JP4034543B2 - プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置 - Google Patents

プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置 Download PDF

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JP4034543B2
JP4034543B2 JP2001332462A JP2001332462A JP4034543B2 JP 4034543 B2 JP4034543 B2 JP 4034543B2 JP 2001332462 A JP2001332462 A JP 2001332462A JP 2001332462 A JP2001332462 A JP 2001332462A JP 4034543 B2 JP4034543 B2 JP 4034543B2
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Japan
Prior art keywords
processing apparatus
quartz member
plasma processing
plasma
processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2001332462A
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English (en)
Japanese (ja)
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JP2003174017A (ja
JP2003174017A5 (https=
Inventor
智一 杉山
秀仁 三枝
信幸 岡山
俊一 飯室
光祐 今福
将之 長山
康至 三橋
博之 中山
亜輝 黄
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2001332462A priority Critical patent/JP4034543B2/ja
Priority to TW091120471A priority patent/TW556269B/zh
Priority to US10/490,105 priority patent/US20040200804A1/en
Priority to CNB028186265A priority patent/CN1293611C/zh
Priority to KR1020047004313A priority patent/KR100585436B1/ko
Priority to PCT/JP2002/009311 priority patent/WO2003028083A1/ja
Publication of JP2003174017A publication Critical patent/JP2003174017A/ja
Publication of JP2003174017A5 publication Critical patent/JP2003174017A5/ja
Application granted granted Critical
Publication of JP4034543B2 publication Critical patent/JP4034543B2/ja
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Expired - Fee Related legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025Glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2001332462A 2001-09-25 2001-10-30 プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置 Expired - Fee Related JP4034543B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001332462A JP4034543B2 (ja) 2001-09-25 2001-10-30 プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置
TW091120471A TW556269B (en) 2001-09-25 2002-09-09 Method of processing quartz member for plasma processing device, quartz member for plasma processing device, and plasma processing device having quartz member for plasma processing device mounted thereon
CNB028186265A CN1293611C (zh) 2001-09-25 2002-09-12 等离子体处理装置用石英部件及其加工方法、及安装有该石英部件的等离子体处理装置
KR1020047004313A KR100585436B1 (ko) 2001-09-25 2002-09-12 플라즈마 처리 장치용 석영부재의 가공 방법, 플라즈마처리 장치용 석영부재 및 플라즈마 처리 장치용석영부재가 실장된 플라즈마 처리 장치
US10/490,105 US20040200804A1 (en) 2001-09-25 2002-09-12 Method of processing quartz member for plasma processing device, quartz member for plasma processing device, and plasma processing device having quartz member for plasma processing device mounted thereon
PCT/JP2002/009311 WO2003028083A1 (fr) 2001-09-25 2002-09-12 Procede de traitement d'une piece de quartz pour dispositif de traitement au plasma, piece de quartz ainsi traitee, et dispositif de traitement au plasma utilisant ladite piece

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001292251 2001-09-25
JP2001-292251 2001-09-25
JP2001332462A JP4034543B2 (ja) 2001-09-25 2001-10-30 プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2003174017A JP2003174017A (ja) 2003-06-20
JP2003174017A5 JP2003174017A5 (https=) 2005-06-02
JP4034543B2 true JP4034543B2 (ja) 2008-01-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001332462A Expired - Fee Related JP4034543B2 (ja) 2001-09-25 2001-10-30 プラズマ処理装置用石英部材の加工方法,プラズマ処理装置用石英部材およびプラズマ処理装置用石英部材が実装されたプラズマ処理装置

Country Status (6)

Country Link
US (1) US20040200804A1 (https=)
JP (1) JP4034543B2 (https=)
KR (1) KR100585436B1 (https=)
CN (1) CN1293611C (https=)
TW (1) TW556269B (https=)
WO (1) WO2003028083A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4888392B2 (ja) * 2005-09-20 2012-02-29 コニカミノルタオプト株式会社 防眩性反射防止フィルムの形成方法及び防眩性反射防止フィルム
KR100997839B1 (ko) * 2006-01-31 2010-12-01 도쿄엘렉트론가부시키가이샤 마이크로파 플라즈마 처리 장치 및 천판
JP2008037498A (ja) * 2006-07-11 2008-02-21 Kirin Brewery Co Ltd プラスチックキャップ及びそれで密封された製品又は容器
CN101740335B (zh) * 2008-11-14 2011-05-04 中芯国际集成电路制造(北京)有限公司 半导体制造设备和半导体结构的刻蚀方法
US20120255635A1 (en) * 2011-04-11 2012-10-11 Applied Materials, Inc. Method and apparatus for refurbishing gas distribution plate surfaces
CN102807327B (zh) * 2011-06-03 2014-11-19 中芯国际集成电路制造(上海)有限公司 一种降低干刻蚀腔体喷嘴内壁的粗糙度的方法
KR102019817B1 (ko) * 2017-09-07 2019-09-09 주식회사 원익큐엔씨 쿼츠 표면 처리 방법
JP7503951B2 (ja) 2020-07-17 2024-06-21 東京エレクトロン株式会社 エッチング処理装置、石英部材及びプラズマ処理方法
US11401608B2 (en) * 2020-10-20 2022-08-02 Sky Tech Inc. Atomic layer deposition equipment and process method
CN114536158B (zh) * 2022-01-19 2023-03-31 宁波云德半导体材料有限公司 一种刻蚀机反应腔的石英窗的加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09167755A (ja) * 1995-12-15 1997-06-24 Nec Corp プラズマ酸化膜処理装置
JP2000114353A (ja) * 1998-09-30 2000-04-21 Ibiden Co Ltd 半導体製造装置用部品
JP4256516B2 (ja) * 1999-02-17 2009-04-22 株式会社アトック 石英ガラス円筒体の内面研磨方法
US6368410B1 (en) * 1999-06-28 2002-04-09 General Electric Company Semiconductor processing article
JP2001089198A (ja) * 1999-09-22 2001-04-03 Asahi Glass Co Ltd 半導体装置用石英ガラス治具およびその製造方法
US6887576B2 (en) * 2000-08-23 2005-05-03 Herseus Quarzglas GmbH & Co. KG Quartz glass body having improved resistance against plasma corrosion, and method for production thereof
US20040173313A1 (en) * 2003-03-03 2004-09-09 Bradley Beach Fire polished showerhead electrode

Also Published As

Publication number Publication date
KR100585436B1 (ko) 2006-06-07
KR20040035884A (ko) 2004-04-29
WO2003028083A1 (fr) 2003-04-03
TW556269B (en) 2003-10-01
CN1557018A (zh) 2004-12-22
US20040200804A1 (en) 2004-10-14
JP2003174017A (ja) 2003-06-20
CN1293611C (zh) 2007-01-03

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