KR100751453B1 - 표시장치와 이의 제조방법 - Google Patents

표시장치와 이의 제조방법 Download PDF

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Publication number
KR100751453B1
KR100751453B1 KR1020060053520A KR20060053520A KR100751453B1 KR 100751453 B1 KR100751453 B1 KR 100751453B1 KR 1020060053520 A KR1020060053520 A KR 1020060053520A KR 20060053520 A KR20060053520 A KR 20060053520A KR 100751453 B1 KR100751453 B1 KR 100751453B1
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South Korea
Prior art keywords
resin layer
insulating substrate
layer
encapsulation layer
foil
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Expired - Fee Related
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KR1020060053520A
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English (en)
Korean (ko)
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구원회
김훈
최정미
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삼성전자주식회사
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Priority to KR1020060053520A priority Critical patent/KR100751453B1/ko
Priority to JP2007124986A priority patent/JP4960762B2/ja
Priority to US11/753,213 priority patent/US7986096B2/en
Priority to CN2007101091224A priority patent/CN101090131B/zh
Application granted granted Critical
Publication of KR100751453B1 publication Critical patent/KR100751453B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020060053520A 2006-06-14 2006-06-14 표시장치와 이의 제조방법 Expired - Fee Related KR100751453B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060053520A KR100751453B1 (ko) 2006-06-14 2006-06-14 표시장치와 이의 제조방법
JP2007124986A JP4960762B2 (ja) 2006-06-14 2007-05-09 表示装置とその製造方法
US11/753,213 US7986096B2 (en) 2006-06-14 2007-05-24 Display device with minimized infiltration of oxygen and moisture and manufacturing method thereof
CN2007101091224A CN101090131B (zh) 2006-06-14 2007-06-12 显示装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060053520A KR100751453B1 (ko) 2006-06-14 2006-06-14 표시장치와 이의 제조방법

Publications (1)

Publication Number Publication Date
KR100751453B1 true KR100751453B1 (ko) 2007-08-23

Family

ID=38615135

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060053520A Expired - Fee Related KR100751453B1 (ko) 2006-06-14 2006-06-14 표시장치와 이의 제조방법

Country Status (4)

Country Link
US (1) US7986096B2 (enExample)
JP (1) JP4960762B2 (enExample)
KR (1) KR100751453B1 (enExample)
CN (1) CN101090131B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140060601A (ko) * 2012-11-09 2014-05-21 엘지디스플레이 주식회사 플렉서블 유기전계발광소자 및 그 제조방법
KR101491156B1 (ko) * 2008-10-30 2015-02-06 엘지디스플레이 주식회사 유기전계발광표시장치
CN105374946A (zh) * 2015-11-18 2016-03-02 上海天马微电子有限公司 一种柔性显示装置及其制备方法

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
JP2010528417A (ja) * 2007-05-24 2010-08-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 電子薄膜素子のための封入部
WO2009104563A1 (ja) * 2008-02-20 2009-08-27 富士電機ホールディングス株式会社 有機ｅｌディスプレイおよびその製造方法
EP2434840A1 (en) * 2008-04-22 2012-03-28 Zeon Corporation Organic electroluminescent light source
US8766269B2 (en) * 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
JP5765307B2 (ja) * 2012-09-06 2015-08-19 トヨタ自動車株式会社 燃料電池の製造方法
JP2014170686A (ja) * 2013-03-04 2014-09-18 Toshiba Corp 表示素子の製造方法、表示素子及び表示装置
US9627338B2 (en) * 2013-03-06 2017-04-18 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming ultra high density embedded semiconductor die package
KR102262598B1 (ko) * 2014-09-03 2021-06-09 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
KR102351024B1 (ko) * 2015-01-26 2022-01-13 엘지디스플레이 주식회사 유기발광 다이오드 표시장치
WO2016163367A1 (ja) * 2015-04-09 2016-10-13 シャープ株式会社 Ｅｌ表示装置およびｅｌ表示装置の製造方法
KR102517446B1 (ko) * 2015-12-02 2023-04-04 엘지디스플레이 주식회사 표시장치 및 그 제조방법
DE102016108195A1 (de) * 2016-05-03 2017-11-09 Osram Oled Gmbh Verfahren zum herstellen eines organischen optoelektronischen bauelements und organisches optoelektronisches bauelement
CN108963103B (zh) * 2018-06-28 2020-07-10 武汉华星光电半导体显示技术有限公司 Oled显示面板

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KR20050002572A (ko) * 2003-06-27 2005-01-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 그의 제작방법

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US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
JPH09204981A (ja) * 1996-01-26 1997-08-05 Nippon Steel Chem Co Ltd 有機ｅｌ素子
TW495812B (en) * 2000-03-06 2002-07-21 Semiconductor Energy Lab Thin film forming device, method of forming a thin film, and self-light-emitting device
KR100370921B1 (ko) 2000-12-07 2003-02-05 주식회사 엘리아테크 이중 경화공정에 의한 유기 전계 발광 표시패널 및 그제조방법
KR100500607B1 (ko) 2001-11-21 2005-07-11 주식회사 비스톰 전계발광소자의 봉지용 접착성 필름 및 이를 이용한봉지방법
KR100462469B1 (ko) 2002-04-17 2004-12-17 한국전자통신연구원 접착식 유기-무기 복합막을 갖춘 엔캡슐레이션 박막과이를 포함하는 유기 전기발광 소자
KR20030096518A (ko) 2002-06-12 2003-12-31 주식회사 엘리아테크 유기 이엘 패널 및 그의 패키징 방법
JP3884351B2 (ja) * 2002-08-26 2007-02-21 株式会社 日立ディスプレイズ 画像表示装置およびその製造方法
JP2004171806A (ja) 2002-11-18 2004-06-17 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子
KR100528326B1 (ko) * 2002-12-31 2005-11-15 삼성전자주식회사 가요성 기판 상에 보호캡을 구비하는 박막 반도체 소자 및 이를 이용하는 전자장치 및 그 제조방법
JP4520226B2 (ja) * 2003-06-27 2010-08-04 株式会社半導体エネルギー研究所 表示装置及び表示装置の作製方法
JP4479381B2 (ja) * 2003-09-24 2010-06-09 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
KR101095293B1 (ko) * 2003-11-28 2011-12-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 제조 방법
KR101061730B1 (ko) * 2003-11-28 2011-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 그 제조 방법
JP4689249B2 (ja) * 2003-11-28 2011-05-25 株式会社半導体エネルギー研究所 表示装置の作製方法
US7084045B2 (en) * 2003-12-12 2006-08-01 Seminconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4776949B2 (ja) * 2004-03-16 2011-09-21 株式会社半導体エネルギー研究所 発光装置
JP2005293946A (ja) * 2004-03-31 2005-10-20 Sanyo Electric Co Ltd 有機ｅｌ表示装置
TWI367686B (en) * 2004-04-07 2012-07-01 Semiconductor Energy Lab Light emitting device, electronic device, and television device
JP2005302401A (ja) 2004-04-08 2005-10-27 Three Bond Co Ltd 有機ｅｌ素子封止材
KR101424784B1 (ko) * 2006-01-10 2014-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 그의 제조방법

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491156B1 (ko) * 2008-10-30 2015-02-06 엘지디스플레이 주식회사 유기전계발광표시장치
KR20140060601A (ko) * 2012-11-09 2014-05-21 엘지디스플레이 주식회사 플렉서블 유기전계발광소자 및 그 제조방법
KR101967600B1 (ko) * 2012-11-09 2019-04-10 엘지디스플레이 주식회사 플렉서블 유기전계발광소자 및 그 제조방법
CN105374946A (zh) * 2015-11-18 2016-03-02 上海天马微电子有限公司 一种柔性显示装置及其制备方法

Also Published As

Publication number Publication date
JP2007335403A (ja) 2007-12-27
JP4960762B2 (ja) 2012-06-27
US7986096B2 (en) 2011-07-26
US20070291215A1 (en) 2007-12-20
CN101090131B (zh) 2012-01-04
CN101090131A (zh) 2007-12-19

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