KR100752429B1 - 기판 캐리어 - Google Patents
기판 캐리어 Download PDFInfo
- Publication number
- KR100752429B1 KR100752429B1 KR1020060026709A KR20060026709A KR100752429B1 KR 100752429 B1 KR100752429 B1 KR 100752429B1 KR 1020060026709 A KR1020060026709 A KR 1020060026709A KR 20060026709 A KR20060026709 A KR 20060026709A KR 100752429 B1 KR100752429 B1 KR 100752429B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H12/00—Towers; Masts or poles; Chimney stacks; Water-towers; Methods of erecting such structures
- E04H12/22—Sockets or holders for poles or posts
- E04H12/2238—Sockets or holders for poles or posts to be placed on the ground
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
- C03B35/202—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames by supporting frames
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/34—Masking
Abstract
Description
Claims (10)
- 적어도 일부 영역이 기판의 열팽창 계수보다 큰 열팽창 계수를 갖는 소재로 구성되는 기판 캐리어에 있어서,상기 캐리어(1)의 특정 영역에 웹(17)이 중심을 맞추어 고정되며, 상기 웹(17)의 열 팽창 계수는 상기 웹(17)이 고정되는 영역의 열 팽창 계수보다 작은 것을 특징으로 하는 기판 캐리어.
- 제1항에 있어서,상기 웹(17)은 그 양단에 돌출부들(18,19)을 가지고, 상기 돌출부들(18,19) 사이에 상기 기판(2)의 일단이 위치되는 것을 특징으로 하는 캐리어.
- 제1항에 있어서,상기 캐리어(1)는 프레임 형태로 형성되는 것을 특징으로 하는 캐리어.
- 제1항에 있어서,상기 캐리어(1)의 적어도 일부분(5,6)은 알루미늄으로 구성되는 것을 특징으 로 하는 캐리어.
- 제1항에 있어서,2개의 수직 웹(3,4) 및 2개의 수평판(5,6)을 포함하며, 상기 수평판(5,6)은 알루미늄으로 구성되는 것을 특징으로 하는 캐리어.
- 제5항에 있어서,상기 2개의 수직 웹(3,4)은 티타늄으로 구성되는 것을 특징으로 하는 캐리어.
- 제1항에 있어서,상기 기판(2)은 유리판인 것을 특징으로 하는 캐리어.
- 제1항에 있어서,상기 캐리어(1)에 고정되는 웹(17)은 티타늄으로 구성되는 것을 특징으로 하는 캐리어.
- 제5항에 있어서,상기 캐리어(1)의 수평판(5,6)은 수직 웹(3,4)의 단부에 연결되며, 상기 웹(17)은 상기 수평판들 중 하부 수평판(6)에 중심을 맞춰 연결되는 것을 특징으로 하는 캐리어.
- 제9항에 있어서,상기 웹(17)이 배치되는 수평판(6)은 상기 웹(17)을 위한 수평 가이드를 포함하는 것을 특징으로 하는 캐리어.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005045718A DE102005045718B4 (de) | 2005-09-24 | 2005-09-24 | Träger für ein Substrat |
DE102005045718.5 | 2005-09-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070034416A KR20070034416A (ko) | 2007-03-28 |
KR100752429B1 true KR100752429B1 (ko) | 2007-08-28 |
Family
ID=37852494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060026709A KR100752429B1 (ko) | 2005-09-24 | 2006-03-23 | 기판 캐리어 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8083912B2 (ko) |
JP (1) | JP4607024B2 (ko) |
KR (1) | KR100752429B1 (ko) |
CN (1) | CN1936071B (ko) |
DE (1) | DE102005045718B4 (ko) |
TW (1) | TWI306905B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2423350B1 (en) * | 2010-08-27 | 2013-07-31 | Applied Materials, Inc. | Carrier for a substrate and a method for assembling the same |
KR101029937B1 (ko) * | 2010-09-24 | 2011-04-19 | 김철수 | 캐리어 프레임 구조 |
CN102615605A (zh) * | 2011-01-31 | 2012-08-01 | 进准光学(江苏)有限公司 | 夹具 |
GB2489474A (en) * | 2011-03-29 | 2012-10-03 | Kromek Ltd | Crystal growth apparatus |
TWI491755B (zh) * | 2011-12-13 | 2015-07-11 | 聯華電子股份有限公司 | 基材載具及其應用 |
TW201424873A (zh) * | 2012-12-21 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | 清洗裝置 |
KR101488879B1 (ko) * | 2013-01-18 | 2015-02-04 | 주식회사 대고테크 | 캐리어 프레임 구조 |
WO2017170125A1 (ja) * | 2016-03-29 | 2017-10-05 | 株式会社アルバック | 透明導電膜付き基板の製造方法、透明導電膜付き基板の製造装置、透明導電膜付き基板、及び太陽電池 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050060733A (ko) * | 2003-12-17 | 2005-06-22 | 삼성전자주식회사 | 캐리어 기판, 이를 이용한 플라스틱 기판의 적층 방법 및유연한 디스플레이 장치의 제조 방법 |
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JPH04325679A (ja) * | 1991-04-26 | 1992-11-16 | Vacuum Metallurgical Co Ltd | 基板ホルダー |
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JPH05230651A (ja) * | 1992-02-24 | 1993-09-07 | Nikon Corp | スパッタ成膜基板ホルダ− |
JPH07102366A (ja) * | 1993-10-01 | 1995-04-18 | Vacuum Metallurgical Co Ltd | 薄膜形成装置 |
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JPH09217173A (ja) * | 1996-02-14 | 1997-08-19 | Nissin Electric Co Ltd | 基板保持装置およびそれへの基板装着方法 |
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JP2001525997A (ja) * | 1997-05-20 | 2001-12-11 | 東京エレクトロン株式会社 | 処理装置 |
JP2000129441A (ja) * | 1998-10-27 | 2000-05-09 | Read Rite Smi Kk | スパッタリング装置における基板保持方法、並びに、プラズマ雰囲気中で基板表面に薄膜を形成する装置の基板ホルダー |
US6168668B1 (en) * | 1998-11-25 | 2001-01-02 | Applied Materials, Inc. | Shadow ring and guide for supporting the shadow ring in a chamber |
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JP2006117995A (ja) * | 2004-10-21 | 2006-05-11 | Alps Electric Co Ltd | スパッタ装置 |
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2005
- 2005-09-24 DE DE102005045718A patent/DE102005045718B4/de active Active
- 2005-10-20 US US11/254,426 patent/US8083912B2/en active Active
- 2005-12-23 TW TW094146027A patent/TWI306905B/zh active
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2006
- 2006-01-17 CN CN2006100014457A patent/CN1936071B/zh active Active
- 2006-01-25 JP JP2006015759A patent/JP4607024B2/ja active Active
- 2006-03-23 KR KR1020060026709A patent/KR100752429B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050060733A (ko) * | 2003-12-17 | 2005-06-22 | 삼성전자주식회사 | 캐리어 기판, 이를 이용한 플라스틱 기판의 적층 방법 및유연한 디스플레이 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN1936071B (zh) | 2010-05-12 |
KR20070034416A (ko) | 2007-03-28 |
TWI306905B (en) | 2009-03-01 |
JP2007088408A (ja) | 2007-04-05 |
TW200712241A (en) | 2007-04-01 |
DE102005045718A1 (de) | 2007-04-05 |
JP4607024B2 (ja) | 2011-01-05 |
US20070069351A1 (en) | 2007-03-29 |
CN1936071A (zh) | 2007-03-28 |
US8083912B2 (en) | 2011-12-27 |
DE102005045718B4 (de) | 2009-06-25 |
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