KR100687306B1 - 배출-구동 에스엠아이에프 포드 정화 시스템 - Google Patents

배출-구동 에스엠아이에프 포드 정화 시스템 Download PDF

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Publication number
KR100687306B1
KR100687306B1 KR1020007010687A KR20007010687A KR100687306B1 KR 100687306 B1 KR100687306 B1 KR 100687306B1 KR 1020007010687 A KR1020007010687 A KR 1020007010687A KR 20007010687 A KR20007010687 A KR 20007010687A KR 100687306 B1 KR100687306 B1 KR 100687306B1
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South Korea
Prior art keywords
pod
gas
flow
inlet
outlet
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Expired - Lifetime
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KR1020007010687A
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Korean (ko)
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KR20010042200A (ko
Inventor
포스나이트윌리엄제이.
보노라안토니씨.
마틴레이몬드에스.
타트로제이
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어사이스트 테크놀로지스, 인코포레이티드
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Publication of KR20010042200A publication Critical patent/KR20010042200A/ko
Application granted granted Critical
Publication of KR100687306B1 publication Critical patent/KR100687306B1/ko
Assigned to 크로씽 오토메이션, 인코포레이티드 reassignment 크로씽 오토메이션, 인코포레이티드 권리의 전부이전등록 Assignors: 어사이스트 테크놀로지스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007010687A 1998-03-27 1999-03-22 배출-구동 에스엠아이에프 포드 정화 시스템 Expired - Lifetime KR100687306B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/049,461 1998-03-27
US9/049,461 1998-03-27
US09/049,461 US5988233A (en) 1998-03-27 1998-03-27 Evacuation-driven SMIF pod purge system

Publications (2)

Publication Number Publication Date
KR20010042200A KR20010042200A (ko) 2001-05-25
KR100687306B1 true KR100687306B1 (ko) 2007-02-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007010687A Expired - Lifetime KR100687306B1 (ko) 1998-03-27 1999-03-22 배출-구동 에스엠아이에프 포드 정화 시스템

Country Status (5)

Country Link
US (1) US5988233A (https=)
EP (1) EP1075418A4 (https=)
JP (1) JP2002510150A (https=)
KR (1) KR100687306B1 (https=)
WO (1) WO1999050145A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301057B1 (ko) * 2011-12-16 2013-08-28 주식회사 테라세미콘 웨이퍼 처리장치
KR20150001625A (ko) * 2013-06-26 2015-01-06 가부시키가이샤 다이후쿠 처리 설비
KR20180062829A (ko) * 2016-12-01 2018-06-11 에스케이하이닉스 주식회사 웨이퍼 보관 용기, 이를 포함하는 클러스터 시스템 및 클러스터 시스템의 구동 방법

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3167970B2 (ja) * 1997-10-13 2001-05-21 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US6319297B1 (en) * 1998-03-27 2001-11-20 Asyst Technologies, Inc. Modular SMIF pod breather, adsorbent, and purge cartridges
US6056026A (en) * 1998-12-01 2000-05-02 Asyst Technologies, Inc. Passively activated valve for carrier purging
FR2802335B1 (fr) * 1999-12-09 2002-04-05 Cit Alcatel Systeme et procede de controle de minienvironnement
JP3619119B2 (ja) * 2000-05-15 2005-02-09 キヤノン株式会社 真空処理方法
KR100410991B1 (ko) * 2001-02-22 2003-12-18 삼성전자주식회사 반도체 제조장치의 로드포트
US6701972B2 (en) * 2002-01-11 2004-03-09 The Boc Group, Inc. Vacuum load lock, system including vacuum load lock, and associated methods
FR2834974B1 (fr) * 2002-01-24 2004-10-15 Air Liquide Enceinte de stockage, valve d'evacuation de gaz pour cette enceinte, et procede d'alimentation en gaz de cette enceinte
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
JP2004235516A (ja) * 2003-01-31 2004-08-19 Trecenti Technologies Inc ウエハ収納治具のパージ方法、ロードポートおよび半導体装置の製造方法
US6899145B2 (en) * 2003-03-20 2005-05-31 Asm America, Inc. Front opening unified pod
JP4027837B2 (ja) * 2003-04-28 2007-12-26 Ｔｄｋ株式会社 パージ装置およびパージ方法
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
WO2004109748A2 (en) * 2003-06-05 2004-12-16 Palbam Class Ltd. Supporting shelf for front opening unified pod
US6919102B2 (en) * 2003-06-20 2005-07-19 Powerchip Semiconductor Corp. Method of stabilizing material layer
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
KR100572321B1 (ko) * 2003-10-02 2006-04-19 삼성전자주식회사 반도체 소자 제조 설비 및 방법 그리고 이에 사용되는스토커
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
DE602005017250D1 (de) * 2004-02-05 2009-12-03 Entegris Inc Reinigen eines wafer-überführungsbehälters
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
JP5386082B2 (ja) * 2004-08-19 2014-01-15 ブルックス オートメーション インコーポレイテッド 低収容力のキャリア及びその使用方法
WO2006023873A2 (en) 2004-08-23 2006-03-02 Brooks Automation, Inc. Elevator-based tool loading and buffering system
US20060104712A1 (en) * 2004-08-24 2006-05-18 Bufano Michael L Transportation system
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
JP3983254B2 (ja) * 2005-06-24 2007-09-26 Ｔｄｋ株式会社 製品収容容器用パージシステム及び該パージシステムに供せられる台
WO2007019105A1 (en) * 2005-08-03 2007-02-15 Entegris, Inc. A transfer container
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
JP2007221042A (ja) * 2006-02-20 2007-08-30 Tdk Corp インターフェースシール
TWM320179U (en) * 2006-06-09 2007-10-01 Gudeng Prec Industral Co Ltd Gas filling equipment and filling chamber therein for photomask conveying box
US8297319B2 (en) * 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US20080254377A1 (en) * 2006-12-19 2008-10-16 Chen Chien-Ta Metal photomask pod and filter device thereof
WO2008106622A2 (en) * 2007-02-28 2008-09-04 Entegris, Inc. Purge system for a substrate container
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
US20100175781A1 (en) * 2007-07-09 2010-07-15 Kondoh Industries, Ltd. Apparatus for Charging Dry Air or Nitrogen Gas into a Container for Storing Semiconductor Wafers and an Apparatus for Thereby Removing Static Electricity from the Wafers
US8870512B2 (en) * 2007-10-27 2014-10-28 Applied Materials, Inc. Sealed substrate carriers and systems and methods for transporting substrates
TWM330970U (en) * 2007-11-01 2008-04-21 Gudeng Prec Industral Co Ltd Semiconductor elements storage apparatus and reticle storage apparatus
TWM337832U (en) * 2007-11-15 2008-08-01 Gudeng Prec Industral Co Ltd Storage apparatus and filter apparatus therein
TWM331514U (en) * 2007-11-15 2008-05-01 Gudeng Prec Industral Co Ltd Storage apparatus for storing semiconductor element or reticle
TW200929357A (en) * 2007-12-20 2009-07-01 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWI379171B (en) * 2007-12-27 2012-12-11 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWM336219U (en) * 2008-01-31 2008-07-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI331123B (en) * 2008-03-06 2010-10-01 Gudeng Prec Ind Co Ltd Reticle pod and method for keeping reticle clean and dry
JP4692584B2 (ja) * 2008-07-03 2011-06-01 村田機械株式会社 パージ装置
US20100051501A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Ic waper carrier sealed from ambient atmosphere during transportation from one process to the next
JP5381054B2 (ja) * 2008-12-02 2014-01-08 シンフォニアテクノロジー株式会社 ロードポート
JP2012532284A (ja) * 2009-06-30 2012-12-13 ロイラン ディヴェロップメンツ リミテッド 感応材料を貯蔵するためのコンテナをパージする装置
JP2011187539A (ja) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd ガス注入装置、ガス排出装置、ガス注入方法及びガス排出方法
CN102194730B (zh) * 2010-03-15 2015-08-05 三星电子株式会社 衬底转移容器、气体净化监视工具及具有其的半导体制造设备
KR101780789B1 (ko) 2010-03-15 2017-09-22 삼성전자주식회사 기판 이송 용기, 가스 퍼지 모니터링 툴, 그리고 이들을 구비한 반도체 제조 설비
CN103548130B (zh) * 2011-05-25 2016-08-17 村田机械株式会社 载入机装置、搬运系统、以及容器搬出方法
JP5557061B2 (ja) * 2012-01-04 2014-07-23 株式会社ダイフク 物品保管設備
JP5598734B2 (ja) * 2012-01-06 2014-10-01 株式会社ダイフク 物品保管設備
JP6087161B2 (ja) 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
CN103311163A (zh) * 2012-03-09 2013-09-18 家登精密工业股份有限公司 应用于半导体存储装置的逆止阀
US20140041755A1 (en) * 2012-08-09 2014-02-13 Santa Phoenix Technology Inc. Wafer pod gas charging apparatus
KR101418733B1 (ko) * 2012-10-31 2014-08-13 크린팩토메이션 주식회사 반도체 웨이퍼 제조 시스템에서 에스티비에 불활성 가스를 공급하는 방법 및 이를 이용한 반도체 웨이퍼 제조 시스템
TWI610864B (zh) 2012-11-20 2018-01-11 恩特葛瑞斯股份有限公司 具有清洗埠的基板收納盒
US9257320B2 (en) 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
JP5874691B2 (ja) * 2013-06-26 2016-03-02 株式会社ダイフク 不活性気体供給設備
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
US9837293B2 (en) 2013-10-30 2017-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for charging gas into cassette pod
WO2015118775A1 (ja) * 2014-02-07 2015-08-13 村田機械株式会社 ガス注入装置及び補助部材
US9411332B2 (en) 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
CN105900226A (zh) * 2014-02-27 2016-08-24 村田机械株式会社 净化装置及净化方法
EP3121845B1 (en) * 2014-03-17 2021-07-28 Murata Machinery, Ltd. Purge apparatus and purge method
JP6052469B2 (ja) * 2014-04-28 2016-12-27 村田機械株式会社 パージ装置及びパージ方法
JP6323245B2 (ja) * 2014-08-08 2018-05-16 Tdk株式会社 ガスパージユニット、ロードポート装置およびパージ対象容器の設置台
EP3218135B1 (de) * 2014-11-10 2020-02-19 Fronius International GmbH Schweissdrahtmagazin mit feuchteschutz
KR20170088411A (ko) * 2014-12-01 2017-08-01 엔테그리스, 아이엔씨. 기재 수용기 밸브 조립체
TWM500354U (zh) * 2015-01-30 2015-05-01 劉淑真 具有環境感測及數據傳輸之密封裝置
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP2017028209A (ja) * 2015-07-27 2017-02-02 東京エレクトロン株式会社 基板収納方法及び基板処理装置
KR101688620B1 (ko) * 2015-12-24 2016-12-21 피코앤테라(주) 웨이퍼 수납용기
KR101852323B1 (ko) * 2016-07-05 2018-04-26 로체 시스템즈(주) 퍼지 모듈 지그 및 이를 포함한 퍼지 모듈
JP6327374B2 (ja) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
US10790177B2 (en) * 2017-11-14 2020-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Systems, devices, and methods for using a real time environment sensor in a FOUP
JP6519897B2 (ja) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP7234527B2 (ja) * 2018-07-30 2023-03-08 Tdk株式会社 センサー内蔵フィルタ構造体及びウエハ収容容器
KR20200022682A (ko) * 2018-08-23 2020-03-04 세메스 주식회사 버퍼 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
KR102113276B1 (ko) * 2018-09-04 2020-05-20 주식회사 저스템 가스공급용 노즐패드 및 이를 구비한 웨이퍼 용기의 가스공급장치
US11061417B2 (en) * 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
KR102012389B1 (ko) * 2019-04-03 2019-08-20 (주)에이이 로드 포트용 퍼지노즐 모듈
JP6882698B2 (ja) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
US11569102B2 (en) 2020-02-14 2023-01-31 Applied Materials, Inc. Oxidation inhibiting gas in a manufacturing system
US11810805B2 (en) * 2020-07-09 2023-11-07 Applied Materials, Inc. Prevention of contamination of substrates during gas purging
US11631604B2 (en) * 2020-07-17 2023-04-18 Nanya Technology Corporation Load port device, gas gate and gas-providing method
US12027399B2 (en) 2020-10-22 2024-07-02 Nanya Technology Corporation Gas purge device and gas purging method
CN118284960A (zh) * 2021-10-27 2024-07-02 恩特格里斯公司 调节对容器内部进行清洗的方法及装置
CN116525587A (zh) * 2022-01-21 2023-08-01 群创光电股份有限公司 电子装置的封装结构的制造方法
CN222838818U (zh) * 2024-02-21 2025-05-06 北京七星华创集成电路装备有限公司 片盒气体输送装置及半导体工艺设备
KR20260024465A (ko) * 2024-08-09 2026-02-23 주식회사 세미티에스 풉의 내부로 질소 가스를 공급하도록 지원하는 퍼징 플레이트를 제조하는 방법 및 이를 이용한 컴퓨팅 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US20050169272A1 (en) * 2004-02-03 2005-08-04 Yung-Chieh Lo Method for fragmenting an incoming packet into a first outgoing packet and a second outgoing packet

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3330166B2 (ja) * 1992-12-04 2002-09-30 東京エレクトロン株式会社 処理装置
DE4326308C1 (de) * 1993-08-05 1994-10-20 Jenoptik Jena Gmbh Transportvorrichtung für Magazine zur Aufnahme scheibenförmiger Objekte
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US5810062A (en) * 1996-07-12 1998-09-22 Asyst Technologies, Inc. Two stage valve for charging and/or vacuum relief of pods
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US20050169272A1 (en) * 2004-02-03 2005-08-04 Yung-Chieh Lo Method for fragmenting an incoming packet into a first outgoing packet and a second outgoing packet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301057B1 (ko) * 2011-12-16 2013-08-28 주식회사 테라세미콘 웨이퍼 처리장치
KR20150001625A (ko) * 2013-06-26 2015-01-06 가부시키가이샤 다이후쿠 처리 설비
KR102236231B1 (ko) * 2013-06-26 2021-04-02 가부시키가이샤 다이후쿠 처리 설비
KR20180062829A (ko) * 2016-12-01 2018-06-11 에스케이하이닉스 주식회사 웨이퍼 보관 용기, 이를 포함하는 클러스터 시스템 및 클러스터 시스템의 구동 방법
KR102597446B1 (ko) 2016-12-01 2023-11-03 에스케이하이닉스 주식회사 웨이퍼 보관 용기, 이를 포함하는 클러스터 시스템 및 클러스터 시스템의 구동 방법

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WO1999050145A1 (en) 1999-10-07
KR20010042200A (ko) 2001-05-25
EP1075418A4 (en) 2004-10-20
US5988233A (en) 1999-11-23
JP2002510150A (ja) 2002-04-02

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