KR100681963B1 - 전자 회로의 제조 방법 및 전자 회로 기판 - Google Patents

전자 회로의 제조 방법 및 전자 회로 기판 Download PDF

Info

Publication number
KR100681963B1
KR100681963B1 KR1020040111801A KR20040111801A KR100681963B1 KR 100681963 B1 KR100681963 B1 KR 100681963B1 KR 1020040111801 A KR1020040111801 A KR 1020040111801A KR 20040111801 A KR20040111801 A KR 20040111801A KR 100681963 B1 KR100681963 B1 KR 100681963B1
Authority
KR
South Korea
Prior art keywords
resin
resin layer
base member
electronic circuit
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020040111801A
Other languages
English (en)
Korean (ko)
Other versions
KR20050067051A (ko
Inventor
야마구찌나오꼬
아오끼히데오
다꾸보찌아끼
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20050067051A publication Critical patent/KR20050067051A/ko
Application granted granted Critical
Publication of KR100681963B1 publication Critical patent/KR100681963B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/221—Machines other than electrographic copiers, e.g. electrophotographic cameras, electrostatic typewriters
    • G03G15/224—Machines for forming tactile or three dimensional images by electrographic means, e.g. braille, 3d printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Combination Of More Than One Step In Electrophotography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electrophotography Configuration And Component (AREA)
KR1020040111801A 2003-12-26 2004-12-24 전자 회로의 제조 방법 및 전자 회로 기판 Expired - Fee Related KR100681963B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003435756A JP4130407B2 (ja) 2003-12-26 2003-12-26 電子回路の製造方法
JPJP-P-2003-00435756 2003-12-26

Publications (2)

Publication Number Publication Date
KR20050067051A KR20050067051A (ko) 2005-06-30
KR100681963B1 true KR100681963B1 (ko) 2007-02-15

Family

ID=34736645

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040111801A Expired - Fee Related KR100681963B1 (ko) 2003-12-26 2004-12-24 전자 회로의 제조 방법 및 전자 회로 기판

Country Status (5)

Country Link
US (1) US7486921B2 (OSRAM)
JP (1) JP4130407B2 (OSRAM)
KR (1) KR100681963B1 (OSRAM)
CN (1) CN100421533C (OSRAM)
TW (1) TWI254967B (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102881383A (zh) * 2012-09-19 2013-01-16 江西联创电子有限公司 一种透明导电薄膜制作方法
JP7455516B2 (ja) * 2019-03-29 2024-03-26 Tdk株式会社 素子内蔵基板およびその製造方法
JP7238548B2 (ja) 2019-03-29 2023-03-14 Tdk株式会社 多層基板用絶縁シート、多層基板および多層基板の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60102794A (ja) * 1983-11-09 1985-06-06 ブラザー工業株式会社 回路基板の製造方法
GB8504481D0 (en) * 1985-02-21 1985-03-27 Soszek P Circuitry
IT1184408B (it) * 1985-04-09 1987-10-28 Telettra Lab Telefon Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
JPS63180952A (ja) 1987-01-22 1988-07-26 Ricoh Co Ltd 回路基板のレジストパタ−ン形成方法
JPH0786721A (ja) 1993-09-16 1995-03-31 Toshiba Corp 配線基板
JP3499588B2 (ja) * 1993-11-11 2004-02-23 ジャパン・エア・ガシズ株式会社 ハイブリッド回路基体上での厚フィルム電気部品の製造方法
JPH07263841A (ja) 1994-03-18 1995-10-13 Toshiba Corp 配線基板
JPH0856077A (ja) 1994-08-12 1996-02-27 Mitsubishi Paper Mills Ltd 多層プリント配線板の製造方法
JPH0888456A (ja) 1994-09-14 1996-04-02 Nikon Corp 基板配線製造方法および製造装置
US5703394A (en) * 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
EP1005261B1 (en) * 1997-04-15 2003-03-05 Ibiden Co., Ltd. Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
DE19715658A1 (de) * 1997-04-16 1998-10-22 Philips Leiterplatten At Gmbh Multifunktions-Leiterplatte mit opto-elektronisch aktivem Bauelement
JP3505993B2 (ja) * 1998-03-03 2004-03-15 株式会社村田製作所 回路形成用荷電性粉末及びそれを用いた多層配線基板
JPH11312859A (ja) 1998-04-28 1999-11-09 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JPH11354908A (ja) 1998-06-08 1999-12-24 Murata Mfg Co Ltd 回路パターン形成方法及びそれを用いて形成された多層配線基板
US6440625B1 (en) * 1999-01-31 2002-08-27 Elfotek Ltd. Method of electrostatic recording on a cylindrical photoreceptor with dielectric coating and an electrophotographic duplicating apparatus
TW511264B (en) * 1999-02-18 2002-11-21 Seiko Epson Corp Semiconductor device, mounting substrate and its manufacturing method, circuit substrate and electronic machine
JP4543490B2 (ja) 2000-03-29 2010-09-15 株式会社村田製作所 回路パターン形成方法及びそれによって形成された配線基板
JP3800977B2 (ja) * 2001-04-11 2006-07-26 株式会社日立製作所 Ｚｎ−Ａｌ系はんだを用いた製品
WO2003009655A1 (fr) 2001-07-18 2003-01-30 Ajinomoto Co., Inc. Film pour carte de circuit
JP2003347462A (ja) * 2002-05-30 2003-12-05 Denso Corp 回路基板の製造方法
JP2004048030A (ja) * 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置

Also Published As

Publication number Publication date
CN100421533C (zh) 2008-09-24
US7486921B2 (en) 2009-02-03
TW200525591A (en) 2005-08-01
TWI254967B (en) 2006-05-11
CN1638606A (zh) 2005-07-13
JP4130407B2 (ja) 2008-08-06
JP2005197305A (ja) 2005-07-21
US20050153220A1 (en) 2005-07-14
KR20050067051A (ko) 2005-06-30

Similar Documents

Publication Publication Date Title
US6977130B2 (en) Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
US20070065639A1 (en) Circuit board and manufacturing method of the circuit board
US20050053772A1 (en) Wiring board and multilayer wiring board
US7877871B2 (en) Method of manufacturing an electronic circuit formed on a substrate
JPH07263841A (ja) 配線基板
US8220147B2 (en) Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
TW200521171A (en) Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
JP4166686B2 (ja) 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
KR20050067051A (ko) 전자 회로의 제조 방법 및 전자 회로 기판
JPH10280170A (ja) エッチングマスクの形成方法及び装置
JP3909728B2 (ja) 印刷配線基板の製造装置
JP2005197007A (ja) 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法
JP4343033B2 (ja) 電子回路の製造装置
JP4363488B2 (ja) 回路形成用荷電性粉末及びそれを用いた多層配線基板
JP4363487B2 (ja) 回路形成用荷電性粉末及びそれを用いた多層配線基板
JP2006222324A (ja) 配線基板の製造方法
JP2005302842A (ja) 配線基板作成用トナー、及びこれを用いた配線基板の製造方法
JP2005197306A (ja) 配線基板およびその製造方法
JP2005300681A (ja) 配線基板作成用トナー、及びこれを用いた配線基板の製造方法
JPS60160690A (ja) 印刷配線基板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20120119

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130207

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130207

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000