KR100752009B1 - Ｌｅｄ가 구비된 백라이트유닛 - Google Patents

Ｌｅｄ가 구비된 백라이트유닛 Download PDF

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Publication number
KR100752009B1
KR100752009B1 KR1020060021010A KR20060021010A KR100752009B1 KR 100752009 B1 KR100752009 B1 KR 100752009B1 KR 1020060021010 A KR1020060021010 A KR 1020060021010A KR 20060021010 A KR20060021010 A KR 20060021010A KR 100752009 B1 KR100752009 B1 KR 100752009B1
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KR
South Korea
Prior art keywords
diffusion plate
insulating substrate
backlight unit
led
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020060021010A
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English (en)
Korean (ko)
Inventor
정기호
권재욱
김동진
양윤탁
윤형원
이현호
박정훈
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020060021010A priority Critical patent/KR100752009B1/ko
Priority to EP09178293.8A priority patent/EP2170024B1/en
Priority to EP07103453A priority patent/EP1833101A3/en
Priority to DE202007019142U priority patent/DE202007019142U1/de
Priority to CNB2007100867098A priority patent/CN100517025C/zh
Priority to US11/714,193 priority patent/US7795635B2/en
Priority to JP2007055384A priority patent/JP4794481B2/ja
Application granted granted Critical
Publication of KR100752009B1 publication Critical patent/KR100752009B1/ko
Priority to US12/693,994 priority patent/US8053804B2/en
Priority to JP2010016653A priority patent/JP4856767B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
KR1020060021010A 2006-03-06 2006-03-06 Ｌｅｄ가 구비된 백라이트유닛 Active KR100752009B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020060021010A KR100752009B1 (ko) 2006-03-06 2006-03-06 Ｌｅｄ가 구비된 백라이트유닛
EP07103453A EP1833101A3 (en) 2006-03-06 2007-03-02 Backlight unit equipped with light emitting diodes
DE202007019142U DE202007019142U1 (de) 2006-03-06 2007-03-02 Mit Leuchtdioden ausgestattete Hinterleuchtungseinheit
EP09178293.8A EP2170024B1 (en) 2006-03-06 2007-03-02 Backlight unit equipped with light emitting diodes
CNB2007100867098A CN100517025C (zh) 2006-03-06 2007-03-06 装备有发光二极管的背光装置
US11/714,193 US7795635B2 (en) 2006-03-06 2007-03-06 Backlight unit equipped with light emitting diodes
JP2007055384A JP4794481B2 (ja) 2006-03-06 2007-03-06 バックライトユニット
US12/693,994 US8053804B2 (en) 2006-03-06 2010-01-26 Backlight unit equipped with light emitting diodes
JP2010016653A JP4856767B2 (ja) 2006-03-06 2010-01-28 バックライトユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060021010A KR100752009B1 (ko) 2006-03-06 2006-03-06 Ｌｅｄ가 구비된 백라이트유닛

Publications (1)

Publication Number Publication Date
KR100752009B1 true KR100752009B1 (ko) 2007-08-28

Family

ID=38179643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060021010A Active KR100752009B1 (ko) 2006-03-06 2006-03-06 Ｌｅｄ가 구비된 백라이트유닛

Country Status (6)

Country Link
US (2) US7795635B2 (enExample)
EP (2) EP2170024B1 (enExample)
JP (2) JP4794481B2 (enExample)
KR (1) KR100752009B1 (enExample)
CN (1) CN100517025C (enExample)
DE (1) DE202007019142U1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101476422B1 (ko) * 2008-06-30 2014-12-26 서울반도체 주식회사 인쇄회로기판 및 그를 이용한 ｌｅｄ 모듈

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100855065B1 (ko) * 2007-04-24 2008-08-29 삼성전기주식회사 발광 다이오드 패키지
JP5033688B2 (ja) * 2008-03-18 2012-09-26 株式会社リコー 光源装置、光走査装置及び画像形成装置
JP5391767B2 (ja) * 2008-05-30 2014-01-15 東芝ライテック株式会社 発光装置及び照明器具
JP5286206B2 (ja) * 2009-09-11 2013-09-11 日立コンシューマエレクトロニクス株式会社 液晶表示装置
WO2011148694A1 (ja) * 2010-05-25 2011-12-01 シャープ株式会社 照明装置、表示装置、及びテレビ受信装置
KR101136316B1 (ko) * 2010-07-09 2012-04-19 율촌화학 주식회사 Ｌｅｄ 백라이트 유닛
KR101775671B1 (ko) * 2010-09-29 2017-09-20 삼성디스플레이 주식회사 발광다이오드 패키지를 갖는 백라이트 어셈블리 및 이를 갖는 표시장치
CN102734654A (zh) * 2011-04-12 2012-10-17 上海矽卓电子科技有限公司 一种高功率led日光灯及散热方法
DE102011112081A1 (de) 2011-05-11 2015-08-20 Entex Rust & Mitschke Gmbh Verfahren zur Verarbeitung von Elasten
WO2014056553A1 (de) 2012-10-11 2014-04-17 Entex Gmbh Rust & Mitschke Gmbh Extruder zur verarbeitung von kunststoffen, die zum kleben neigen
KR102108214B1 (ko) * 2013-06-12 2020-05-07 엘지디스플레이 주식회사 발광다이오드어셈블리 및 그를 포함한 액정표시장치
DE102017001093A1 (de) 2016-04-07 2017-10-26 Entex Rust & Mitschke Gmbh Entgasen bei der Extrusion von Kunststoffen mit Filterscheiben aus Sintermetall
DE102015001167A1 (de) 2015-02-02 2016-08-04 Entex Rust & Mitschke Gmbh Entgasen bei der Extrusion von Kunststoffen
DE102016002143A1 (de) 2016-02-25 2017-08-31 Entex Rust & Mitschke Gmbh Füllteilmodul in Planetwalzenextruderbauweise
KR102687092B1 (ko) * 2016-10-27 2024-07-22 엘지디스플레이 주식회사 표시장치 및 그 제조방법
DE102017006638A1 (de) 2017-07-13 2019-01-17 Entex Rust & Mitschke Gmbh Füllteilmodul in Planetwalzenextruderbauweise
WO2019166125A1 (de) 2018-02-28 2019-09-06 Entex Rust & Mitschke Gmbh Verfahren zur herstellung und verarbeitung von polymeren und polymermischungen in einem modular aufgebauten planetwalzenextruder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050117414A (ko) * 2004-06-10 2005-12-14 엘지전자 주식회사 고출력 ｌｅｄ 패키지

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257786A (ja) * 1986-05-02 1987-11-10 株式会社日立製作所 プリント配線基板
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
JP3506547B2 (ja) * 1995-10-20 2004-03-15 シチズン時計株式会社 半導体装置
JPH09214077A (ja) * 1996-02-02 1997-08-15 Toshiba Electric Appliance Co Ltd プリント回路基板の製造方法及びその放熱構造
JPH1140901A (ja) * 1997-07-23 1999-02-12 Sharp Corp 回路基板
JPH11233891A (ja) * 1998-02-12 1999-08-27 Oki Electric Ind Co Ltd 半導体発光装置およびその製造方法
JP2000164774A (ja) * 1998-11-26 2000-06-16 Sony Corp 半導体装置及びその製造方法
US6065823A (en) * 1999-04-16 2000-05-23 Hewlett-Packard Company Heat spreader for ink-jet printhead
JP2002026206A (ja) * 2000-07-12 2002-01-25 Matsushita Electric Ind Co Ltd 放熱装置
DE10214363A1 (de) * 2002-03-30 2003-10-16 Bosch Gmbh Robert Kühlanordnung und Elektrogerät mit einer Kühlanordnung
US6977396B2 (en) * 2003-02-19 2005-12-20 Lumileds Lighting U.S., Llc High-powered light emitting device with improved thermal properties
US20040184272A1 (en) * 2003-03-20 2004-09-23 Wright Steven A. Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same
US6920046B2 (en) * 2003-06-25 2005-07-19 Eaton Corporation Dissipating heat in an array of circuit components
CN100411204C (zh) * 2003-06-30 2008-08-13 皇家飞利浦电子股份有限公司 发光二极管热管理系统
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
JP4160881B2 (ja) * 2003-08-28 2008-10-08 松下電器産業株式会社 半導体発光装置、発光モジュール、照明装置、および半導体発光装置の製造方法
US7816863B2 (en) * 2003-09-12 2010-10-19 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method for manufacturing the same
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
JP2005283852A (ja) * 2004-03-29 2005-10-13 Kyocera Corp 液晶表示装置
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7241030B2 (en) * 2004-07-30 2007-07-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Illumination apparatus and method
KR100624090B1 (ko) 2004-09-02 2006-09-20 (주)트윈 세이버 통풍 가능한 베개

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050117414A (ko) * 2004-06-10 2005-12-14 엘지전자 주식회사 고출력 ｌｅｄ 패키지

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
10-2005-117414

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101476422B1 (ko) * 2008-06-30 2014-12-26 서울반도체 주식회사 인쇄회로기판 및 그를 이용한 ｌｅｄ 모듈

Also Published As

Publication number Publication date
DE202007019142U1 (de) 2010-09-23
CN101034233A (zh) 2007-09-12
US8053804B2 (en) 2011-11-08
US20100127281A1 (en) 2010-05-27
EP2170024A2 (en) 2010-03-31
EP1833101A3 (en) 2011-03-09
JP4856767B2 (ja) 2012-01-18
EP2170024B1 (en) 2017-08-09
US20070221941A1 (en) 2007-09-27
JP2010103126A (ja) 2010-05-06
JP2007242617A (ja) 2007-09-20
EP1833101A2 (en) 2007-09-12
US7795635B2 (en) 2010-09-14
JP4794481B2 (ja) 2011-10-19
CN100517025C (zh) 2009-07-22
EP2170024A3 (en) 2011-03-09

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