TWI290345B - Plasma processing method and plasma processing apparatus - Google Patents

Plasma processing method and plasma processing apparatus Download PDF

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Publication number
TWI290345B
TWI290345B TW094105872A TW94105872A TWI290345B TW I290345 B TWI290345 B TW I290345B TW 094105872 A TW094105872 A TW 094105872A TW 94105872 A TW94105872 A TW 94105872A TW I290345 B TWI290345 B TW I290345B
Authority
TW
Taiwan
Prior art keywords
plasma
voltage
electrode
electrostatic adsorption
peak
Prior art date
Application number
TW094105872A
Other languages
English (en)
Chinese (zh)
Other versions
TW200627540A (en
Inventor
Hiroaki Ishimura
Ken Yoshioka
Takahiro Abe
Go Saito
Motohiko Yoshigai
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW200627540A publication Critical patent/TW200627540A/zh
Application granted granted Critical
Publication of TWI290345B publication Critical patent/TWI290345B/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/04—Roasting apparatus with movably-mounted food supports or with movable heating implements; Spits
    • A47J37/041—Roasting apparatus with movably-mounted food supports or with movable heating implements; Spits with food supports rotating about a horizontal axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H01J37/32706—Polarising the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0786—Accessories
    • A47J2037/0795—Adjustable food supports, e.g. for height adjustment
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0704—Roasting devices for outdoor use; Barbecues with horizontal fire box
    • A47J37/0713—Roasting devices for outdoor use; Barbecues with horizontal fire box with gas burners
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0745—Roasting devices for outdoor use; Barbecues with motor-driven food supports
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0786—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW094105872A 2005-01-28 2005-02-25 Plasma processing method and plasma processing apparatus TWI290345B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005022112A JP4468194B2 (ja) 2005-01-28 2005-01-28 プラズマ処理方法およびプラズマ処理装置

Publications (2)

Publication Number Publication Date
TW200627540A TW200627540A (en) 2006-08-01
TWI290345B true TWI290345B (en) 2007-11-21

Family

ID=36756289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105872A TWI290345B (en) 2005-01-28 2005-02-25 Plasma processing method and plasma processing apparatus

Country Status (4)

Country Link
US (1) US7224568B2 (https=)
JP (1) JP4468194B2 (https=)
KR (1) KR100757528B1 (https=)
TW (1) TWI290345B (https=)

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* Cited by examiner, † Cited by third party
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JP5094002B2 (ja) * 2005-09-06 2012-12-12 ルネサスエレクトロニクス株式会社 プラズマ処理装置およびその異常放電抑止方法
JP5372419B2 (ja) 2008-06-25 2013-12-18 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
DE102008036766B4 (de) * 2008-08-07 2013-08-01 Alexander Gschwandtner Vorrichtung und Verfahren zum Erzeugen dielektrischer Schichten im Mikrowellenplasma
US9063356B2 (en) 2008-09-05 2015-06-23 Japan Display Inc. Method for repairing display device and apparatus for same
US11615941B2 (en) 2009-05-01 2023-03-28 Advanced Energy Industries, Inc. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US9767988B2 (en) 2010-08-29 2017-09-19 Advanced Energy Industries, Inc. Method of controlling the switched mode ion energy distribution system
JP2011187881A (ja) * 2010-03-11 2011-09-22 Hitachi High-Technologies Corp プラズマ処理装置および方法
US9685297B2 (en) 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
KR102168064B1 (ko) * 2013-02-20 2020-10-20 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리 방법
JP6357436B2 (ja) 2014-07-25 2018-07-11 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR101677748B1 (ko) 2014-10-29 2016-11-29 삼성전자 주식회사 펄스 플라즈마 장치 및 펄스 플라즈마 장치 구동 방법
US9779919B2 (en) 2015-01-09 2017-10-03 Hitachi High-Technologies Corporation Plasma processing apparatus and plasma processing method
JP6567943B2 (ja) 2015-01-09 2019-08-28 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6396822B2 (ja) * 2015-02-16 2018-09-26 東京エレクトロン株式会社 プラズマ処理装置のサセプタの電位を制御する方法
US9824857B2 (en) * 2016-01-14 2017-11-21 Varian Semiconductor Equipment Associates, Inc. Method for implantation of semiconductor wafers having high bulk resistivity
US10535505B2 (en) * 2016-11-11 2020-01-14 Lam Research Corporation Plasma light up suppression
CN111788654B (zh) 2017-11-17 2023-04-14 先进工程解决方案全球控股私人有限公司 等离子体处理系统中的调制电源的改进应用
WO2019099925A1 (en) 2017-11-17 2019-05-23 Advanced Energy Industries, Inc. Spatial and temporal control of ion bias voltage for plasma processing
US12230476B2 (en) 2017-11-17 2025-02-18 Advanced Energy Industries, Inc. Integrated control of a plasma processing system
US12505986B2 (en) 2017-11-17 2025-12-23 Advanced Energy Industries, Inc. Synchronization of plasma processing components
US11437221B2 (en) 2017-11-17 2022-09-06 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
EP3711080B1 (en) 2017-11-17 2023-06-21 AES Global Holdings, Pte. Ltd. Synchronized pulsing of plasma processing source and substrate bias
KR102524810B1 (ko) 2017-12-26 2023-04-24 삼성전자주식회사 반도체 공정의 제어 방법
TWI869392B (zh) * 2019-04-15 2025-01-11 美商應用材料股份有限公司 處理基板的方法
WO2021011450A1 (en) 2019-07-12 2021-01-21 Advanced Energy Industries, Inc. Bias supply with a single controlled switch
US12125674B2 (en) 2020-05-11 2024-10-22 Advanced Energy Industries, Inc. Surface charge and power feedback and control using a switch mode bias system
CN115250648B (zh) * 2021-02-25 2025-11-11 株式会社日立高新技术 等离子处理装置
JP7648498B2 (ja) * 2021-10-07 2025-03-18 東京エレクトロン株式会社 制御プログラム、制御方法、及びプラズマ処理装置
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply
US12567572B2 (en) 2023-07-11 2026-03-03 Advanced Energy Industries, Inc. Plasma behaviors predicted by current measurements during asymmetric bias waveform application

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Publication number Priority date Publication date Assignee Title
US5557215A (en) 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
US5737177A (en) * 1996-10-17 1998-04-07 Applied Materials, Inc. Apparatus and method for actively controlling the DC potential of a cathode pedestal
US6367413B1 (en) * 1999-06-15 2002-04-09 Tokyo Electron Limited Apparatus for monitoring substrate biasing during plasma processing of a substrate

Also Published As

Publication number Publication date
TW200627540A (en) 2006-08-01
JP2006210726A (ja) 2006-08-10
US7224568B2 (en) 2007-05-29
JP4468194B2 (ja) 2010-05-26
US20060171093A1 (en) 2006-08-03
KR20060087358A (ko) 2006-08-02
KR100757528B1 (ko) 2007-09-11

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