KR100600921B1 - 레이저 보정 장치 및 방법 - Google Patents

레이저 보정 장치 및 방법 Download PDF

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Publication number
KR100600921B1
KR100600921B1 KR1020017013732A KR20017013732A KR100600921B1 KR 100600921 B1 KR100600921 B1 KR 100600921B1 KR 1020017013732 A KR1020017013732 A KR 1020017013732A KR 20017013732 A KR20017013732 A KR 20017013732A KR 100600921 B1 KR100600921 B1 KR 100600921B1
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KR
South Korea
Prior art keywords
laser beam
focused laser
scanner
photodetector
coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020017013732A
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English (en)
Korean (ko)
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KR20010112950A (ko
Inventor
키타이안톤디오도어
밀러이언제임스
파커로버트글렌
Original Assignee
지에스아이 루모닉스 인코퍼레이티드
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Publication of KR20010112950A publication Critical patent/KR20010112950A/ko
Application granted granted Critical
Publication of KR100600921B1 publication Critical patent/KR100600921B1/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • B23K26/043Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/705Beam measuring devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020017013732A 1999-04-27 2000-04-26 레이저 보정 장치 및 방법 Expired - Fee Related KR100600921B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13113899P 1999-04-27 1999-04-27
US60/131,138 1999-04-27

Publications (2)

Publication Number Publication Date
KR20010112950A KR20010112950A (ko) 2001-12-22
KR100600921B1 true KR100600921B1 (ko) 2006-07-13

Family

ID=22448055

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017013732A Expired - Fee Related KR100600921B1 (ko) 1999-04-27 2000-04-26 레이저 보정 장치 및 방법

Country Status (8)

Country Link
US (1) US6501061B1 (https=)
EP (1) EP1173302B1 (https=)
JP (1) JP2002542042A (https=)
KR (1) KR100600921B1 (https=)
AU (1) AU4280700A (https=)
CA (1) CA2370813C (https=)
DE (1) DE60019573T2 (https=)
WO (1) WO2000064622A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100890259B1 (ko) 2007-07-25 2009-03-24 (주)와이티에스 레이저 마킹 시스템의 주행축 틀어짐에 따른 마킹패턴오프셋 자동 보정 방법
JP2025515684A (ja) * 2022-05-09 2025-05-20 エディソン ウェルディング インスティテュート、インク. 高速レーザモーションシステムの指令位置とキャリブレーションの検証

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KR100445974B1 (ko) * 2001-12-01 2004-08-25 주식회사 이오테크닉스 칩 스케일 마커의 마킹 위치 보정 방법 및 그 장치
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JP4531323B2 (ja) * 2002-09-13 2010-08-25 株式会社半導体エネルギー研究所 レーザ装置、レーザ照射方法、および半導体装置の作製方法
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JP5735803B2 (ja) * 2007-08-23 2015-06-17 スリーディー システムズ インコーポレーテッド レーザ走査反射計を用いる自動形状校正法
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DE102011109449B9 (de) * 2011-08-04 2013-04-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum kalibrieren eines laserscanners, verwendung des verfahrens und bearbeitungssystem mit laserscanner
JP5385356B2 (ja) 2011-10-21 2014-01-08 株式会社片岡製作所 レーザ加工機
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JP2025515684A (ja) * 2022-05-09 2025-05-20 エディソン ウェルディング インスティテュート、インク. 高速レーザモーションシステムの指令位置とキャリブレーションの検証

Also Published As

Publication number Publication date
CA2370813C (en) 2008-06-17
JP2002542042A (ja) 2002-12-10
AU4280700A (en) 2000-11-10
DE60019573T2 (de) 2006-03-23
CA2370813A1 (en) 2000-11-02
US6501061B1 (en) 2002-12-31
WO2000064622A1 (en) 2000-11-02
EP1173302B1 (en) 2005-04-20
DE60019573D1 (de) 2005-05-25
EP1173302A1 (en) 2002-01-23
KR20010112950A (ko) 2001-12-22

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