변완충부재(330)는 신축작용으로 덮개(200)가 원활하게 회전되고 덮 개(200)가 정지되는 위치에서는 지속적으로 밀어주는 작용으로 덮개(200)가 정위치에 안정적으로 놓여지도록 한다.At this time, the variable buffer member 330 is elastically rotated so that the cover 200 is smoothly rotated and the cover 200 is stopped in a position to continuously push the cover 200 to be stably placed in place. .

상기와 같이 덮개(200)가 개방된 상태에서 진공챔버(100)의 내부를 수리하거나 청소를 하게 되는 것으로, 이렇게 덮개(200)를 힌지작동부재(300)에 의해 간편하고 안전하게 개방할 수 있게 되고 작업공간을 효과적으로 확보할 수 있게 된다.By repairing or cleaning the interior of the vacuum chamber 100 in a state in which the cover 200 is opened as described above, the cover 200 can be easily and safely opened by the hinge operating member 300. It is possible to effectively secure a workspace.

그리고 상기 개방된 덮개(200)를 진공챔버(100)상단의 밀착단부(130)에 장착할 때에는 상기 덮개(200)를 개방하는 것과 역방향으로 진행한 다음 덮개(200)의 선,후단부에 각각 부착된 체결지지대(210)의 체결편(211)에 체결부재(150)를 체결함으로서 장착이 완료된다.In addition, when the open cover 200 is mounted on the close end 130 of the upper end of the vacuum chamber 100, the cover 200 is moved in the opposite direction to the opening of the cover 200. Mounting is completed by fastening the fastening member 150 to the fastening piece 211 of the fastening support 210 attached.

상기 진공챔버(100)의 상측에 직립되게 설치되는 레이저 송출부재(400)는 덮개(200)후단부에 부착된 체결지지대(210)의 체결편(211)중간부에 장착되어 덮개(200)와 일체로 구성되어 있으므로 별도의 볼트 체결작업이 필요치 않고 덮개(200)의 장착 및 개방을 간편하고 신속하게 할 수 있게 된다.The laser transmitting member 400 which is installed upright on the upper side of the vacuum chamber 100 is mounted to the middle of the fastening piece 211 of the fastening support 210 attached to the rear end of the cover 200 and the cover 200. Since it is integrally configured, it is possible to easily and quickly install and open the cover 200 without a separate bolt fastening operation.

이상에서 본 발명은 상기 실시예를 참고하여 설명하였지만 본 발명의 기술사상범위내에서 다양한 변형실시가 가능함은 물론이다.In the above, the present invention has been described with reference to the above embodiments, but various modifications are possible within the technical scope of the present invention.

도 1은 종래의 진공챔버 구성을 나타낸 사시도1 is a perspective view showing a conventional vacuum chamber configuration

도 2는 종래의 진공챔버 구성을 나타낸 전면도2 is a front view showing a conventional vacuum chamber configuration

도 3의(가)(나)(다)(라)는 종래의 진공챔버에서 덮개의 개방상태를 단계별로 나타낸 전면도3 (a) (b) (d) is a front view showing the opening state of a cover step by step in a conventional vacuum chamber.

도 4는 진공챔버에서 덮개가 분리된 상태를 보인 평면예시도Figure 4 is a plan view showing a state in which the cover is removed from the vacuum chamber

도 5는 본 발명의 개폐장치 구성을 보인 진공챔버 사시도Figure 5 is a perspective view of the vacuum chamber showing the opening and closing device configuration of the present invention

도 6은 본 발명의 개폐장치 구성을 보인 진공챔버 전면도Figure 6 is a front view of the vacuum chamber showing the opening and closing device configuration of the present invention

도 7은 본 발명의 구성을 나타낸 일부절개 전면도Figure 7 is a partial cutaway front view showing the configuration of the present invention

도 8은 본 발명에 의한 덮개 개방시의 수직으로 들어올린상태 전면 예시도8 is a front view illustrating a vertically lifted state at the time of opening the cover according to the present invention

도 9는 본 발명에 의한 개방된 덮개의 거치상태 전면 예시도9 is a front view of the mounting state of the open cover according to the present invention

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

100: 진공챔버 110 : 패킹부재100: vacuum chamber 110: packing member

120 : 외벽 130 : 밀착단부120: outer wall 130: close end

150 : 체결부재 200: 덮개150: fastening member 200: cover

210: 체결지지대 211 : 체결편210: fastening support 211: fastening piece

212 : 체결홈 300: 힌지작동부재212: fastening groove 300: hinge operating member

310 : 지지대 311 : 승강안내구멍310: support 311: lifting guide hole

320 : 작동간 321 : 연장부320: Between operations 321: Extension part

322 : 지지축핀 323 : 연결편322: support shaft pin 323: connecting piece

330 : 가변완충부재 331 : 고정축핀330: variable buffer member 331: fixed shaft pin

400 : 송출부재400: sending member

Claims (4)

삭제delete 삭제delete 삭제delete 반도체 제조 공정에서 웨이퍼가 해당 공정 작업을 수행하기 위하여 운반수단에 의해 운반되어진 웨이퍼가 정상적으로 놓여 있는지 여부를 확인하고 가스를 제거하는 공정을 수행하는 진공챔버(100)와,  In the semiconductor manufacturing process, the vacuum chamber 100 to check whether the wafer carried by the conveying means is normally placed in order to perform the process operation and to remove the gas, and the vacuum chamber 100, 상기 진공챔버(100) 상부에는 덮개(200)가 장착되되 상기 진공챔버(100) 내부의 진공상태를 유지하기 위하여 진공챔버(100)의 상단에 패킹부재(110)가 설치되고 외벽(120)이 구비된 밀착단부(130)에 덮개(200)를 수직으로 들어올려 장착하거나 개방이 이루어지도록 하되 상기 진공챔버(100)의 선단부 양측과 덮개(200)의 선단부 양측은 덮개(200)를 수직으로 들어올림과 아울러 일정높이에서 측부로 회전시켜 거치시킬수 있도록 하는 힌지작동부재(300)가 설치된 구성과,The cover 200 is mounted on the vacuum chamber 100, but a packing member 110 is installed on the top of the vacuum chamber 100 to maintain a vacuum state inside the vacuum chamber 100, and an outer wall 120 is provided. The cover 200 is mounted vertically on the provided close end 130 or opened to be opened, but both ends of the vacuum chamber 100 and both ends of the cover 200 lift the cover 200 vertically. In addition to the configuration, the hinge operating member 300 is installed so that it can be mounted by rotating to the side at a certain height, 상기 덮개(200)의 선,후단부는 체결지지대(210)가 각각 부착되고 체결지지대(210)에는 진공챔버(100)의 상면과 일정간극을 두고 덮개(200)의 외측으로 수평돌출된 체결편(211)이 형성되고 체결편(211)에는 일측이 개구된 체결홈(212)이 양측에 형성되어 체결부재(150)에 의해 체결이 이루어지게 하되 상기 체결홈(212)에 각각 끼워질 수 있는 위치의 진공챔버(100)상측에 체결부재(150)가 축핀(153)으로 회전가능하게 설치되어 체결되는 구성과,The front and rear ends of the cover 200 are attached to the fastening support 210, respectively, and the fastening piece 210 protrudes horizontally to the outside of the cover 200 with a predetermined gap between the upper surface of the vacuum chamber 100 and the fastening support 210 ( 211 is formed and a fastening groove 212 having one side open on the fastening piece 211 is formed on both sides to be fastened by the fastening member 150, but may be fitted into the fastening grooves 212, respectively. And a fastening member 150 is rotatably installed on the vacuum chamber 100 of the axial pin 153 and fastened, 상기 덮개(200)후단부에 부착된 체결지지대(210)의 체결편(211)중간부에 레이저 송출부재(400)가 장착되어 덮개(200)와 일체로 구성된 것을 특징으로 하는 반도체 공정용 웨이퍼 감지 진공챔버의 덮개 개폐장치Laser detection member 400 is mounted on the middle of the fastening piece 211 of the fastening support 210 attached to the rear end of the cover 200, wafer detection for a semiconductor process, characterized in that integrally configured with the cover 200 Cover opening and closing device of the vacuum chamber
KR1020070128719A 2007-12-12 2007-12-12 The cover of the vacuum chamber in semiconductor process KR100847535B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190046520A (en) * 2017-10-26 2019-05-07 에스케이하이닉스 주식회사 Lid fixing unit and substrate processing apparatus
CN110527946A (en) * 2019-09-04 2019-12-03 苏州沃盾纳米科技有限公司 Coating apparatus

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Publication number Priority date Publication date Assignee Title
KR100667165B1 (en) * 2004-11-08 2007-01-12 삼성전자주식회사 Processing chamber for making semiconductor
KR20070041965A (en) * 2005-10-17 2007-04-20 주식회사 에이디피엔지니어링 Apparatus for vacuum processing

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Publication number Priority date Publication date Assignee Title
KR100667165B1 (en) * 2004-11-08 2007-01-12 삼성전자주식회사 Processing chamber for making semiconductor
KR20070041965A (en) * 2005-10-17 2007-04-20 주식회사 에이디피엔지니어링 Apparatus for vacuum processing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190046520A (en) * 2017-10-26 2019-05-07 에스케이하이닉스 주식회사 Lid fixing unit and substrate processing apparatus
KR102389748B1 (en) * 2017-10-26 2022-04-25 에스케이하이닉스 주식회사 Lid fixing unit and substrate processing apparatus
CN110527946A (en) * 2019-09-04 2019-12-03 苏州沃盾纳米科技有限公司 Coating apparatus
CN110527946B (en) * 2019-09-04 2024-03-19 立讯电子科技（昆山）有限公司 Coating device

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