TW200600437A - Stage device - Google Patents

Stage device

Info

Publication number
TW200600437A
TW200600437A TW094111230A TW94111230A TW200600437A TW 200600437 A TW200600437 A TW 200600437A TW 094111230 A TW094111230 A TW 094111230A TW 94111230 A TW94111230 A TW 94111230A TW 200600437 A TW200600437 A TW 200600437A
Authority
TW
Taiwan
Prior art keywords
movable stage
linear motors
driving
respect
stage
Prior art date
Application number
TW094111230A
Other languages
Chinese (zh)
Other versions
TWI267090B (en
Inventor
Yoshiyuki Tomita
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200600437A publication Critical patent/TW200600437A/en
Application granted granted Critical
Publication of TWI267090B publication Critical patent/TWI267090B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Machine Tool Units (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a stage device for eliminating the reacting force effect due to driving force. The stage device of the invention includes: a stationary base fixed to a base; a substrate table supported on the stationary base; a movable stage transversely constructed so as to straddle the substrate table; a pair of linear motors for driving both the end parts of the movable stage with respect to the Y-direction; and a controller for synchronously driving the linear motors. Slide mechanisms are provided between the stationary base and the lower ends of strut parts of motor support parts. When the linear motors drive the movable stage with respect to the Y-direction, the motor support parts are moved with respect to the direction opposite to the traveling direction of the movable stage. Accordingly, there is no effect of the reaction force from the linear motors, and the driving control of the movable stage can be performed at high accuracy.
TW094111230A 2004-05-20 2005-04-08 Stage device TWI267090B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004150711A JP2005331402A (en) 2004-05-20 2004-05-20 Stage device

Publications (2)

Publication Number Publication Date
TW200600437A true TW200600437A (en) 2006-01-01
TWI267090B TWI267090B (en) 2006-11-21

Family

ID=35476389

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111230A TWI267090B (en) 2004-05-20 2005-04-08 Stage device

Country Status (4)

Country Link
JP (1) JP2005331402A (en)
KR (1) KR100591939B1 (en)
CN (1) CN100464401C (en)
TW (1) TWI267090B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927338B2 (en) 2005-02-21 2012-05-09 住友重機械工業株式会社 STAGE DEVICE, GANTRY TYPE STAGE DEVICE, AND STAGE DEVICE CONTROL METHOD
KR100842116B1 (en) * 2006-03-31 2008-06-30 (주)21하이테크 Apparatus for machining light-guide plate
KR101321454B1 (en) * 2006-05-02 2013-10-25 주식회사 케이씨텍 Transfer device of slit nozzle
JP4402078B2 (en) * 2006-06-19 2010-01-20 住友重機械工業株式会社 Stage equipment
ES2321033T3 (en) * 2006-06-23 2009-06-01 The Gleason Works MACHINE TOOL.
JP4138858B2 (en) * 2007-12-12 2008-08-27 住友重機械工業株式会社 Stage equipment
KR101054915B1 (en) * 2008-12-05 2011-08-05 주식회사 디엠에스 Slit Coater
KR20100073540A (en) * 2008-12-23 2010-07-01 주식회사 탑 엔지니어링 Apparatus for offsetting reaction force and paste dispenser having the same
KR101022646B1 (en) 2009-08-31 2011-03-22 주식회사 져스텍 Linear motor system and reaction force compensation method thereof
KR101052491B1 (en) * 2009-12-18 2011-07-29 주식회사 탑 엔지니어링 Array test device
KR101703717B1 (en) * 2010-05-13 2017-02-08 주식회사 탑 엔지니어링 Apparatus for offsetting reaction force and paste dispenser having the same
JP5639815B2 (en) * 2010-08-17 2014-12-10 株式会社ミツトヨ Industrial machinery
CN102887341A (en) * 2011-07-22 2013-01-23 大银微系统股份有限公司 Crossbeam pre-tensioning module of cantilever type platform
CN102929295B (en) * 2012-11-08 2015-04-15 中国地质大学（武汉） Automatic leveling control device based on single chip microcomputer (SCM)and levelling method
CN103389740B (en) * 2013-07-29 2016-03-23 中国传媒大学 A kind of control module of parallel type stereoscopic video cloud station
CN103971755B (en) * 2014-05-07 2016-05-11 马宁 A kind of fine setting shifting block type adjustable plate
KR102333209B1 (en) * 2015-04-28 2021-12-01 삼성디스플레이 주식회사 Substrate polishing apparatus
TWI616269B (en) * 2016-08-01 2018-03-01 Reaction force elimination platform device
CN106362817B (en) * 2016-10-31 2018-08-24 苏州昇特智能科技有限公司 A kind of objective table for placing nanofiber sample
JP6631745B1 (en) * 2018-12-14 2020-01-15 日立金属株式会社 Control method and control device for linear motor stage
KR102407790B1 (en) * 2020-11-05 2022-06-13 이노6 주식회사 Reaction force suppression system
CN114043260B (en) * 2022-01-13 2022-04-26 上海隐冠半导体技术有限公司 Displacement device
JP2024036288A (en) 2022-09-05 2024-03-15 住友化学株式会社 Polarizing plate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634483B2 (en) * 1996-02-13 2005-03-30 キヤノン株式会社 Stage apparatus, and exposure apparatus and device production method using the same
JP3548353B2 (en) * 1996-10-15 2004-07-28 キヤノン株式会社 Stage apparatus, exposure apparatus and device manufacturing method using the same
JPH11168064A (en) * 1997-09-22 1999-06-22 Nikon Corp Stage driving method, stage equipment, and aligner
KR100625625B1 (en) * 1999-10-07 2006-09-20 가부시키가이샤 니콘 Substrate, stage device, method of driving stage, exposure system and exposure method
JP2003243279A (en) * 2002-02-13 2003-08-29 Nikon Corp Drive device, stage device, exposure method and aligner
US6844635B2 (en) * 2002-05-24 2005-01-18 Dover Instrument Corporation Reaction force transfer system

Also Published As

Publication number Publication date
CN100464401C (en) 2009-02-25
KR100591939B1 (en) 2006-06-20
TWI267090B (en) 2006-11-21
KR20060047978A (en) 2006-05-18
CN1700438A (en) 2005-11-23
JP2005331402A (en) 2005-12-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees