KR100802831B1 - 알칼리 토금속 및 ⅲｂ족 금속의 산화물을 함유하는형광체 및 그를 포함하는 광원 - Google Patents

알칼리 토금속 및 ⅲｂ족 금속의 산화물을 함유하는형광체 및 그를 포함하는 광원 Download PDF

Info

Publication number
KR100802831B1
KR100802831B1 KR1020030042597A KR20030042597A KR100802831B1 KR 100802831 B1 KR100802831 B1 KR 100802831B1 KR 1020030042597 A KR1020030042597 A KR 1020030042597A KR 20030042597 A KR20030042597 A KR 20030042597A KR 100802831 B1 KR100802831 B1 KR 100802831B1
Authority
KR
South Korea
Prior art keywords
delete delete
phosphor
phosphors
group
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020030042597A
Other languages
English (en)
Korean (ko)
Other versions
KR20040002788A (ko
Inventor
세틀러아난트아크유트
스리바스타바알록마니
코만조홀리안
Original Assignee
제너럴 일렉트릭 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제너럴 일렉트릭 캄파니 filed Critical 제너럴 일렉트릭 캄파니
Publication of KR20040002788A publication Critical patent/KR20040002788A/ko
Application granted granted Critical
Publication of KR100802831B1 publication Critical patent/KR100802831B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C09K11/7731—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7786—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7792—Aluminates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
KR1020030042597A 2002-06-28 2003-06-27 알칼리 토금속 및 ⅲｂ족 금속의 산화물을 함유하는형광체 및 그를 포함하는 광원 Expired - Fee Related KR100802831B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/064,285 2002-06-28
US10/064,285 US6809471B2 (en) 2002-06-28 2002-06-28 Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070108826A Division KR100869396B1 (ko) 2002-06-28 2007-10-29 알칼리 토금속 및 ⅲａ족 금속의 산화물을 함유하는 형광체 및 그를 포함하는 광원

Publications (2)

Publication Number Publication Date
KR20040002788A KR20040002788A (ko) 2004-01-07
KR100802831B1 true KR100802831B1 (ko) 2008-02-12

Family

ID=29720373

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020030042597A Expired - Fee Related KR100802831B1 (ko) 2002-06-28 2003-06-27 알칼리 토금속 및 ⅲｂ족 금속의 산화물을 함유하는형광체 및 그를 포함하는 광원
KR1020070108826A Expired - Fee Related KR100869396B1 (ko) 2002-06-28 2007-10-29 알칼리 토금속 및 ⅲａ족 금속의 산화물을 함유하는 형광체 및 그를 포함하는 광원

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020070108826A Expired - Fee Related KR100869396B1 (ko) 2002-06-28 2007-10-29 알칼리 토금속 및 ⅲａ족 금속의 산화물을 함유하는 형광체 및 그를 포함하는 광원

Country Status (6)

Country Link
US (1) US6809471B2 (enExample)
EP (1) EP1378555A1 (enExample)
JP (1) JP2004107623A (enExample)
KR (2) KR100802831B1 (enExample)
CN (2) CN101157855A (enExample)
TW (1) TWI309673B (enExample)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051351B2 (en) * 1999-03-08 2006-05-23 Microsoft Corporation System and method of inserting advertisements into an information retrieval system display
US7091656B2 (en) * 2001-04-20 2006-08-15 Nichia Corporation Light emitting device
WO2002086978A1 (en) * 2001-04-20 2002-10-31 Nichia Corporation Light emitting device
DE10131698A1 (de) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
GB0118258D0 (en) * 2001-07-26 2001-09-19 Cambridge Display Tech Ltd Electrode compositions
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7768189B2 (en) 2004-08-02 2010-08-03 Lumination Llc White LEDs with tunable CRI
US20040061810A1 (en) * 2002-09-27 2004-04-01 Lumileds Lighting, U.S., Llc Backlight for a color LCD using wavelength-converted light emitting devices
EP2596948B1 (en) * 2003-03-10 2020-02-26 Toyoda Gosei Co., Ltd. Method of making a semiconductor device
CA2521263A1 (en) * 2003-04-07 2004-10-21 Mcmaster University Europium-doped gallium-indium oxides as red emitting electroluminescent phosphor materials
EP1644985A4 (en) * 2003-06-24 2006-10-18 Gelcore Llc FULL SPECTRUM FLUID MIXTURES FOR WHITE GENERATION WITH LED CHIPS
CN100379041C (zh) * 2003-08-07 2008-04-02 松下电器产业株式会社 Led照明光源及其制造方法
US7488432B2 (en) * 2003-10-28 2009-02-10 Nichia Corporation Fluorescent material and light-emitting device
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
US7329904B2 (en) * 2004-01-30 2008-02-12 Toyoda Gosei Co., Ltd. LED lamp device
US20050236958A1 (en) * 2004-04-23 2005-10-27 Harvatek Corporation White light-emitting device
EP2113549B1 (en) * 2004-04-27 2011-12-28 Panasonic Corporation Phosphor composition and light-emitting device using the same
US7077980B2 (en) * 2004-05-03 2006-07-18 General Electric Company Phosphors containing oxides of alkaline-earth and group-13 metals, and light sources incorporating the same
EP1769050B1 (en) * 2004-07-06 2013-01-16 Lightscape Materials Inc. Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
US8417215B2 (en) * 2004-07-28 2013-04-09 Koninklijke Philips Electronics N.V. Method for positioning of wireless medical devices with short-range radio frequency technology
US7453195B2 (en) 2004-08-02 2008-11-18 Lumination Llc White lamps with enhanced color contrast
US20070241657A1 (en) * 2004-08-02 2007-10-18 Lumination, Llc White light apparatus with enhanced color contrast
US20060181192A1 (en) * 2004-08-02 2006-08-17 Gelcore White LEDs with tailorable color temperature
US20060081815A1 (en) * 2004-10-15 2006-04-20 Terralium Industries Inc. Light accumulating and luminous materials and a process to produce same
WO2006095285A1 (en) 2005-03-09 2006-09-14 Philips Intellectual Property & Standards Gmbh Illumination system comprising a radiation source and a fluorescent material
US7276183B2 (en) * 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
KR100799839B1 (ko) * 2005-03-30 2008-01-31 삼성전기주식회사 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치
KR101142519B1 (ko) * 2005-03-31 2012-05-08 서울반도체 주식회사 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널
US20060228973A1 (en) * 2005-04-11 2006-10-12 Jlj, Inc. LED Light Strings
US7329907B2 (en) 2005-08-12 2008-02-12 Avago Technologies, Ecbu Ip Pte Ltd Phosphor-converted LED devices having improved light distribution uniformity
US20070114561A1 (en) * 2005-11-22 2007-05-24 Comanzo Holly A High efficiency phosphor for use in LEDs
US8906262B2 (en) 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
KR100764148B1 (ko) * 2006-01-17 2007-10-05 루시미아 주식회사 시트상 형광체와 그 제조방법 및 이를 이용한 발광장치
JP2007300069A (ja) 2006-04-04 2007-11-15 Toyoda Gosei Co Ltd 発光素子、この発光素子を用いた発光装置及びこの発光素子の製造方法
KR101497104B1 (ko) 2006-10-03 2015-02-27 라이트스케이프 머티어리얼스, 인코포레이티드 금속 실리케이트 할라이드 형광체 및 이를 이용한 ｌｅｄ 조명 디바이스
US8475683B2 (en) 2006-10-20 2013-07-02 Intematix Corporation Yellow-green to yellow-emitting phosphors based on halogenated-aluminates
US8133461B2 (en) 2006-10-20 2012-03-13 Intematix Corporation Nano-YAG:Ce phosphor compositions and their methods of preparation
US9120975B2 (en) 2006-10-20 2015-09-01 Intematix Corporation Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates
US8529791B2 (en) 2006-10-20 2013-09-10 Intematix Corporation Green-emitting, garnet-based phosphors in general and backlighting applications
US20080171229A1 (en) * 2007-01-17 2008-07-17 General Electric Company Method of producing a palette of colors for persistent phosphors and phosphors made by same
US7959827B2 (en) * 2007-12-12 2011-06-14 General Electric Company Persistent phosphor
US8333907B2 (en) 2007-01-17 2012-12-18 Utc Fire & Security Corporation Articles using persistent phosphors
US8003012B2 (en) * 2007-01-17 2011-08-23 General Electric Company Method for producing a palette of colors for persistent phosphors and phosphors made by same
US7864381B2 (en) * 2007-03-20 2011-01-04 Xerox Corporation Document illuminator with LED-driven phosphor
US7608829B2 (en) * 2007-03-26 2009-10-27 General Electric Company Polymeric composite scintillators and method for making same
US7625502B2 (en) * 2007-03-26 2009-12-01 General Electric Company Nano-scale metal halide scintillation materials and methods for making same
US7708968B2 (en) * 2007-03-26 2010-05-04 General Electric Company Nano-scale metal oxide, oxyhalide and oxysulfide scintillation materials and methods for making same
US8545723B2 (en) * 2007-12-12 2013-10-01 General Electric Company Persistent phosphor
KR101416319B1 (ko) * 2008-03-19 2014-07-09 삼성전자주식회사 메모리 칩들이 적층되는 메모리 모듈을 포함하는 반도체메모리 장치
EP2297794B1 (en) 2008-07-07 2017-09-06 Glo Ab Nanostructured light emitting diode
US8703016B2 (en) 2008-10-22 2014-04-22 General Electric Company Phosphor materials and related devices
US8329060B2 (en) * 2008-10-22 2012-12-11 General Electric Company Blue-green and green phosphors for lighting applications
US8456082B2 (en) 2008-12-01 2013-06-04 Ifire Ip Corporation Surface-emission light source with uniform illumination
CN102333843A (zh) * 2009-02-25 2012-01-25 皇家飞利浦电子股份有限公司 Uv发射放电灯
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US20110109220A1 (en) * 2009-11-09 2011-05-12 Han-Ming Lee Intermittent cyclic permanent illuminating LED lamp
US20110147661A1 (en) * 2009-12-21 2011-06-23 Sam Joseph Camardello Novel aluminosilicate based blue persistent phosphors
TWI464463B (zh) * 2010-06-11 2014-12-11 Hon Hai Prec Ind Co Ltd 導光板及背光模組
CN102382649B (zh) * 2010-08-31 2014-02-19 海洋王照明科技股份有限公司 掺In的稀土氧化物发光材料及其制备方法
KR20120097697A (ko) * 2011-02-25 2012-09-05 삼성전자주식회사 발광 다이오드
CN105754601A (zh) * 2011-03-08 2016-07-13 英特曼帝克司公司 以卤化铝酸盐为主的发黄绿光到黄光的磷光体及其用途
KR101851726B1 (ko) * 2011-11-23 2018-04-24 엘지이노텍 주식회사 표시장치
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US8933478B2 (en) * 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8847261B1 (en) 2013-03-14 2014-09-30 Cooledge Lighting Inc. Light-emitting devices having engineered phosphor elements
JP2014181260A (ja) * 2013-03-18 2014-09-29 Toshiba Corp 蛍光体、発光装置、および蛍光体の製造方法
CN104119869A (zh) * 2013-04-26 2014-10-29 海洋王照明科技股份有限公司 一种镓酸锶发光材料及其制备方法
US11251343B2 (en) * 2017-02-08 2022-02-15 Current Lighting Solutions, Llc LED design of lower CCT utilizing PFS phosphor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0622440A1 (en) * 1993-04-28 1994-11-02 Nemoto & Co., Ltd. Phosphorescent phosphor

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW353678B (en) 1994-08-17 1999-03-01 Mitsubishi Chem Corp Aluminate phosphor
JP3456553B2 (ja) 1994-11-01 2003-10-14 根本特殊化学株式会社 蓄光性蛍光体
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
US5725801A (en) * 1995-07-05 1998-03-10 Adrian H. Kitai Doped amorphous and crystalline gallium oxides, alkaline earth gallates and doped zinc germanate phosphors as electroluminescent materials
JPH09217059A (ja) * 1996-02-08 1997-08-19 Toshiba Corp 青色発光蛍光体，その製造方法および蛍光ランプ
JPH101666A (ja) 1996-06-13 1998-01-06 Kasei Optonix Co Ltd アルミン酸塩蛍光体、その製造方法及び真空紫外線励起発光素子
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5788882A (en) * 1996-07-03 1998-08-04 Adrian H. Kitai Doped amorphous and crystalline alkaline earth gallates as electroluminescent materials
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
DE69731126T2 (de) 1997-05-19 2006-02-09 Citizen Watch Co., Ltd., Nishitokyo Lichtspeicherndes Fluoreszenzpigment zur Verwendung als Anzeigeelement
US6278135B1 (en) 1998-02-06 2001-08-21 General Electric Company Green-light emitting phosphors and light sources using the same
JP2000001672A (ja) * 1998-06-15 2000-01-07 Hirotsu Naotoshi 蓄光性蛍光体微粒粉末及びその製造方法
JP2000356964A (ja) * 1998-12-25 2000-12-26 Nemoto & Co Ltd 表示部材、表示装置、計測装置および時計
EP1120452A1 (en) 1999-03-31 2001-08-01 Somar Corporation Phosphorescent material, composition containing the same, and method of absorbing energy with the same
US6190577B1 (en) 1999-07-20 2001-02-20 Usr Optonix Inc. Indium-substituted aluminate phosphor and method for making the same
JP3511083B2 (ja) * 1999-08-06 2004-03-29 独立行政法人産業技術総合研究所 高輝度応力発光材料、その製造方法及びそれを用いた発光方法
JP3559210B2 (ja) * 1999-11-08 2004-08-25 株式会社リード 耐熱・耐水性・高輝度・長残光性黄緑発光色蓄光体及びその製造法
JP2002012863A (ja) * 2000-06-27 2002-01-15 Sumitomo Chem Co Ltd 蓄光材用アルミン酸塩系蛍光体の製造方法
DE10036940A1 (de) * 2000-07-28 2002-02-07 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lumineszenz-Konversions-LED
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
JP2003197979A (ja) * 2001-12-28 2003-07-11 Okaya Electric Ind Co Ltd 発光素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0622440A1 (en) * 1993-04-28 1994-11-02 Nemoto & Co., Ltd. Phosphorescent phosphor

Also Published As

Publication number Publication date
US6809471B2 (en) 2004-10-26
CN101157855A (zh) 2008-04-09
JP2004107623A (ja) 2004-04-08
KR20070111432A (ko) 2007-11-21
US20040000862A1 (en) 2004-01-01
EP1378555A1 (en) 2004-01-07
KR100869396B1 (ko) 2008-11-21
KR20040002788A (ko) 2004-01-07
TW200404883A (en) 2004-04-01
TWI309673B (en) 2009-05-11
CN1470596A (zh) 2004-01-28
CN1470596B (zh) 2011-06-22

Similar Documents

Publication Publication Date Title
KR100802831B1 (ko) 알칼리 토금속 및 ⅲｂ족 금속의 산화물을 함유하는형광체 및 그를 포함하는 광원
US6596195B2 (en) Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same
US7077978B2 (en) Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same
US7128849B2 (en) Phosphors containing boron and metals of Group IIIA and IIIB
US6685852B2 (en) Phosphor blends for generating white light from near-UV/blue light-emitting devices
US6765237B1 (en) White light emitting device based on UV LED and phosphor blend
KR100666211B1 (ko) 자외선 및 장파장 여기용 규산염계 형광체
US6761837B2 (en) Europium-activated phosphors containing oxides of rare-earth and group-IIIB metals and method of making the same
JP5461752B2 (ja) アルカリ土類金属及び１３族金属の酸化物を含む蛍光体及び該蛍光体を組み込む光源
US7022263B2 (en) Europium-activated phosphors containing oxides of rare-earth and group-IIIB metals and method of making the same
US7122128B2 (en) Phosphors containing borate of terbium, alkaline-earth, and Group-3 metals, and light sources incorporating the same
US20080309219A1 (en) Phosphors and lighting apparatus using the same
US20040239233A1 (en) Boron-containing red light-emitting phosphors and light sources incorporating the same
KR101072572B1 (ko) 고체 조명용 적색 형광체 및 그 제조방법
US20130020928A1 (en) Phosphor precursor composition
WO2018124106A1 (ja) 蓄光を有する蛍光体及びその製造方法、並びに蓄光性発光製品

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A16-div-PA0107

St.27 status event code: A-0-1-A10-A18-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

Fee payment year number: 1

St.27 status event code: A-2-2-U10-U11-oth-PR1002

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

Fee payment year number: 4

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 5

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20130124

Year of fee payment: 6

PR1001 Payment of annual fee

Fee payment year number: 6

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20140124

Year of fee payment: 7

PR1001 Payment of annual fee

Fee payment year number: 7

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20150126

Year of fee payment: 8

PR1001 Payment of annual fee

Fee payment year number: 8

St.27 status event code: A-4-4-U10-U11-oth-PR1001

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20160122

Year of fee payment: 9

PR1001 Payment of annual fee

Fee payment year number: 9

St.27 status event code: A-4-4-U10-U11-oth-PR1001

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20170125

Year of fee payment: 10

PR1001 Payment of annual fee

Fee payment year number: 10

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20180125

Year of fee payment: 11

PR1001 Payment of annual fee

Fee payment year number: 11

St.27 status event code: A-4-4-U10-U11-oth-PR1001

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

Not in force date: 20190202

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

St.27 status event code: A-4-4-U10-U13-oth-PC1903

PC1903 Unpaid annual fee

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190202

St.27 status event code: N-4-6-H10-H13-oth-PC1903

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000