KR100583999B1 - 웨이퍼처리장치에서 사용하기 위한 세정/버핑장치 - Google Patents

웨이퍼처리장치에서 사용하기 위한 세정/버핑장치 Download PDF

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Publication number
KR100583999B1
KR100583999B1 KR1020007007873A KR20007007873A KR100583999B1 KR 100583999 B1 KR100583999 B1 KR 100583999B1 KR 1020007007873 A KR1020007007873 A KR 1020007007873A KR 20007007873 A KR20007007873 A KR 20007007873A KR 100583999 B1 KR100583999 B1 KR 100583999B1
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KR
South Korea
Prior art keywords
wafer
buffing
brush
station
assembly
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Expired - Fee Related
Application number
KR1020007007873A
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English (en)
Korean (ko)
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KR20010040352A (ko
Inventor
라브킨마이클
드라리오스존엠
장지하
고켈토마스알
Original Assignee
램 리서치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 램 리서치 코포레이션 filed Critical 램 리서치 코포레이션
Publication of KR20010040352A publication Critical patent/KR20010040352A/ko
Application granted granted Critical
Publication of KR100583999B1 publication Critical patent/KR100583999B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Magnetic Heads (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020007007873A 1998-01-20 1999-01-19 웨이퍼처리장치에서 사용하기 위한 세정/버핑장치 Expired - Fee Related KR100583999B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/009583 1998-01-20
US09/009,583 US6200201B1 (en) 1996-08-29 1998-01-20 Cleaning/buffer apparatus for use in a wafer processing device
US09/009.583 1998-01-20

Publications (2)

Publication Number Publication Date
KR20010040352A KR20010040352A (ko) 2001-05-15
KR100583999B1 true KR100583999B1 (ko) 2006-05-29

Family

ID=21738550

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007007873A Expired - Fee Related KR100583999B1 (ko) 1998-01-20 1999-01-19 웨이퍼처리장치에서 사용하기 위한 세정/버핑장치

Country Status (8)

Country Link
US (1) US6200201B1 (enExample)
EP (1) EP1056549B1 (enExample)
JP (1) JP2002509367A (enExample)
KR (1) KR100583999B1 (enExample)
AT (1) ATE255473T1 (enExample)
DE (1) DE69913317T2 (enExample)
TW (1) TW412460B (enExample)
WO (1) WO1999036196A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368183B1 (en) * 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
WO2002088683A1 (en) * 2001-04-30 2002-11-07 The Board Of Trustees Of The University Of Illinois Method and apparatus for characterization of ultrathin silicon oxide films using mirror-enhanced polarized reflectance fourier transform infrared spectroscopy
DE60320227T2 (de) * 2002-02-20 2009-05-20 Ebara Corp. Verfahren und einrichtung zum polieren
US7040240B2 (en) * 2002-04-10 2006-05-09 Ebara Corporation Ash fusing system, method of operating the system, and gasification fusing system for waste
US6916233B2 (en) * 2002-11-28 2005-07-12 Tsc Corporation Polishing and cleaning compound device
US7077731B1 (en) * 2003-12-22 2006-07-18 Lam Research Corporation Chemical mechanical planarization (CMP) system and method for preparing a wafer in a cleaning module
TWI372661B (en) * 2007-11-21 2012-09-21 Tokyo Electron Ltd Cleaning apparatus and cleaning method
US8468637B2 (en) * 2009-02-06 2013-06-25 Endoclear Llc Mechanically-actuated endotracheal tube cleaning device
JP6346541B2 (ja) * 2014-10-10 2018-06-20 株式会社荏原製作所 バフ処理装置、および、基板処理装置
SG10201508329UA (en) * 2014-10-10 2016-05-30 Ebara Corp Buffing apparatus and substrate processing apparatus
CN111854428B (zh) * 2019-04-29 2024-12-06 伊利诺斯工具制品有限公司 网带用清洁装置及具有网带用清洁装置的烧结炉
KR20200130545A (ko) * 2019-05-08 2020-11-19 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
JP7491774B2 (ja) * 2020-08-24 2024-05-28 株式会社荏原製作所 基板保持回転機構、基板処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
JPS59110550A (ja) * 1982-12-17 1984-06-26 Himejima Dousen Kk 電気めつき線の研磨装置
JPH06101329B2 (ja) * 1982-12-23 1994-12-12 松下電器産業株式会社 電池用極板のバフ研磨機
US4586296A (en) * 1984-07-03 1986-05-06 Charlton Associates Method of finishing the surface of a disc
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JPH01226167A (ja) * 1988-03-07 1989-09-08 Seiko Epson Corp 半導体装置基板の製造方法
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
US5140774A (en) * 1991-10-31 1992-08-25 System Seiko Co., Ltd. Apparatus for polishing hard disk substrates
JP3315544B2 (ja) * 1994-11-29 2002-08-19 株式会社荏原製作所 半導体ウエハ研磨装置および方法
JPH07211677A (ja) 1993-11-30 1995-08-11 M Setetsuku Kk 基板のスクラビング方法とその装置
US5555177A (en) 1994-05-27 1996-09-10 Ontrak Systems, Inc. Method and apparatus for resetting individual processes in a control system
FR2722511B1 (fr) * 1994-07-15 1999-04-02 Ontrak Systems Inc Procede pour enlever les metaux dans un dispositif de recurage
JPH08150377A (ja) * 1994-11-29 1996-06-11 M Setetsuku Kk スクラビング用円筒ブラシ
US5551986A (en) 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
US5704987A (en) 1996-01-19 1998-01-06 International Business Machines Corporation Process for removing residue from a semiconductor wafer after chemical-mechanical polishing
JP3658454B2 (ja) * 1996-03-29 2005-06-08 コマツ電子金属株式会社 半導体ウェハの製造方法
US5809832A (en) 1996-08-29 1998-09-22 Ontrak Systems, Inc. Roller positioning apparatus
US5794299A (en) 1996-08-29 1998-08-18 Ontrak Systems, Inc. Containment apparatus
DE19917064A1 (de) * 1999-04-15 2000-08-24 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Schichtstruktur

Also Published As

Publication number Publication date
WO1999036196A1 (en) 1999-07-22
KR20010040352A (ko) 2001-05-15
EP1056549B1 (en) 2003-12-03
ATE255473T1 (de) 2003-12-15
DE69913317D1 (de) 2004-01-15
DE69913317T2 (de) 2004-09-30
TW412460B (en) 2000-11-21
JP2002509367A (ja) 2002-03-26
US6200201B1 (en) 2001-03-13
EP1056549A1 (en) 2000-12-06

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