KR100779236B1 - 베이크 장치 - Google Patents
베이크 장치 Download PDFInfo
- Publication number
- KR100779236B1 KR100779236B1 KR1020060048807A KR20060048807A KR100779236B1 KR 100779236 B1 KR100779236 B1 KR 100779236B1 KR 1020060048807 A KR1020060048807 A KR 1020060048807A KR 20060048807 A KR20060048807 A KR 20060048807A KR 100779236 B1 KR100779236 B1 KR 100779236B1
- Authority
- KR
- South Korea
- Prior art keywords
- cross
- sectional area
- discharge
- discharge pipe
- baking
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Lift Valve (AREA)
Abstract
Description
Claims (5)
- 베이크 챔버; 및상기 베이크 챔버와 연결된 배출 버퍼, 상기 배출 버퍼와 연결된 배출관, 및 상기 배출관 내에 위치하고, 상기 배출관의 단면 면적을 조절하기 위한 댐퍼부를 포함하며,상기 댐퍼부는,상기 배출관의 내주면에 지지되며, 상기 배출관의 단면 모양을 조절하기 위한 단면 모양 조절부; 및상기 단면 모양 조절부에 의해 조절된 상기 배출관의 단면 면적을 조절하기 위한 단면 면적 조절부를 포함하는 베이크 장치.
- 삭제
- 제 1 항에 있어서,상기 댐퍼부는 복수개로 구성되는 베이크 장치.
- 제 1 항에 있어서,상기 배출관 내에 위치하고, 상기 배출관을 완전히 개방하거나 폐쇄하는 밸브를 더 포함하는 베이크 장치.
- 관의 내주면에 지지되며, 상기 관의 단면 모양을 조절하기 위한 단면 모양 조절부; 및상기 단면 모양 조절부에 의해 조절된 상기 관의 단면 면적을 조절하기 위한 단면 면적 조절부를 포함하는 댐퍼부.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060048807A KR100779236B1 (ko) | 2006-05-30 | 2006-05-30 | 베이크 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060048807A KR100779236B1 (ko) | 2006-05-30 | 2006-05-30 | 베이크 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100779236B1 true KR100779236B1 (ko) | 2007-11-23 |
Family
ID=39080763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060048807A KR100779236B1 (ko) | 2006-05-30 | 2006-05-30 | 베이크 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100779236B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101135548B1 (ko) * | 2009-09-23 | 2012-04-17 | 오에프티 주식회사 | 베이킹 장치용 배기량 조절기 |
KR101135547B1 (ko) * | 2009-09-23 | 2012-04-17 | 오에프티 주식회사 | 베이킹 장치 |
KR20220160143A (ko) * | 2021-05-26 | 2022-12-06 | 세메스 주식회사 | 기판 처리 설비의 배기 장치 및 배기 방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5820745A (ja) | 1981-07-22 | 1983-02-07 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ用母材の製造方法 |
JPH0213959A (ja) * | 1988-06-30 | 1990-01-18 | Mitsubishi Electric Corp | レジスト現像装置 |
JPH04337630A (ja) * | 1991-05-14 | 1992-11-25 | Nec Corp | 半導体ウェハーの熱処理炉 |
JPH05272797A (ja) * | 1992-03-24 | 1993-10-19 | Shibaura Eng Works Co Ltd | 風量調整ダンパ装置 |
JPH08162418A (ja) * | 1994-12-07 | 1996-06-21 | Hitachi Ltd | 半導体ウエハの処理装置及びそれを用いた半導体ウエハの処理方法 |
JP2000018697A (ja) * | 1998-06-29 | 2000-01-18 | Hitachi Plant Eng & Constr Co Ltd | 逆流防止ダンパ装置 |
JP2000161607A (ja) * | 1998-11-27 | 2000-06-16 | Babcock Hitachi Kk | 蒸気温度制御装置 |
-
2006
- 2006-05-30 KR KR1020060048807A patent/KR100779236B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5820745A (ja) | 1981-07-22 | 1983-02-07 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ用母材の製造方法 |
JPH0213959A (ja) * | 1988-06-30 | 1990-01-18 | Mitsubishi Electric Corp | レジスト現像装置 |
JPH04337630A (ja) * | 1991-05-14 | 1992-11-25 | Nec Corp | 半導体ウェハーの熱処理炉 |
JPH05272797A (ja) * | 1992-03-24 | 1993-10-19 | Shibaura Eng Works Co Ltd | 風量調整ダンパ装置 |
JPH08162418A (ja) * | 1994-12-07 | 1996-06-21 | Hitachi Ltd | 半導体ウエハの処理装置及びそれを用いた半導体ウエハの処理方法 |
JP2000018697A (ja) * | 1998-06-29 | 2000-01-18 | Hitachi Plant Eng & Constr Co Ltd | 逆流防止ダンパ装置 |
JP2000161607A (ja) * | 1998-11-27 | 2000-06-16 | Babcock Hitachi Kk | 蒸気温度制御装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101135548B1 (ko) * | 2009-09-23 | 2012-04-17 | 오에프티 주식회사 | 베이킹 장치용 배기량 조절기 |
KR101135547B1 (ko) * | 2009-09-23 | 2012-04-17 | 오에프티 주식회사 | 베이킹 장치 |
KR20220160143A (ko) * | 2021-05-26 | 2022-12-06 | 세메스 주식회사 | 기판 처리 설비의 배기 장치 및 배기 방법 |
KR102583557B1 (ko) | 2021-05-26 | 2023-10-10 | 세메스 주식회사 | 기판 처리 설비의 배기 장치 및 배기 방법 |
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