KR100690930B1 - 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법 - Google Patents

깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법 Download PDF

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KR100690930B1
KR100690930B1 KR1020060039985A KR20060039985A KR100690930B1 KR 100690930 B1 KR100690930 B1 KR 100690930B1 KR 1020060039985 A KR1020060039985 A KR 1020060039985A KR 20060039985 A KR20060039985 A KR 20060039985A KR 100690930 B1 KR100690930 B1 KR 100690930B1
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South Korea
Prior art keywords
pattern
sacrificial film
aspect ratio
forming
high aspect
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English (en)
Korean (ko)
Inventor
신동윤
김동수
김충환
이택민
조정대
최병오
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한국기계연구원
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Priority to KR1020060039985A priority Critical patent/KR100690930B1/ko
Priority to DE102006058559A priority patent/DE102006058559B4/de
Priority to US11/612,636 priority patent/US7517467B2/en
Priority to JP2006341983A priority patent/JP5289703B2/ja
Application granted granted Critical
Publication of KR100690930B1 publication Critical patent/KR100690930B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020060039985A 2006-05-03 2006-05-03 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법 Active KR100690930B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060039985A KR100690930B1 (ko) 2006-05-03 2006-05-03 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법
DE102006058559A DE102006058559B4 (de) 2006-05-03 2006-12-12 Verfahren zur Bildung hochaufgelöster Strukturen mit gewünschter Dicke oder hohem Aspektverhältnis mittels tiefer Ablation
US11/612,636 US7517467B2 (en) 2006-05-03 2006-12-19 Method for forming high-resolution pattern having desired thickness or high aspect ratio using deep ablation
JP2006341983A JP5289703B2 (ja) 2006-05-03 2006-12-19 高解像度パターンの形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060039985A KR100690930B1 (ko) 2006-05-03 2006-05-03 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법

Publications (1)

Publication Number Publication Date
KR100690930B1 true KR100690930B1 (ko) 2007-03-09

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Family Applications (1)

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Country Status (4)

Country Link
US (1) US7517467B2 (https=)
JP (1) JP5289703B2 (https=)
KR (1) KR100690930B1 (https=)
DE (1) DE102006058559B4 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101654519B1 (ko) * 2015-04-14 2016-09-06 서울대학교 산학협력단 나노스케일 3차원 구조 제작 장치 및 방법
KR20180083332A (ko) * 2015-10-15 2018-07-20 보드 오브 리전츠 더 유니버시티 오브 텍사스 시스템 정밀 나노스케일 제조를 위한 다목적 프로세스

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US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
US8053168B2 (en) * 2006-12-19 2011-11-08 Palo Alto Research Center Incorporated Printing plate and system using heat-decomposable polymers
JP4873160B2 (ja) * 2007-02-08 2012-02-08 トヨタ自動車株式会社 接合方法
DE102007007183A1 (de) * 2007-02-14 2008-08-21 Man Roland Druckmaschinen Ag Verfahren zur Herstellung von Druckformen
US20090107546A1 (en) * 2007-10-29 2009-04-30 Palo Alto Research Center Incorporated Co-extruded compositions for high aspect ratio structures
US8013300B2 (en) * 2008-06-20 2011-09-06 Carl Zeiss Nts, Llc Sample decontamination
US8200106B2 (en) * 2009-06-11 2012-06-12 Canon Kabushiki Kaisha Image forming apparatus with image forming condition control feature based on difference in patch densities
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
MX2012006706A (es) * 2009-12-16 2012-07-03 Hoffmann La Roche Deteccion de la descomposicion de las enzimas en un elemento de prueba mediante la liberacion controlada de analito protegido.
US9472787B2 (en) 2011-05-23 2016-10-18 Oledworks Gmbh Fabrication apparatus for fabricating a patterned layer
GB2508915A (en) * 2012-12-14 2014-06-18 Mahle Int Gmbh A thrust washer for a sliding bearing
EP3041890A1 (en) * 2013-09-06 2016-07-13 Solvay Specialty Polymers Italy S.p.A. Electrically conducting assemblies
CA2955373A1 (en) * 2014-08-01 2016-02-04 Western Michigan University Research Foundation Self-supported electronic devices
CN106660355B (zh) 2014-08-27 2019-10-11 3M创新有限公司 电多层层合转印膜
EP3159740B1 (de) * 2015-10-22 2018-08-01 Flint Group Germany GmbH Verfahren zu generativen herstellung von reliefdruckformen
JP6678430B2 (ja) * 2015-11-06 2020-04-08 株式会社Ｎｂｃメッシュテック スクリーン印刷による薄膜細線パターンの形成方法
CN105293937A (zh) * 2015-11-29 2016-02-03 杭州柳茶医药科技有限公司 一种防水玻璃及其制作工艺
WO2017142958A1 (en) * 2016-02-15 2017-08-24 Newport Corporation Method of selectively varying the wetting characteristics of a surface
US10746612B2 (en) 2016-11-30 2020-08-18 The Board Of Trustees Of Western Michigan University Metal-metal composite ink and methods for forming conductive patterns
KR102402471B1 (ko) * 2020-12-22 2022-05-26 주식회사 셀코스 표면 코팅의 균일도 향상을 위한 코팅 방법

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JPH0722732A (ja) * 1993-06-30 1995-01-24 Sumitomo Metal Ind Ltd 微細配線の形成方法
US5580511A (en) 1990-01-25 1996-12-03 Dai Nippon Insatsu Kabushiki Kaisha Method of forming thick film pattern and material for forming thick film pattern
JPH1171130A (ja) 1997-08-26 1999-03-16 Taiyo Ink Mfg Ltd ガラスペースト組成物及びそれを用いたプラズマディスプレイパネルの背面板の製造方法
US6120975A (en) 1997-11-04 2000-09-19 Taiyo Ink Manufacturing Co., Ltd. Methods for production of a plasma display panel

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US6756181B2 (en) * 1993-06-25 2004-06-29 Polyfibron Technologies, Inc. Laser imaged printing plates
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
JPH0794848A (ja) * 1993-09-27 1995-04-07 Sumitomo Kinzoku Ceramics:Kk 導体層パターンの形成方法
KR100660384B1 (ko) * 1998-03-17 2006-12-21 세이코 엡슨 가부시키가이샤 표시장치의 제조방법
JPH11297213A (ja) * 1998-04-09 1999-10-29 Dainippon Printing Co Ltd プラズマディスプレイパネル用蛍光面とその形成方法
JP2000260309A (ja) * 1999-03-05 2000-09-22 Matsushita Electric Ind Co Ltd ガス放電パネルの製造方法
JP3982231B2 (ja) * 2001-10-19 2007-09-26 セイコーエプソン株式会社 カラーフィルタの製造方法とカラーフィルタ及び液晶装置並びに電子機器
JP2005285616A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 薄膜形成方法、電気光学装置の製造方法、カラーフィルタの製造方法および液滴吐出装置
JP2006024695A (ja) * 2004-07-07 2006-01-26 Nec Lcd Technologies Ltd ナノ粒子インクを用いた配線形成方法
JP2008511433A (ja) * 2004-09-03 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ パターンを設置する方法および機器ならびにそのようなパターンを備える素子および装置
JP2006073450A (ja) * 2004-09-06 2006-03-16 Idemitsu Kosan Co Ltd 色変換基板及びその製造方法並びに有機ｅｌ表示装置
US8796583B2 (en) * 2004-09-17 2014-08-05 Eastman Kodak Company Method of forming a structured surface using ablatable radiation sensitive material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5580511A (en) 1990-01-25 1996-12-03 Dai Nippon Insatsu Kabushiki Kaisha Method of forming thick film pattern and material for forming thick film pattern
JPH0722732A (ja) * 1993-06-30 1995-01-24 Sumitomo Metal Ind Ltd 微細配線の形成方法
JPH1171130A (ja) 1997-08-26 1999-03-16 Taiyo Ink Mfg Ltd ガラスペースト組成物及びそれを用いたプラズマディスプレイパネルの背面板の製造方法
US6120975A (en) 1997-11-04 2000-09-19 Taiyo Ink Manufacturing Co., Ltd. Methods for production of a plasma display panel

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101654519B1 (ko) * 2015-04-14 2016-09-06 서울대학교 산학협력단 나노스케일 3차원 구조 제작 장치 및 방법
WO2016167389A1 (ko) * 2015-04-14 2016-10-20 서울대학교 산학협력단 나노스케일 3차원 구조 제작 장치 및 방법
KR20180083332A (ko) * 2015-10-15 2018-07-20 보드 오브 리전츠 더 유니버시티 오브 텍사스 시스템 정밀 나노스케일 제조를 위한 다목적 프로세스
KR102207781B1 (ko) * 2015-10-15 2021-01-26 보드 오브 리전츠 더 유니버시티 오브 텍사스 시스템 정밀 나노스케일 제조를 위한 방법

Also Published As

Publication number Publication date
DE102006058559A1 (de) 2007-11-15
US20070259474A1 (en) 2007-11-08
DE102006058559B4 (de) 2012-12-06
US7517467B2 (en) 2009-04-14
JP2007298944A (ja) 2007-11-15
JP5289703B2 (ja) 2013-09-11

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