KR100765008B1 - 마이크로 부품 및 마이크로 부품을 이용한 마이크로 웰 어레이 칩 또는 수지제 피펫팁 - Google Patents

마이크로 부품 및 마이크로 부품을 이용한 마이크로 웰 어레이 칩 또는 수지제 피펫팁 Download PDF

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KR100765008B1
KR100765008B1 KR1020057016168A KR20057016168A KR100765008B1 KR 100765008 B1 KR100765008 B1 KR 100765008B1 KR 1020057016168 A KR1020057016168 A KR 1020057016168A KR 20057016168 A KR20057016168 A KR 20057016168A KR 100765008 B1 KR100765008 B1 KR 100765008B1
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South Korea
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polymer block
resin
resin composition
bond
micro
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Korean (ko)
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KR20060116681A (ko
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카주유키 야마시타
타카시 오나가
토시후미 후지키
히데키 모리모토
투토무 오바타
마사야수 수주키
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가부시키가이샤 릿첼
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
KR1020057016168A 2003-12-19 2004-12-17 마이크로 부품 및 마이크로 부품을 이용한 마이크로 웰 어레이 칩 또는 수지제 피펫팁 Expired - Fee Related KR100765008B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00423846 2003-12-19
JP2003423846 2003-12-19
JPJP-P-2004-00268136 2004-09-15
JP2004268136 2004-09-15

Publications (2)

Publication Number Publication Date
KR20060116681A KR20060116681A (ko) 2006-11-15
KR100765008B1 true KR100765008B1 (ko) 2007-10-09

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KR1020057016168A Expired - Fee Related KR100765008B1 (ko) 2003-12-19 2004-12-17 마이크로 부품 및 마이크로 부품을 이용한 마이크로 웰 어레이 칩 또는 수지제 피펫팁

Country Status (9)

Country Link
US (2) US20060127282A1 (enExample)
EP (2) EP1702952B1 (enExample)
JP (2) JP3867126B2 (enExample)
KR (1) KR100765008B1 (enExample)
CN (2) CN100378159C (enExample)
AT (2) ATE557064T1 (enExample)
DE (1) DE602004031050D1 (enExample)
ES (1) ES2357532T3 (enExample)
WO (1) WO2005059025A1 (enExample)

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ATE552968T1 (de) * 2005-06-17 2012-04-15 Richell Corp Verbindungsstruktur
CH708024B8 (de) * 2005-12-20 2015-01-15 Tpp Techno Plastic Products Ag Verfahren zur Herstellung einer Pipette.
JP4797718B2 (ja) * 2006-03-14 2011-10-19 株式会社カネカ 異種材料を一体化した栓
JP4714805B2 (ja) * 2006-03-23 2011-06-29 富山県 マイクロチップ
US20100092752A1 (en) * 2007-02-22 2010-04-15 Konica Minolta Medical & Graphic, Inc. Resin molded body, microchip, and production method of the same
JP5176032B2 (ja) * 2008-02-21 2013-04-03 富山県 マイクロウェルアレイチップ
CN102264460B (zh) * 2008-12-15 2014-03-26 科腾聚合物美国有限责任公司 氢化苯乙烯类嵌段共聚物与聚丙烯的共混物
JP5577502B2 (ja) * 2009-03-16 2014-08-27 富山県 機能性マイクロチップおよびその製造方法
TW201116569A (en) * 2009-11-13 2011-05-16 Richell Corp Resin composition and resin forming article for medical and biochemical use
TW201124256A (en) * 2010-01-07 2011-07-16 Richell Corp Mold for and method of manufacturing small components
JP5768403B2 (ja) * 2011-02-28 2015-08-26 日本ゼオン株式会社 バイオチップ用樹脂組成物及びその利用
CN102610449B (zh) * 2012-03-13 2014-08-06 苏州晶讯科技股份有限公司 用于小型熔断器的灭弧玻璃制造方法
CN102707359B (zh) * 2012-03-26 2014-06-18 京东方科技集团股份有限公司 一种彩色滤光片的制作方法及模板
CN104552741B (zh) * 2014-12-19 2017-03-01 江苏大学 一种小尺寸锥形硅胶管的制备装置及方法
CN109071895A (zh) * 2016-04-28 2018-12-21 住友化学株式会社 聚丙烯树脂组合物、精密注射成型体、光学构件成型用成型模具、和光学构件的制造方法
CN107522163B (zh) * 2016-09-26 2019-07-05 西北工业大学 一种pdms结构的高保型转移方法
JP7269698B2 (ja) * 2017-02-20 2023-05-09 日本ポリプロ株式会社 医療用プロピレン系樹脂組成物及びその成形品
CN107256814A (zh) * 2017-06-11 2017-10-17 武城县光明电力工程有限公司 一种组合式联动开关
CN108357042A (zh) * 2018-02-09 2018-08-03 广东工业大学 一种高分子复合材料表面微纳结构的制备方法
JP2021069300A (ja) * 2019-10-30 2021-05-06 横河電機株式会社 細胞吸引システム、吸引チップおよび吸引チップの製造方法
CN113703728B (zh) * 2021-08-27 2024-05-03 支付宝(杭州)信息技术有限公司 一种辅助研发的微组件业务处理方法、装置以及设备

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Also Published As

Publication number Publication date
DE602004031050D1 (de) 2011-02-24
ATE495219T1 (de) 2011-01-15
US20100123273A1 (en) 2010-05-20
CN101230168A (zh) 2008-07-30
JPWO2005059025A1 (ja) 2007-07-12
EP1702952B1 (en) 2011-01-12
ATE557064T1 (de) 2012-05-15
JP3867126B2 (ja) 2007-01-10
EP2287247B1 (en) 2012-05-09
HK1114627A1 (en) 2008-11-07
KR20060116681A (ko) 2006-11-15
EP1702952A1 (en) 2006-09-20
JP3981139B2 (ja) 2007-09-26
ES2357532T3 (es) 2011-04-27
EP1702952A4 (en) 2007-08-08
CN1756798A (zh) 2006-04-05
JP2006183060A (ja) 2006-07-13
HK1088625A1 (zh) 2006-11-10
US20060127282A1 (en) 2006-06-15
EP2287247A1 (en) 2011-02-23
US8609009B2 (en) 2013-12-17
WO2005059025A1 (ja) 2005-06-30
CN101230168B (zh) 2013-03-13
CN100378159C (zh) 2008-04-02

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