KR100800047B1 - 고속신호 인가가 가능한 반도체 칩 번인테스트 장치 - Google Patents
고속신호 인가가 가능한 반도체 칩 번인테스트 장치 Download PDFInfo
- Publication number
- KR100800047B1 KR100800047B1 KR1020070093711A KR20070093711A KR100800047B1 KR 100800047 B1 KR100800047 B1 KR 100800047B1 KR 1020070093711 A KR1020070093711 A KR 1020070093711A KR 20070093711 A KR20070093711 A KR 20070093711A KR 100800047 B1 KR100800047 B1 KR 100800047B1
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- Prior art keywords
- clock
- semiconductor chip
- output unit
- burn
- test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Environmental & Geological Engineering (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (3)
- 반도체 칩 번인테스트 장치에 있어서,티티엘 클럭을 발생시키기 위한 티티엘클럭발생부와;상기 티티엘클럭발생부를 통해 발생된 티티엘 클럭을 1차 증폭시켜 2차팬아웃및출력부로 전달시키기 위한 1차팬아웃및출력부와,상기 1차팬아웃및출력부로부터 전달되는 1차 증폭 티티엘출력 신호를 디유티의 수만큼 팬아웃시켜 증폭 출력하여 디유티로 전달시키기 위한 2차팬아웃및출력부를 포함하여 구성되어 안정된 티티엘 클럭을 디유티로 전달하기 위한 티티엘출력부와;상기 티티엘출력부를 통해 전달되는 티티엘출력 신호를 입력받아 반도체 칩에 대한 번인 테스트를 수행시키기 위한 디유티;를 포함하여 구성되되,상기 티티엘 클럭의 범위는,2Mhz 내지 400Mhz 범위 내의 주파수 중 원하는 특정 클럭 신호를 입력받아 반도체 칩에 대한 번인 테스트를 실행하는 것을 특징으로 하는 고속신호 인가가 가능한 반도체 칩 번인테스트 장치.
- 삭제
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070093711A KR100800047B1 (ko) | 2007-09-14 | 2007-09-14 | 고속신호 인가가 가능한 반도체 칩 번인테스트 장치 |
Applications Claiming Priority (1)
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KR1020070093711A KR100800047B1 (ko) | 2007-09-14 | 2007-09-14 | 고속신호 인가가 가능한 반도체 칩 번인테스트 장치 |
Related Parent Applications (1)
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KR1020070075713A Division KR100771560B1 (ko) | 2007-07-27 | 2007-07-27 | 고속신호 인가가 가능한 반도체 칩 번인테스트 장치 |
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KR100800047B1 true KR100800047B1 (ko) | 2008-02-01 |
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KR1020070093711A KR100800047B1 (ko) | 2007-09-14 | 2007-09-14 | 고속신호 인가가 가능한 반도체 칩 번인테스트 장치 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000310666A (ja) | 1999-04-26 | 2000-11-07 | Ando Electric Co Ltd | テストバーンイン装置及びテストバーンイン装置における制御方法 |
JP2001330645A (ja) | 2000-05-18 | 2001-11-30 | Ando Electric Co Ltd | バーンインテストシステム |
JP2003302445A (ja) | 2002-04-05 | 2003-10-24 | Fujitsu Ltd | ダイナミックバーンイン装置用アダプタ・カードおよびダイナミックバーンイン装置 |
JP2005121399A (ja) | 2003-10-15 | 2005-05-12 | Matsushita Electric Ind Co Ltd | バーンインシステムおよびバーンイン試験方法 |
KR20060021429A (ko) * | 2004-09-03 | 2006-03-08 | 주식회사 유니테스트 | 반도체 소자 테스터를 위한 신호 분배 장치 |
JP2007114207A (ja) | 2006-12-04 | 2007-05-10 | Fujitsu Ltd | ダイナミックバーンイン装置 |
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2007
- 2007-09-14 KR KR1020070093711A patent/KR100800047B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000310666A (ja) | 1999-04-26 | 2000-11-07 | Ando Electric Co Ltd | テストバーンイン装置及びテストバーンイン装置における制御方法 |
JP2001330645A (ja) | 2000-05-18 | 2001-11-30 | Ando Electric Co Ltd | バーンインテストシステム |
JP2003302445A (ja) | 2002-04-05 | 2003-10-24 | Fujitsu Ltd | ダイナミックバーンイン装置用アダプタ・カードおよびダイナミックバーンイン装置 |
JP2005121399A (ja) | 2003-10-15 | 2005-05-12 | Matsushita Electric Ind Co Ltd | バーンインシステムおよびバーンイン試験方法 |
KR20060021429A (ko) * | 2004-09-03 | 2006-03-08 | 주식회사 유니테스트 | 반도체 소자 테스터를 위한 신호 분배 장치 |
JP2007114207A (ja) | 2006-12-04 | 2007-05-10 | Fujitsu Ltd | ダイナミックバーンイン装置 |
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