KR100585436B1 - 플라즈마 처리 장치용 석영부재의 가공 방법, 플라즈마처리 장치용 석영부재 및 플라즈마 처리 장치용석영부재가 실장된 플라즈마 처리 장치 - Google Patents

플라즈마 처리 장치용 석영부재의 가공 방법, 플라즈마처리 장치용 석영부재 및 플라즈마 처리 장치용석영부재가 실장된 플라즈마 처리 장치 Download PDF

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KR100585436B1
KR100585436B1 KR1020047004313A KR20047004313A KR100585436B1 KR 100585436 B1 KR100585436 B1 KR 100585436B1 KR 1020047004313 A KR1020047004313 A KR 1020047004313A KR 20047004313 A KR20047004313 A KR 20047004313A KR 100585436 B1 KR100585436 B1 KR 100585436B1
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South Korea
Prior art keywords
quartz member
processing apparatus
plasma processing
plasma
processing
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Expired - Fee Related
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KR1020047004313A
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English (en)
Korean (ko)
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KR20040035884A (ko
Inventor
노리카즈 스기야마
히데히토 사에구사
노부유키 오카야마
šœ이치 이무로
고스케 이마후쿠
노부유키 나가야마
고지 미츠하시
히로유키 나카야마
야후이 후앙
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동경 엘렉트론 주식회사
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Publication of KR20040035884A publication Critical patent/KR20040035884A/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1020047004313A 2001-09-25 2002-09-12 플라즈마 처리 장치용 석영부재의 가공 방법, 플라즈마처리 장치용 석영부재 및 플라즈마 처리 장치용석영부재가 실장된 플라즈마 처리 장치 Expired - Fee Related KR100585436B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001292251 2001-09-25
JPJP-P-2001-00292251 2001-09-25
JP2001332462A JP4034543B2 (ja) 2001-09-25 2001-10-30 プラズマ処理装置用石英部材の加工方法，プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置
JPJP-P-2001-00332462 2001-10-30
PCT/JP2002/009311 WO2003028083A1 (fr) 2001-09-25 2002-09-12 Procede de traitement d'une piece de quartz pour dispositif de traitement au plasma, piece de quartz ainsi traitee, et dispositif de traitement au plasma utilisant ladite piece

Publications (2)

Publication Number Publication Date
KR20040035884A KR20040035884A (ko) 2004-04-29
KR100585436B1 true KR100585436B1 (ko) 2006-06-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047004313A Expired - Fee Related KR100585436B1 (ko) 2001-09-25 2002-09-12 플라즈마 처리 장치용 석영부재의 가공 방법, 플라즈마처리 장치용 석영부재 및 플라즈마 처리 장치용석영부재가 실장된 플라즈마 처리 장치

Country Status (6)

Country Link
US (1) US20040200804A1 (https=)
JP (1) JP4034543B2 (https=)
KR (1) KR100585436B1 (https=)
CN (1) CN1293611C (https=)
TW (1) TW556269B (https=)
WO (1) WO2003028083A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4888392B2 (ja) * 2005-09-20 2012-02-29 コニカミノルタオプト株式会社 防眩性反射防止フィルムの形成方法及び防眩性反射防止フィルム
KR100997839B1 (ko) * 2006-01-31 2010-12-01 도쿄엘렉트론가부시키가이샤 마이크로파 플라즈마 처리 장치 및 천판
JP2008037498A (ja) * 2006-07-11 2008-02-21 Kirin Brewery Co Ltd プラスチックキャップ及びそれで密封された製品又は容器
CN101740335B (zh) * 2008-11-14 2011-05-04 中芯国际集成电路制造(北京)有限公司 半导体制造设备和半导体结构的刻蚀方法
US20120255635A1 (en) * 2011-04-11 2012-10-11 Applied Materials, Inc. Method and apparatus for refurbishing gas distribution plate surfaces
CN102807327B (zh) * 2011-06-03 2014-11-19 中芯国际集成电路制造(上海)有限公司 一种降低干刻蚀腔体喷嘴内壁的粗糙度的方法
KR102019817B1 (ko) * 2017-09-07 2019-09-09 주식회사 원익큐엔씨 쿼츠 표면 처리 방법
JP7503951B2 (ja) 2020-07-17 2024-06-21 東京エレクトロン株式会社 エッチング処理装置、石英部材及びプラズマ処理方法
US11401608B2 (en) * 2020-10-20 2022-08-02 Sky Tech Inc. Atomic layer deposition equipment and process method
CN114536158B (zh) * 2022-01-19 2023-03-31 宁波云德半导体材料有限公司 一种刻蚀机反应腔的石英窗的加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09167755A (ja) * 1995-12-15 1997-06-24 Nec Corp プラズマ酸化膜処理装置
JP2000114353A (ja) * 1998-09-30 2000-04-21 Ibiden Co Ltd 半導体製造装置用部品
JP4256516B2 (ja) * 1999-02-17 2009-04-22 株式会社アトック 石英ガラス円筒体の内面研磨方法
US6368410B1 (en) * 1999-06-28 2002-04-09 General Electric Company Semiconductor processing article
JP2001089198A (ja) * 1999-09-22 2001-04-03 Asahi Glass Co Ltd 半導体装置用石英ガラス治具およびその製造方法
US6887576B2 (en) * 2000-08-23 2005-05-03 Herseus Quarzglas GmbH & Co. KG Quartz glass body having improved resistance against plasma corrosion, and method for production thereof
US20040173313A1 (en) * 2003-03-03 2004-09-09 Bradley Beach Fire polished showerhead electrode

Also Published As

Publication number Publication date
KR20040035884A (ko) 2004-04-29
WO2003028083A1 (fr) 2003-04-03
JP4034543B2 (ja) 2008-01-16
TW556269B (en) 2003-10-01
CN1557018A (zh) 2004-12-22
US20040200804A1 (en) 2004-10-14
JP2003174017A (ja) 2003-06-20
CN1293611C (zh) 2007-01-03

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