KR100757528B1 - 플라즈마처리방법 및 플라즈마처리장치 - Google Patents
플라즈마처리방법 및 플라즈마처리장치 Download PDFInfo
- Publication number
- KR100757528B1 KR100757528B1 KR1020050016720A KR20050016720A KR100757528B1 KR 100757528 B1 KR100757528 B1 KR 100757528B1 KR 1020050016720 A KR1020050016720 A KR 1020050016720A KR 20050016720 A KR20050016720 A KR 20050016720A KR 100757528 B1 KR100757528 B1 KR 100757528B1
- Authority
- KR
- South Korea
- Prior art keywords
- plasma
- electrostatic adsorption
- voltage
- high frequency
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/04—Roasting apparatus with movably-mounted food supports or with movable heating implements; Spits
- A47J37/041—Roasting apparatus with movably-mounted food supports or with movable heating implements; Spits with food supports rotating about a horizontal axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/07—Roasting devices for outdoor use; Barbecues
- A47J37/0786—Accessories
- A47J2037/0795—Adjustable food supports, e.g. for height adjustment
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/07—Roasting devices for outdoor use; Barbecues
- A47J37/0704—Roasting devices for outdoor use; Barbecues with horizontal fire box
- A47J37/0713—Roasting devices for outdoor use; Barbecues with horizontal fire box with gas burners
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/07—Roasting devices for outdoor use; Barbecues
- A47J37/0745—Roasting devices for outdoor use; Barbecues with motor-driven food supports
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/07—Roasting devices for outdoor use; Barbecues
- A47J37/0786—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Food Science & Technology (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005022112A JP4468194B2 (ja) | 2005-01-28 | 2005-01-28 | プラズマ処理方法およびプラズマ処理装置 |
| JPJP-P-2005-00022112 | 2005-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060087358A KR20060087358A (ko) | 2006-08-02 |
| KR100757528B1 true KR100757528B1 (ko) | 2007-09-11 |
Family
ID=36756289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050016720A Expired - Lifetime KR100757528B1 (ko) | 2005-01-28 | 2005-02-28 | 플라즈마처리방법 및 플라즈마처리장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7224568B2 (https=) |
| JP (1) | JP4468194B2 (https=) |
| KR (1) | KR100757528B1 (https=) |
| TW (1) | TWI290345B (https=) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5094002B2 (ja) * | 2005-09-06 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | プラズマ処理装置およびその異常放電抑止方法 |
| JP5372419B2 (ja) | 2008-06-25 | 2013-12-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
| DE102008036766B4 (de) * | 2008-08-07 | 2013-08-01 | Alexander Gschwandtner | Vorrichtung und Verfahren zum Erzeugen dielektrischer Schichten im Mikrowellenplasma |
| US9063356B2 (en) | 2008-09-05 | 2015-06-23 | Japan Display Inc. | Method for repairing display device and apparatus for same |
| US11615941B2 (en) | 2009-05-01 | 2023-03-28 | Advanced Energy Industries, Inc. | System, method, and apparatus for controlling ion energy distribution in plasma processing systems |
| US9767988B2 (en) | 2010-08-29 | 2017-09-19 | Advanced Energy Industries, Inc. | Method of controlling the switched mode ion energy distribution system |
| JP2011187881A (ja) * | 2010-03-11 | 2011-09-22 | Hitachi High-Technologies Corp | プラズマ処理装置および方法 |
| US9685297B2 (en) | 2012-08-28 | 2017-06-20 | Advanced Energy Industries, Inc. | Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system |
| KR102168064B1 (ko) * | 2013-02-20 | 2020-10-20 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
| JP6357436B2 (ja) | 2014-07-25 | 2018-07-11 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| KR101677748B1 (ko) | 2014-10-29 | 2016-11-29 | 삼성전자 주식회사 | 펄스 플라즈마 장치 및 펄스 플라즈마 장치 구동 방법 |
| US9779919B2 (en) | 2015-01-09 | 2017-10-03 | Hitachi High-Technologies Corporation | Plasma processing apparatus and plasma processing method |
| JP6567943B2 (ja) | 2015-01-09 | 2019-08-28 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| JP6396822B2 (ja) * | 2015-02-16 | 2018-09-26 | 東京エレクトロン株式会社 | プラズマ処理装置のサセプタの電位を制御する方法 |
| US9824857B2 (en) * | 2016-01-14 | 2017-11-21 | Varian Semiconductor Equipment Associates, Inc. | Method for implantation of semiconductor wafers having high bulk resistivity |
| US10535505B2 (en) * | 2016-11-11 | 2020-01-14 | Lam Research Corporation | Plasma light up suppression |
| CN111788654B (zh) | 2017-11-17 | 2023-04-14 | 先进工程解决方案全球控股私人有限公司 | 等离子体处理系统中的调制电源的改进应用 |
| WO2019099925A1 (en) | 2017-11-17 | 2019-05-23 | Advanced Energy Industries, Inc. | Spatial and temporal control of ion bias voltage for plasma processing |
| US12230476B2 (en) | 2017-11-17 | 2025-02-18 | Advanced Energy Industries, Inc. | Integrated control of a plasma processing system |
| US12505986B2 (en) | 2017-11-17 | 2025-12-23 | Advanced Energy Industries, Inc. | Synchronization of plasma processing components |
| US11437221B2 (en) | 2017-11-17 | 2022-09-06 | Advanced Energy Industries, Inc. | Spatial monitoring and control of plasma processing environments |
| EP3711080B1 (en) | 2017-11-17 | 2023-06-21 | AES Global Holdings, Pte. Ltd. | Synchronized pulsing of plasma processing source and substrate bias |
| KR102524810B1 (ko) | 2017-12-26 | 2023-04-24 | 삼성전자주식회사 | 반도체 공정의 제어 방법 |
| TWI869392B (zh) * | 2019-04-15 | 2025-01-11 | 美商應用材料股份有限公司 | 處理基板的方法 |
| WO2021011450A1 (en) | 2019-07-12 | 2021-01-21 | Advanced Energy Industries, Inc. | Bias supply with a single controlled switch |
| US12125674B2 (en) | 2020-05-11 | 2024-10-22 | Advanced Energy Industries, Inc. | Surface charge and power feedback and control using a switch mode bias system |
| CN115250648B (zh) * | 2021-02-25 | 2025-11-11 | 株式会社日立高新技术 | 等离子处理装置 |
| JP7648498B2 (ja) * | 2021-10-07 | 2025-03-18 | 東京エレクトロン株式会社 | 制御プログラム、制御方法、及びプラズマ処理装置 |
| US11670487B1 (en) | 2022-01-26 | 2023-06-06 | Advanced Energy Industries, Inc. | Bias supply control and data processing |
| US12046448B2 (en) | 2022-01-26 | 2024-07-23 | Advanced Energy Industries, Inc. | Active switch on time control for bias supply |
| US11942309B2 (en) | 2022-01-26 | 2024-03-26 | Advanced Energy Industries, Inc. | Bias supply with resonant switching |
| US11978613B2 (en) | 2022-09-01 | 2024-05-07 | Advanced Energy Industries, Inc. | Transition control in a bias supply |
| US12567572B2 (en) | 2023-07-11 | 2026-03-03 | Advanced Energy Industries, Inc. | Plasma behaviors predicted by current measurements during asymmetric bias waveform application |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100281935B1 (ko) | 1993-05-12 | 2001-03-02 | 히가시 데쓰로 | 자기 바이어스 측정방법 및 그 장치와 정전 흡착장치 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5737177A (en) * | 1996-10-17 | 1998-04-07 | Applied Materials, Inc. | Apparatus and method for actively controlling the DC potential of a cathode pedestal |
| US6367413B1 (en) * | 1999-06-15 | 2002-04-09 | Tokyo Electron Limited | Apparatus for monitoring substrate biasing during plasma processing of a substrate |
-
2005
- 2005-01-28 JP JP2005022112A patent/JP4468194B2/ja not_active Expired - Lifetime
- 2005-02-25 TW TW094105872A patent/TWI290345B/zh not_active IP Right Cessation
- 2005-02-28 KR KR1020050016720A patent/KR100757528B1/ko not_active Expired - Lifetime
- 2005-03-02 US US11/069,551 patent/US7224568B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100281935B1 (ko) | 1993-05-12 | 2001-03-02 | 히가시 데쓰로 | 자기 바이어스 측정방법 및 그 장치와 정전 흡착장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200627540A (en) | 2006-08-01 |
| JP2006210726A (ja) | 2006-08-10 |
| US7224568B2 (en) | 2007-05-29 |
| TWI290345B (en) | 2007-11-21 |
| JP4468194B2 (ja) | 2010-05-26 |
| US20060171093A1 (en) | 2006-08-03 |
| KR20060087358A (ko) | 2006-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100757528B1 (ko) | 플라즈마처리방법 및 플라즈마처리장치 | |
| JP4838736B2 (ja) | プラズマ処理装置 | |
| KR100502268B1 (ko) | 플라즈마처리장치 및 방법 | |
| JP5317424B2 (ja) | プラズマ処理装置 | |
| KR100802670B1 (ko) | 정전 흡착 장치, 플라즈마 처리 장치 및 플라즈마 처리 방법 | |
| US7988814B2 (en) | Plasma processing apparatus, plasma processing method, focus ring, and focus ring component | |
| CN101653048B (zh) | Rf供电电极上的dc电压控制的方法和设备 | |
| US7771607B2 (en) | Plasma processing apparatus and plasma processing method | |
| US20100078129A1 (en) | Mounting table for plasma processing apparatus | |
| US20080236492A1 (en) | Plasma processing apparatus | |
| US10847348B2 (en) | Plasma processing apparatus and plasma processing method | |
| TWI605486B (zh) | 包括電漿監視探針組件及併入該組件之處理腔室的電漿處理系統 | |
| CN108475633A (zh) | 等离子体处理装置 | |
| JP2010010214A (ja) | 半導体装置の製造方法、半導体製造装置、及び記憶媒体 | |
| CN110660635B (zh) | 工艺腔室和半导体处理设备 | |
| CN115250648B (zh) | 等离子处理装置 | |
| JP2015072825A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
| TWI517243B (zh) | 電漿處理裝置 | |
| KR20180120588A (ko) | 정전척 및 기판 고정 장치 | |
| JPH0770755A (ja) | 基板を被覆あるいはエッチングする装置 | |
| KR101045621B1 (ko) | 정전척 및 상기 정전척을 이용한 기판의 바이어스 전압 측정방법 | |
| JP5640135B2 (ja) | プラズマ処理装置 | |
| JP2011124295A (ja) | プラズマ処理装置 | |
| KR100727263B1 (ko) | 플라즈마 처리 장치 및 그 구동 방법 | |
| KR200426498Y1 (ko) | 플라즈마 공정 챔버에서 이용하기 위한 프로세스 키트 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| G170 | Re-publication after modification of scope of protection [patent] | ||
| PG1701 | Publication of correction |
St.27 status event code: A-5-5-P10-P19-oth-PG1701 Patent document republication publication date: 20080417 Republication note text: Request for Correction Notice (Document Request) Gazette number: 1007575280000 Gazette reference publication date: 20070911 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20120821 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20130819 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20140826 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20150730 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20160818 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20170823 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20180816 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20190819 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 17 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 18 |
|
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20250301 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |