KR100840109B1 - 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자 - Google Patents

무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자 Download PDF

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KR100840109B1
KR100840109B1 KR1020060112621A KR20060112621A KR100840109B1 KR 100840109 B1 KR100840109 B1 KR 100840109B1 KR 1020060112621 A KR1020060112621 A KR 1020060112621A KR 20060112621 A KR20060112621 A KR 20060112621A KR 100840109 B1 KR100840109 B1 KR 100840109B1
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tape
glass
composition
conductor
dielectric
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Expired - Fee Related
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Korean (ko)
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KR20070052206A (ko
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케네쓰 웨렌 행
쿠마란 마니칸탄 네어
마크 프레데릭 맥콤스
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이 아이 듀폰 디 네모아 앤드 캄파니
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus
    • C03C3/19Silica-free oxide glass compositions containing phosphorus containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus
    • C03C3/21Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/253Silica-free oxide glass compositions containing germanium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020060112621A 2005-11-16 2006-11-15 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자 Expired - Fee Related KR100840109B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73728005P 2005-11-16 2005-11-16
US60/737,280 2005-11-16
US11/543,742 2006-10-05
US11/543,742 US7687417B2 (en) 2005-11-16 2006-10-05 Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020080048587A Division KR100918769B1 (ko) 2005-11-16 2008-05-26 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자

Publications (2)

Publication Number Publication Date
KR20070052206A KR20070052206A (ko) 2007-05-21
KR100840109B1 true KR100840109B1 (ko) 2008-06-19

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Family Applications (3)

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KR1020060112621A Expired - Fee Related KR100840109B1 (ko) 2005-11-16 2006-11-15 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자
KR1020080048587A Expired - Fee Related KR100918769B1 (ko) 2005-11-16 2008-05-26 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자
KR1020090038918A Ceased KR20090051027A (ko) 2005-11-16 2009-05-04 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프 조성물 및 저온 동시소성 세라믹 소자

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020080048587A Expired - Fee Related KR100918769B1 (ko) 2005-11-16 2008-05-26 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프조성물 및 저온 동시소성 세라믹 소자
KR1020090038918A Ceased KR20090051027A (ko) 2005-11-16 2009-05-04 무연 유리, 후막 페이스트, 및 그로부터 제조된 테이프 조성물 및 저온 동시소성 세라믹 소자

Country Status (6)

Country Link
US (4) US7687417B2 (https=)
EP (1) EP1787963B1 (https=)
JP (1) JP5022675B2 (https=)
KR (3) KR100840109B1 (https=)
CN (1) CN1974450B (https=)
TW (1) TW200804226A (https=)

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US20090316060A1 (en) * 2008-06-18 2009-12-24 3M Innovative Properties Company Conducting film or electrode with improved optical and electrical performance
EP2411987A4 (en) * 2009-03-23 2015-01-07 Sba Materials Inc NOVEL DIELECTRIC OXIDE FILMS AND MANUFACTURING METHOD THEREOF
KR101141499B1 (ko) * 2009-10-09 2012-05-08 연세대학교 산학협력단 세라믹기판용 유리 조성물
US8633858B2 (en) * 2010-01-29 2014-01-21 E I Du Pont De Nemours And Company Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
CN101923911B (zh) * 2010-04-27 2011-11-02 电子科技大学 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法
WO2012161612A1 (en) * 2011-05-23 2012-11-29 Autonomous Non-Commercial Organization "Research Institute "Sitronics Labs"" Electronically beam steerable antenna device
EP2715788A1 (en) 2011-06-01 2014-04-09 E. I. Du Pont de Nemours and Company Low temperature co-fired ceramic structure for high frequency applications and process for making same
US20130052433A1 (en) 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
CN103936401B (zh) * 2013-11-25 2016-08-17 云南银峰新材料有限公司 一种低介电常数微波介质陶瓷材料的制备方法
WO2016208851A1 (ko) * 2015-06-23 2016-12-29 주식회사 베이스 Led용 유리의 제조 방법
CN105006611A (zh) * 2015-06-29 2015-10-28 南京理工大学 微波毫米波高抑制带通滤波器组
CN105070984A (zh) * 2015-06-29 2015-11-18 南京理工大学 基于ltcc与dgs技术的shf波段高性能滤波器组
WO2017010730A1 (ko) * 2015-07-14 2017-01-19 주식회사 베이스 유리 프릿을 활용한 색변환 소재를 포함하는 led 칩 스케일 패키지 및 그 제조방법
CN105006618A (zh) * 2015-08-07 2015-10-28 南京理工大学 一种基于ltcc和dgs的微型多路滤波器组
TWI585793B (zh) * 2015-11-18 2017-06-01 Prosperity Dielectrics Co Ltd 低溫共燒陶瓷微波介電陶瓷及其製造方法
CN106946567B (zh) * 2017-03-10 2019-10-11 南通通州湾新材料科技有限公司 一种铁铝金属间化合物与ZrO2复相材料手机陶瓷背板的制备方法
CN107134614B (zh) * 2017-05-05 2019-05-21 电子科技大学 一种多层陶瓷微波带通滤波器
CN107056312B (zh) * 2017-06-05 2019-10-11 武汉科技大学 一种硅质可塑料及其制备方法
CN107324808A (zh) * 2017-07-01 2017-11-07 朱胜利 无机非金属材料的增强方法及用于增强碳化硅陶瓷的方法
CN107285809B (zh) * 2017-08-07 2020-06-16 钱炜文 一种环保型硅藻土组合物及其应用
US10511099B2 (en) * 2017-10-09 2019-12-17 Aeroantenna Technology, Inc. Dual-band shaped-pattern quadrifilar helix antenna
JP6787955B2 (ja) * 2018-08-01 2020-11-18 双信電機株式会社 フィルタ
US11524918B2 (en) 2018-11-26 2022-12-13 Owens Corning Intellectual Capital, Llc High performance fiberglass composition with improved specific modulus
PL3887329T3 (pl) 2018-11-26 2024-06-03 Owens Corning Intellectual Capital, Llc Wysokowydajna kompozycja włókna szklanego o ulepszonym module sprężystości
CN109687065B (zh) * 2018-12-24 2020-11-06 瑞声精密制造科技(常州)有限公司 Ltcc滤波器
CN110357419B (zh) * 2019-07-18 2022-05-06 成都宏科电子科技有限公司 一种玻璃组合物和毫米波低温共烧陶瓷材料及其制备方法
CN111276782A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的宽带带通滤波器
CN111276776A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的新型带通滤波器
CN113213949B (zh) * 2021-03-10 2022-11-01 安徽华封电子科技有限公司 一种可电镀或化学镀的高频低损耗ltcc基板材料及其制备方法

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EP1369397A1 (en) * 2002-06-04 2003-12-10 E.I. Dupont De Nemours And Company High thermal expansion glass and tape composition

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US6147019A (en) 1998-01-23 2000-11-14 E. I. Du Pont De Nemours And Company Borate glass based ceramic tape
DE10102296C1 (de) * 2001-01-19 2002-02-21 Schott Glas Gläser mit hohem spezifischen Elastizitätsmodul und deren Verwendung
EP1369397A1 (en) * 2002-06-04 2003-12-10 E.I. Dupont De Nemours And Company High thermal expansion glass and tape composition

Also Published As

Publication number Publication date
KR20090051027A (ko) 2009-05-20
JP5022675B2 (ja) 2012-09-12
JP2007176787A (ja) 2007-07-12
KR20070052206A (ko) 2007-05-21
CN1974450B (zh) 2014-11-19
KR100918769B1 (ko) 2009-09-24
EP1787963A2 (en) 2007-05-23
US20080023216A1 (en) 2008-01-31
TW200804226A (en) 2008-01-16
EP1787963B1 (en) 2013-07-17
US20070111876A1 (en) 2007-05-17
EP1787963A3 (en) 2007-09-05
US7687417B2 (en) 2010-03-30
US20120201009A1 (en) 2012-08-09
CN1974450A (zh) 2007-06-06
KR20080050381A (ko) 2008-06-05
US20090110939A1 (en) 2009-04-30

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PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301