KR100801360B1 - 회로와 리드프레임의 전력 분배 기능을 칩 표면에 집적시킨 집적 회로 칩, 반도체 디바이스 및 그 제조 방법 - Google Patents
회로와 리드프레임의 전력 분배 기능을 칩 표면에 집적시킨 집적 회로 칩, 반도체 디바이스 및 그 제조 방법 Download PDFInfo
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- KR100801360B1 KR100801360B1 KR1020010063193A KR20010063193A KR100801360B1 KR 100801360 B1 KR100801360 B1 KR 100801360B1 KR 1020010063193 A KR1020010063193 A KR 1020010063193A KR 20010063193 A KR20010063193 A KR 20010063193A KR 100801360 B1 KR100801360 B1 KR 100801360B1
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Abstract
Description
<다른 실시예>
Claims (23)
- 리드프레임 상에 장착된 집적 회로 칩에 있어서,상기 칩의 표면 상에 피착되고, 상기 회로의 능동 소자 상에 직접적으로 배치된 전력 분배 라인들의 네트워크를 포함하고,상기 전력 분배 라인은 그 하부의 선택된 능동 소자들에 도전적으로 및 수직으로 접속되는 것과 함께, 도전체에 의해 상기 리드프레임의 세그먼트에 접속되어,회로 전력 분배 라인 및 도전체 패드에 의해 소비되는 실리콘 자원(real estate)을 절약하고, 회로 설계의 유연성 및 조립 제조성능을 얻으며, 상기 세그먼트의 입력/출력 수를 감소시키는 집적 회로 칩.
- 집적 회로의 전력 분배가 리드프레임의 전력 분배와 결합된, 칩 표면 상에 추가의 도전체 네트워크를 포함하는 반도체 디바이스에 있어서,제1 및 제2 표면을 포함하는 반도체 칩;상기 제1 칩 표면 상에 제조된 집적 회로 - 상기 회로는 능동 소자와, 적어도 하나의 금속층을 포함하며, 상기 적어도 하나의 금속층과 콘택하기 위한 복수개의 금속 충전된 비아(vias) 및 회로 콘택 패드를 노출하기 위한 복수개의 윈도우를 포함하는, 기계적으로 강하고 전기적으로 절연성인 오버코트에 의해서 보호됨-;상기 오버코트 상에 피착되고 상기 능동 소자 상에 거의 수직하게 라인들의 네트워크로 패터닝된 전기 도전막 -상기 막은 상기 비아와 콘택하며 적어도 하나의 스트레스 흡수막 및 비부식성이고 금속적으로(metallurgically) 부착가능한 최외측 막을 포함하고, 상기 네트워크는 전력 전류와 접지 전위를 분배하도록 패터닝됨 -;칩 마운트 패드, 전기 신호를 제공하는 복수개의 제1 세그먼트, 및 전기 전력과 접지를 제공하는 복수개의 제2 세그먼트를 포함하는 리드프레임- 상기 제2 칩 표면이 상기 칩 마운트 패드 상에 부착됨 -;상기 칩 콘택트 패드를 상기 복수개의 제1 세그먼트와 접속시키는 전기적 도전체; 및상기 네트워크 라인을 상기 복수개의 제2 세그먼트와 접속시키는 전기적 도전체를 포함하는 반도체 디바이스.
- 제2항에 있어서,상기 칩은 실리콘, 실리콘 게르마늄, 갈륨 아세나이드, 및 전자 디바이스 제조에 관례적으로 이용되는 임의의 다른 반도체 재료로 구성된 그룹으로부터 선택되는 반도체 디바이스.
- 제2항에 있어서,상기 회로는 수평 및 수직으로 배열된 복수개의 능동 및 수동 전자 소자를 포함하는 반도체 디바이스.
- 제2항에 있어서,상기 집적 회로는 다층 금속부를 포함하며, 상기 층들 중의 적어도 하나는 순수의 또는 합금의 구리, 알루미늄, 니켈, 또는 내화성 금속으로 구성되는 반도체 디바이스.
- 제2항에 있어서,상기 오버코트는 실리콘 질화물, 실리콘 산화질화물, 실리콘 탄소 합금, 폴리이미드, 및 이들의 샌드위치된 막(sandwiched films)으로 구성된 그룹으로부터 선택된 물질을 포함하는 반도체 디바이스.
- 제2항에 있어서,상기 리드프레임은 구리, 구리 합금, 알루미늄, 철-니켈 합금, 또는 인바(invar)로 구성된 그룹으로부터 선택된 시트형 물질로부터 미리 제조되는 반도체 디바이스.
- 제2항에 있어서,상기 칩, 칩 마운트 패드, 전기 도전체, 및 상기 리드프레임 세그먼트의 적어도 일부분을 밀봉하는 인캡슐레이션(encapsulation)을 더 포함하는 반도체 디바 이스.
- 제8항에 있어서,상기 인캡슐레이션은 트랜스퍼 몰딩 공정에서 제조된 폴리머 화합물을 포함하는 반도체 디바이스.
- 제8항에 있어서,상기 인캡슐레이션에 포함되지 않는 리드프레임 세그먼트부는 리드 또는 핀의 형상을 하고 있으며, 외부 부품에 솔더가능한 반도체 디바이스.
- 제2항에 있어서,상기 라인 및 콘택 패드는 솔더 볼에 의해 외부 부품에 부착되는 반도체 디바이스.
- 제2항에 있어서,상기 금속적 부착은 배선 볼 및 스티치 본딩, 리본 본딩, 및 솔더링을 포함하는 반도체 디바이스.
- 제2항에 있어서,상기 전기 도전막은 구리, 니켈, 알루미늄, 텅스텐, 티타늄, 몰리브덴, 크롬, 및 이들의 합금으로 구성된 그룹으로부터 선택된 적어도 하나의 스트레스 흡수 금속층을 포함하는 반도체 디바이스.
- 제2항에 있어서,상기 최외측 금속층은 순수의 또는 합금의 금, 팔라듐, 은, 백금, 및 알루미늄으로 구성된 그룹으로부터 선택되는 반도체 디바이스.
- 제2항에 있어서,상기 도전체는 본딩 배선, 본딩 리본, 또는 솔더 볼인 반도체 디바이스.
- 제15항에 있어서,상기 본딩 배선은 순수의 또는 합금의 금, 구리, 및 알루미늄으로 구성된 그룹으로부터 선택되는 반도체 디바이스.
- 제15항에 있어서,상기 솔더 볼은 순수 주석과, 주석/구리, 주석/인듐, 주석/은, 주석/비스무스, 주석/납을 포함하는 주석 합금과, 도전 점착 화합물로 구성된 그룹으로부터 선택되는 반도체 디바이스.
- 제2항에 있어서,상기 라인들의 네트워크는 외측 전기 콘택에 적합한 선택된 세그먼트에 전기적으로 더 접속되는 반도체 디바이스.
- 제2항에 있어서,상기 라인들의 네트워크는 상기 금속 충전된 비아와 함께 상기 능동 회로 소자들 간의 전력 분배 기능을 제공하는 반도체 디바이스.
- 제1 및 제2 표면을 포함하는 반도체 칩을 포함하는 반도체 디바이스를 제조하는 방법에 있어서,상기 제1 칩 표면 상에 집적 회로를 형성하는 단계 - 상기 회로는 능동 소자, 적어도 하나의 금속층, 및 기계적으로 강하고 전기적으로 절연성인 보호 오버코트를 포함함 -;상기 적어도 하나의 금속층에 접근하기 위하여 상기 오버코트를 관통하여 복수개의 비아를 형성하는 단계;상기 오버코트 상에 금속막의 스택을 피착함으로써 상기 비아를 채우는 단계 - 상기 스택은 적어도 하나의 스트레스 흡수막 및 비부식성이고 금속적으로 부착가능한 최외측 막을 포함함 -;라인이 상기 능동 소자 상에 거의 수직으로 배치되고 전력 전류 분배에 적합하게 되도록 상기 막을 상기 라인들의 네트워크로 패터닝하는 단계;회로 콘택 패드를 노출하도록 상기 오버코트에 복수개의 윈도우를 형성하는 단계;칩 마운트 패드, 전기 신호에 적합한 복수개의 제1 세그먼트, 및 전기 전력 및 접지에 적합한 복수개의 제2 세그먼트를 포함하는 미리 제조된 리드프레임을 제공하는 단계;상기 칩을 상기 칩 마운트 패드에 부착하는 단계;전기 도전체를 상기 회로 콘택 패드 및 상기 복수개의 제1 세그먼트에 부착하는 단계; 및전기 도전체를 상기 라인들의 네트워크 및 상기 복수개의 제2 세그먼트에 부착하는 단계를 포함하는 반도체 디바이스 제조 방법.
- 제20항에 있어서,상기 전기 도전체를 상기 콘택 패드 및 상기 라인들의 네트워크에 부착하는 상기 단계는, 배선 또는 리본을 상기 콘택 패드 및 라인들의 네트워크에 본딩하는 단계 또는 솔더 볼을 상기 콘택 패드 및 라인들의 네트워크에 리플로우하는 단계 중의 하나를 포함하는 반도체 디바이스 제조 방법.
- 제20항에 있어서,상기 칩, 칩 마운트 패드, 전기 도전체 및 상기 리드프레임 세그먼트의 적어도 일부분을 패키지 안에 인캡슐레이팅하는 단계를 더 포함하는 반도체 디바이스 제조 방법.
- 제20항에 있어서,상기 회로 콘택 패드 및 상기 라인들의 네트워크를 솔더 볼에 의해 외부 부품에 부착하는 단계를 더 포함하는 반도체 디바이스 제조 방법.
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EP (1) | EP1198004A3 (ko) |
JP (1) | JP2002164383A (ko) |
KR (1) | KR100801360B1 (ko) |
CN (1) | CN1269212C (ko) |
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EP1198004A3 (en) | 2003-10-01 |
CN1355567A (zh) | 2002-06-26 |
US20020043712A1 (en) | 2002-04-18 |
EP1198004A2 (en) | 2002-04-17 |
US7060607B2 (en) | 2006-06-13 |
US6972484B2 (en) | 2005-12-06 |
US20050248027A1 (en) | 2005-11-10 |
TW531867B (en) | 2003-05-11 |
KR20020029644A (ko) | 2002-04-19 |
JP2002164383A (ja) | 2002-06-07 |
CN1269212C (zh) | 2006-08-09 |
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