KR100591939B1 - 스테이지장치 - Google Patents

스테이지장치 Download PDF

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Publication number
KR100591939B1
KR100591939B1 KR1020050041430A KR20050041430A KR100591939B1 KR 100591939 B1 KR100591939 B1 KR 100591939B1 KR 1020050041430 A KR1020050041430 A KR 1020050041430A KR 20050041430 A KR20050041430 A KR 20050041430A KR 100591939 B1 KR100591939 B1 KR 100591939B1
Authority
KR
South Korea
Prior art keywords
stage
reaction force
linear
motor
linear motors
Prior art date
Application number
KR1020050041430A
Other languages
English (en)
Korean (ko)
Other versions
KR20060047978A (ko
Inventor
요시유키 도미타
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20060047978A publication Critical patent/KR20060047978A/ko
Application granted granted Critical
Publication of KR100591939B1 publication Critical patent/KR100591939B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Machine Tool Units (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020050041430A 2004-05-20 2005-05-18 스테이지장치 KR100591939B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00150711 2004-05-20
JP2004150711A JP2005331402A (ja) 2004-05-20 2004-05-20 ステージ装置

Publications (2)

Publication Number Publication Date
KR20060047978A KR20060047978A (ko) 2006-05-18
KR100591939B1 true KR100591939B1 (ko) 2006-06-20

Family

ID=35476389

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050041430A KR100591939B1 (ko) 2004-05-20 2005-05-18 스테이지장치

Country Status (4)

Country Link
JP (1) JP2005331402A (zh)
KR (1) KR100591939B1 (zh)
CN (1) CN100464401C (zh)
TW (1) TWI267090B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022646B1 (ko) 2009-08-31 2011-03-22 주식회사 져스텍 선형 모터 시스템 및 그 반발력 보상방법

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927338B2 (ja) 2005-02-21 2012-05-09 住友重機械工業株式会社 ステージ装置及びガントリ型ステージ装置及びステージ装置の制御方法
KR100842116B1 (ko) * 2006-03-31 2008-06-30 (주)21하이테크 도광판 가공장치
KR101321454B1 (ko) * 2006-05-02 2013-10-25 주식회사 케이씨텍 슬릿노즐 이송장치
JP4402078B2 (ja) * 2006-06-19 2010-01-20 住友重機械工業株式会社 ステージ装置
DE502007000499D1 (de) * 2006-06-23 2009-04-23 Gleason Works Werkzeugmaschine
JP4138858B2 (ja) * 2007-12-12 2008-08-27 住友重機械工業株式会社 ステージ装置
KR101054915B1 (ko) * 2008-12-05 2011-08-05 주식회사 디엠에스 슬릿코터
KR20100073540A (ko) * 2008-12-23 2010-07-01 주식회사 탑 엔지니어링 반력상쇄장치 및 이를 구비한 페이스트 디스펜서
KR101052491B1 (ko) * 2009-12-18 2011-07-29 주식회사 탑 엔지니어링 어레이 테스트 장치
KR101703717B1 (ko) * 2010-05-13 2017-02-08 주식회사 탑 엔지니어링 반력상쇄장치 및 이를 구비한 페이스트 디스펜서
JP5639815B2 (ja) * 2010-08-17 2014-12-10 株式会社ミツトヨ 産業機械
CN102887341A (zh) * 2011-07-22 2013-01-23 大银微系统股份有限公司 悬臂式平台的横梁预拉模组
CN102929295B (zh) * 2012-11-08 2015-04-15 中国地质大学（武汉） 一种基于单片机的自动调平控制装置及调平方法
CN103389740B (zh) * 2013-07-29 2016-03-23 中国传媒大学 一种平行式立体拍摄云台控制模块
CN103971755B (zh) * 2014-05-07 2016-05-11 马宁 一种微调拨块式调节板
KR102333209B1 (ko) * 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device
CN106362817B (zh) * 2016-10-31 2018-08-24 苏州昇特智能科技有限公司 一种用于放置纳米纤维样品的载物台
JP6631745B1 (ja) * 2018-12-14 2020-01-15 日立金属株式会社 リニアモータステージの制御方法及び制御装置
KR102407790B1 (ko) * 2020-11-05 2022-06-13 이노6 주식회사 반발력 저감 테이블 시스템
CN114043260B (zh) * 2022-01-13 2022-04-26 上海隐冠半导体技术有限公司 位移装置
JP2024036288A (ja) 2022-09-05 2024-03-15 住友化学株式会社 偏光板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634483B2 (ja) * 1996-02-13 2005-03-30 キヤノン株式会社 ステージ装置、及びこれを用いた露光装置やデバイス生産方法
JP3548353B2 (ja) * 1996-10-15 2004-07-28 キヤノン株式会社 ステージ装置およびこれを用いた露光装置ならびにデバイス製造方法
JPH11168064A (ja) * 1997-09-22 1999-06-22 Nikon Corp ステージ駆動方法、ステージ装置、及び露光装置
CN1260772C (zh) * 1999-10-07 2006-06-21 株式会社尼康 载物台装置、载物台驱动方法和曝光装置及曝光方法
JP2003243279A (ja) * 2002-02-13 2003-08-29 Nikon Corp 駆動装置、ステージ装置、露光方法、及び露光装置
US6844635B2 (en) * 2002-05-24 2005-01-18 Dover Instrument Corporation Reaction force transfer system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022646B1 (ko) 2009-08-31 2011-03-22 주식회사 져스텍 선형 모터 시스템 및 그 반발력 보상방법

Also Published As

Publication number Publication date
CN1700438A (zh) 2005-11-23
JP2005331402A (ja) 2005-12-02
KR20060047978A (ko) 2006-05-18
TWI267090B (en) 2006-11-21
CN100464401C (zh) 2009-02-25
TW200600437A (en) 2006-01-01

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