KR100815503B1 - 물체의 기복을 측정하기 위한 방법 및 시스템 - Google Patents

물체의 기복을 측정하기 위한 방법 및 시스템 Download PDF

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Publication number
KR100815503B1
KR100815503B1 KR1020027000555A KR20027000555A KR100815503B1 KR 100815503 B1 KR100815503 B1 KR 100815503B1 KR 1020027000555 A KR1020027000555 A KR 1020027000555A KR 20027000555 A KR20027000555 A KR 20027000555A KR 100815503 B1 KR100815503 B1 KR 100815503B1
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South Korea
Prior art keywords
connectors
phase
substrate
grid
pixel
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Expired - Lifetime
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KR20020060151A (ko
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콜롬브아레인
캔틴미첼
니키타인알렉산더
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솔비젼 인코포레이티드
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measuring Arrangements Characterized By The Use Of Fluids (AREA)
  • Image Processing (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
KR1020027000555A 1999-07-14 2000-07-14 물체의 기복을 측정하기 위한 방법 및 시스템 Expired - Lifetime KR100815503B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA2,277,855 1999-07-14
CA002277855A CA2277855A1 (fr) 1999-07-14 1999-07-14 Methode et systeme de mesure de la hauteur des billes de soudure d'un circuit imprime

Related Child Applications (1)

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KR1020077009430A Division KR100858521B1 (ko) 1999-07-14 2000-07-14 검사를 이용하여 제품을 생산하는 방법

Publications (2)

Publication Number Publication Date
KR20020060151A KR20020060151A (ko) 2002-07-16
KR100815503B1 true KR100815503B1 (ko) 2008-03-20

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KR1020027000555A Expired - Lifetime KR100815503B1 (ko) 1999-07-14 2000-07-14 물체의 기복을 측정하기 위한 방법 및 시스템
KR1020077009430A Expired - Lifetime KR100858521B1 (ko) 1999-07-14 2000-07-14 검사를 이용하여 제품을 생산하는 방법

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KR1020077009430A Expired - Lifetime KR100858521B1 (ko) 1999-07-14 2000-07-14 검사를 이용하여 제품을 생산하는 방법

Country Status (13)

Country Link
US (2) USRE42899E1 (enExample)
EP (1) EP1192414B1 (enExample)
JP (1) JP4112858B2 (enExample)
KR (2) KR100815503B1 (enExample)
CN (1) CN1181313C (enExample)
AT (1) ATE266188T1 (enExample)
AU (1) AU6143300A (enExample)
CA (3) CA2277855A1 (enExample)
DE (1) DE60010462T2 (enExample)
HK (1) HK1047470B (enExample)
IL (2) IL147607A0 (enExample)
TW (1) TW544509B (enExample)
WO (1) WO2001006210A1 (enExample)

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WO2010132794A3 (en) * 2009-05-15 2011-03-10 University Of Delaware Method and apparatus for measuring microrelief of an object

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CA2301822A1 (fr) 2000-03-24 2001-09-24 9071 9410 Quebec Inc. Projection simultanee de plusieurs patrons avec acquisition simultanee pour l'inspection d'objets en trois dimensions
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US7659253B2 (en) 2002-02-22 2010-02-09 Shire Llc Abuse-resistant amphetamine prodrugs
US7700561B2 (en) 2002-02-22 2010-04-20 Shire Llc Abuse-resistant amphetamine prodrugs
KR100483345B1 (ko) * 2002-06-18 2005-04-15 한국과학기술연구원 이중파장 영사식 모아레 기반 형상측정장치 및 레지스트레이션을 이용한 멀티헤드 시스템용 자동 캘리브레이션 방법
US20040130730A1 (en) * 2002-11-21 2004-07-08 Michel Cantin Fast 3D height measurement method and system
BRPI0410792B8 (pt) 2003-05-29 2021-05-25 New River Pharmaceuticals Inc compostos de anfetamina resistentes à dependencia
KR20060052699A (ko) * 2003-06-11 2006-05-19 솔비젼 인코포레이티드 감도 및 다이내믹 레인지가 증가된 3ｄ 및 2ｄ 측정장치 및방법
US7433058B2 (en) * 2004-07-12 2008-10-07 Solvision Inc. System and method for simultaneous 3D height measurements on multiple sides of an object
US20060072122A1 (en) * 2004-09-30 2006-04-06 Qingying Hu Method and apparatus for measuring shape of an object
US7551272B2 (en) * 2005-11-09 2009-06-23 Aceris 3D Inspection Inc. Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object
US7830528B2 (en) * 2005-12-14 2010-11-09 Koh Young Technology, Inc. 3D image measuring apparatus and method thereof
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US20080117438A1 (en) * 2006-11-16 2008-05-22 Solvision Inc. System and method for object inspection using relief determination
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
CN101918789A (zh) * 2007-09-16 2010-12-15 梅厄·本-利维 利用周期图案照明和tdi的成像测量系统
US8059280B2 (en) 2008-01-31 2011-11-15 Cyberoptics Corporation Method for three-dimensional imaging using multi-phase structured light
CN201974159U (zh) * 2008-04-01 2011-09-14 感知器公司 包括mems反射镜的轮廓传感器
US9170097B2 (en) * 2008-04-01 2015-10-27 Perceptron, Inc. Hybrid system
US8559699B2 (en) 2008-10-10 2013-10-15 Roboticvisiontech Llc Methods and apparatus to facilitate operations in image based systems
JP4715944B2 (ja) * 2009-04-03 2011-07-06 オムロン株式会社 三次元形状計測装置、三次元形状計測方法、および三次元形状計測プログラム
TWI432699B (zh) * 2009-07-03 2014-04-01 Koh Young Tech Inc 用於檢查測量物件之方法
US8855403B2 (en) * 2010-04-16 2014-10-07 Koh Young Technology Inc. Method of discriminating between an object region and a ground region and method of measuring three dimensional shape by using the same
KR101340336B1 (ko) 2010-04-29 2013-12-13 주식회사 미르기술 비전검사장치
GB2481459B (en) * 2010-06-25 2017-05-03 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E V Capturing a surface structure of an object surface
JP5683002B2 (ja) * 2011-02-01 2015-03-11 Ｊｕｋｉオートメーションシステムズ株式会社 ３次元測定装置、３次元測定方法及びプログラム
EP2573508B1 (en) * 2011-03-14 2014-01-29 Panasonic Corporation Solder height detection method and solder height detection device
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board
US10126252B2 (en) 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
CN103673934A (zh) * 2013-12-31 2014-03-26 中国矿业大学 一种基于网格投影的pcb板平整度检测方法
CN104101611A (zh) * 2014-06-06 2014-10-15 华南理工大学 一种类镜面物体表面光学成像装置及其成像方法
BR112018002995A2 (pt) * 2015-08-17 2018-09-25 Qso Interferometer Systems Ab método e aparelho para derivar uma topografia de uma superfície de objeto
CN107356214A (zh) * 2017-08-23 2017-11-17 苏州岸肯电子科技有限公司 一种玻璃平整度检测装置
US10701259B2 (en) * 2017-09-15 2020-06-30 Quality Vision International Inc. Video measuring system with dual-acting reticle projector for focusing and alignment
KR102632562B1 (ko) * 2018-08-22 2024-02-02 삼성전자주식회사 Si 기반 검사 장치와 검사 방법, 및 그 검사 방법을 포함한 반도체 소자 제조방법
CN112866549B (zh) * 2019-11-12 2022-04-12 Oppo广东移动通信有限公司 图像处理方法和装置、电子设备、计算机可读存储介质
TWI735330B (zh) 2020-09-03 2021-08-01 由田新技股份有限公司 球體高度量測系統及其方法
CN113358030B (zh) * 2021-07-15 2022-09-30 中国科学院长春光学精密机械与物理研究所 色散共焦测量系统及其误差修正方法
CN114111637B (zh) * 2021-11-25 2024-06-21 天津工业大学 一种基于虚拟双目的条纹结构光三维重建方法
CN119411451B (zh) * 2024-11-04 2025-10-24 交通运输部公路科学研究所 路面平整度仪原位校准方法、校准装置和系统

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010132794A3 (en) * 2009-05-15 2011-03-10 University Of Delaware Method and apparatus for measuring microrelief of an object

Also Published As

Publication number Publication date
HK1047470A1 (en) 2003-02-21
HK1047470B (en) 2005-01-14
JP2003504634A (ja) 2003-02-04
EP1192414B1 (en) 2004-05-06
CN1375053A (zh) 2002-10-16
CA2579563A1 (en) 2001-01-25
CA2378867C (en) 2007-05-29
KR100858521B1 (ko) 2008-09-12
AU6143300A (en) 2001-02-05
CN1181313C (zh) 2004-12-22
IL147607A0 (en) 2002-08-14
DE60010462D1 (de) 2004-06-09
TW544509B (en) 2003-08-01
DE60010462T2 (de) 2005-04-21
US7023559B1 (en) 2006-04-04
KR20020060151A (ko) 2002-07-16
EP1192414A1 (en) 2002-04-03
ATE266188T1 (de) 2004-05-15
CA2378867A1 (en) 2001-01-25
KR20070058652A (ko) 2007-06-08
USRE42899E1 (en) 2011-11-08
JP4112858B2 (ja) 2008-07-02
IL147607A (en) 2006-12-10
WO2001006210A1 (en) 2001-01-25
CA2277855A1 (fr) 2001-01-14

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