JP5022675B2 - 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス - Google Patents

鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス Download PDF

Info

Publication number
JP5022675B2
JP5022675B2 JP2006309207A JP2006309207A JP5022675B2 JP 5022675 B2 JP5022675 B2 JP 5022675B2 JP 2006309207 A JP2006309207 A JP 2006309207A JP 2006309207 A JP2006309207 A JP 2006309207A JP 5022675 B2 JP5022675 B2 JP 5022675B2
Authority
JP
Japan
Prior art keywords
tape
glass
composition
conductor
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006309207A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007176787A (ja
JP2007176787A5 (https=
Inventor
ウォーレン ハング ケニス
マニカンタン ナイル クマラン
フレデリック マコームズ マーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2007176787A publication Critical patent/JP2007176787A/ja
Publication of JP2007176787A5 publication Critical patent/JP2007176787A5/ja
Application granted granted Critical
Publication of JP5022675B2 publication Critical patent/JP5022675B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/19—Silica-free oxide glass compositions containing phosphorus containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/253—Silica-free oxide glass compositions containing germanium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2006309207A 2005-11-16 2006-11-15 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス Expired - Fee Related JP5022675B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73728005P 2005-11-16 2005-11-16
US60/737,280 2005-11-16
US11/543,742 2006-10-05
US11/543,742 US7687417B2 (en) 2005-11-16 2006-10-05 Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom

Publications (3)

Publication Number Publication Date
JP2007176787A JP2007176787A (ja) 2007-07-12
JP2007176787A5 JP2007176787A5 (https=) 2009-11-26
JP5022675B2 true JP5022675B2 (ja) 2012-09-12

Family

ID=37734924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006309207A Expired - Fee Related JP5022675B2 (ja) 2005-11-16 2006-11-15 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス

Country Status (6)

Country Link
US (4) US7687417B2 (https=)
EP (1) EP1787963B1 (https=)
JP (1) JP5022675B2 (https=)
KR (3) KR100840109B1 (https=)
CN (1) CN1974450B (https=)
TW (1) TW200804226A (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090316060A1 (en) * 2008-06-18 2009-12-24 3M Innovative Properties Company Conducting film or electrode with improved optical and electrical performance
EP2411987A4 (en) * 2009-03-23 2015-01-07 Sba Materials Inc NOVEL DIELECTRIC OXIDE FILMS AND MANUFACTURING METHOD THEREOF
KR101141499B1 (ko) * 2009-10-09 2012-05-08 연세대학교 산학협력단 세라믹기판용 유리 조성물
US8633858B2 (en) * 2010-01-29 2014-01-21 E I Du Pont De Nemours And Company Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
CN101923911B (zh) * 2010-04-27 2011-11-02 电子科技大学 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法
WO2012161612A1 (en) * 2011-05-23 2012-11-29 Autonomous Non-Commercial Organization "Research Institute "Sitronics Labs"" Electronically beam steerable antenna device
EP2715788A1 (en) 2011-06-01 2014-04-09 E. I. Du Pont de Nemours and Company Low temperature co-fired ceramic structure for high frequency applications and process for making same
US20130052433A1 (en) 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
CN103936401B (zh) * 2013-11-25 2016-08-17 云南银峰新材料有限公司 一种低介电常数微波介质陶瓷材料的制备方法
WO2016208851A1 (ko) * 2015-06-23 2016-12-29 주식회사 베이스 Led용 유리의 제조 방법
CN105006611A (zh) * 2015-06-29 2015-10-28 南京理工大学 微波毫米波高抑制带通滤波器组
CN105070984A (zh) * 2015-06-29 2015-11-18 南京理工大学 基于ltcc与dgs技术的shf波段高性能滤波器组
WO2017010730A1 (ko) * 2015-07-14 2017-01-19 주식회사 베이스 유리 프릿을 활용한 색변환 소재를 포함하는 led 칩 스케일 패키지 및 그 제조방법
CN105006618A (zh) * 2015-08-07 2015-10-28 南京理工大学 一种基于ltcc和dgs的微型多路滤波器组
TWI585793B (zh) * 2015-11-18 2017-06-01 Prosperity Dielectrics Co Ltd 低溫共燒陶瓷微波介電陶瓷及其製造方法
CN106946567B (zh) * 2017-03-10 2019-10-11 南通通州湾新材料科技有限公司 一种铁铝金属间化合物与ZrO2复相材料手机陶瓷背板的制备方法
CN107134614B (zh) * 2017-05-05 2019-05-21 电子科技大学 一种多层陶瓷微波带通滤波器
CN107056312B (zh) * 2017-06-05 2019-10-11 武汉科技大学 一种硅质可塑料及其制备方法
CN107324808A (zh) * 2017-07-01 2017-11-07 朱胜利 无机非金属材料的增强方法及用于增强碳化硅陶瓷的方法
CN107285809B (zh) * 2017-08-07 2020-06-16 钱炜文 一种环保型硅藻土组合物及其应用
US10511099B2 (en) * 2017-10-09 2019-12-17 Aeroantenna Technology, Inc. Dual-band shaped-pattern quadrifilar helix antenna
JP6787955B2 (ja) * 2018-08-01 2020-11-18 双信電機株式会社 フィルタ
US11524918B2 (en) 2018-11-26 2022-12-13 Owens Corning Intellectual Capital, Llc High performance fiberglass composition with improved specific modulus
PL3887329T3 (pl) 2018-11-26 2024-06-03 Owens Corning Intellectual Capital, Llc Wysokowydajna kompozycja włókna szklanego o ulepszonym module sprężystości
CN109687065B (zh) * 2018-12-24 2020-11-06 瑞声精密制造科技(常州)有限公司 Ltcc滤波器
CN110357419B (zh) * 2019-07-18 2022-05-06 成都宏科电子科技有限公司 一种玻璃组合物和毫米波低温共烧陶瓷材料及其制备方法
CN111276782A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的宽带带通滤波器
CN111276776A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的新型带通滤波器
CN113213949B (zh) * 2021-03-10 2022-11-01 安徽华封电子科技有限公司 一种可电镀或化学镀的高频低损耗ltcc基板材料及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4547467A (en) * 1983-06-22 1985-10-15 Burroughs Corporation Dielectric composition and devices using it
JPS60221338A (ja) * 1984-04-12 1985-11-06 Ohara Inc 光学ガラス
US4655864A (en) * 1985-03-25 1987-04-07 E. I. Du Pont De Nemours And Company Dielectric compositions and method of forming a multilayer interconnection using same
US4830988A (en) * 1986-10-02 1989-05-16 General Electric Company Dielectric inks for multilayer copper circuits
US4861646A (en) * 1987-08-13 1989-08-29 Ceramics Process Systems Corp. Co-fired metal-ceramic package
US5258335A (en) 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5164342A (en) 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
TW524786B (en) 1998-01-23 2003-03-21 Du Pont Glass composition, castable dielectric composition and tape composition made therewith
US6228788B1 (en) * 1998-08-21 2001-05-08 Advanced Ceramic X Corporation High-frequency ceramic inductor formulation
FR2793241B1 (fr) * 1999-05-06 2002-03-08 Corning Inc Composition de verre borate dope a l erbium
JP4689019B2 (ja) * 1999-12-28 2011-05-25 石塚硝子株式会社 抗菌性付与用ガラス組成物、及びそれを用いた抗菌性高分子複合材料、抗菌性高分子複合材料成形体
JP2004515365A (ja) * 2000-12-15 2004-05-27 エグシル テクノロジー リミテッド 半導体材料のレーザー加工
DE10102296C1 (de) 2001-01-19 2002-02-21 Schott Glas Gläser mit hohem spezifischen Elastizitätsmodul und deren Verwendung
US6835682B2 (en) 2002-06-04 2004-12-28 E. I. Du Pont De Nemours And Company High thermal expansion glass and tape composition
US6841493B2 (en) * 2002-06-04 2005-01-11 E. I. Du Pont De Nemours And Company High K glass and tape composition for use at high frequency
DE102004026433A1 (de) * 2004-05-29 2005-12-22 Schott Ag Nanoglaspulver und deren Verwendung

Also Published As

Publication number Publication date
KR20090051027A (ko) 2009-05-20
JP2007176787A (ja) 2007-07-12
KR20070052206A (ko) 2007-05-21
CN1974450B (zh) 2014-11-19
KR100840109B1 (ko) 2008-06-19
KR100918769B1 (ko) 2009-09-24
EP1787963A2 (en) 2007-05-23
US20080023216A1 (en) 2008-01-31
TW200804226A (en) 2008-01-16
EP1787963B1 (en) 2013-07-17
US20070111876A1 (en) 2007-05-17
EP1787963A3 (en) 2007-09-05
US7687417B2 (en) 2010-03-30
US20120201009A1 (en) 2012-08-09
CN1974450A (zh) 2007-06-06
KR20080050381A (ko) 2008-06-05
US20090110939A1 (en) 2009-04-30

Similar Documents

Publication Publication Date Title
JP5022675B2 (ja) 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス
EP1369402B2 (en) Tape composition for constrained sintering of low temperature co-fired ceramic
JP3890321B2 (ja) 高熱膨張ガラスおよびテープ組成物
JP2006225252A (ja) 擬似対称に構成された低温共焼成セラミック構造体の強制焼結法
US20060228585A1 (en) Thick film paste via fill composition for use in LTCC applications
JP4926460B2 (ja) 擬似対称に構成された低温共焼成セラミック構造体の強制焼結法
KR100517846B1 (ko) 고 주파수에서 사용하기 위한 고 ｋ 유리 및 테이프 조성물
JP2006225251A (ja) 擬似対称に構成された低温共焼成セラミック構造体の強制焼結法
CN103748048B (zh) 用于低k、低温共烧复合材料（ltcc）带材的组合物以及由此形成的低收缩、多层ltcc结构
EP1509479B1 (en) Ltcc tape composition
HK1060722B (en) High thermal expansion glass and tape composition
HK1060872B (en) High k glass and tape composition for use at high frequency

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091009

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091009

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110922

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110930

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20111221

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20111227

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120229

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120402

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120518

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120618

R150 Certificate of patent or registration of utility model

Ref document number: 5022675

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees