KR100571353B1 - 다기능 마이크로 구조(ｍｉｃｒｏｓｔｒｕｃｔｕｒｅ) 및 그생산 방법 - Google Patents

다기능 마이크로 구조(ｍｉｃｒｏｓｔｒｕｃｔｕｒｅ) 및 그생산 방법 Download PDF

Info

Publication number
KR100571353B1
KR100571353B1 KR1019997004116A KR19997004116A KR100571353B1 KR 100571353 B1 KR100571353 B1 KR 100571353B1 KR 1019997004116 A KR1019997004116 A KR 1019997004116A KR 19997004116 A KR19997004116 A KR 19997004116A KR 100571353 B1 KR100571353 B1 KR 100571353B1
Authority
KR
South Korea
Prior art keywords
layer
relief
properties
microstructure
functional material
Prior art date
Application number
KR1019997004116A
Other languages
English (en)
Korean (ko)
Other versions
KR20000053171A (ko
Inventor
티모시죠지 라이언
토마스그리어슨 하비
Original Assignee
에피겜 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에피겜 리미티드 filed Critical 에피겜 리미티드
Publication of KR20000053171A publication Critical patent/KR20000053171A/ko
Application granted granted Critical
Publication of KR100571353B1 publication Critical patent/KR100571353B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1007—Running or continuous length work
    • Y10T156/1023—Surface deformation only [e.g., embossing]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y10T156/1041—Subsequent to lamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019997004116A 1996-11-09 1997-11-10 다기능 마이크로 구조(ｍｉｃｒｏｓｔｒｕｃｔｕｒｅ) 및 그생산 방법 KR100571353B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9623185.7 1996-11-09
GBGB9623185.7A GB9623185D0 (en) 1996-11-09 1996-11-09 Improved micro relief element and preparation thereof
PCT/GB1997/003008 WO1998021626A1 (en) 1996-11-09 1997-11-10 Multifunctional microstructures and preparation thereof

Publications (2)

Publication Number Publication Date
KR20000053171A KR20000053171A (ko) 2000-08-25
KR100571353B1 true KR100571353B1 (ko) 2006-04-14

Family

ID=10802579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019997004116A KR100571353B1 (ko) 1996-11-09 1997-11-10 다기능 마이크로 구조(ｍｉｃｒｏｓｔｒｕｃｔｕｒｅ) 및 그생산 방법

Country Status (8)

Country Link
US (1) US6284072B1 (de)
EP (1) EP0937280B1 (de)
JP (2) JP2001504043A (de)
KR (1) KR100571353B1 (de)
AU (1) AU4954397A (de)
DK (1) DK0937280T3 (de)
GB (1) GB9623185D0 (de)
WO (1) WO1998021626A1 (de)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520396B2 (ja) * 1997-07-02 2004-04-19 セイコーエプソン株式会社 アクティブマトリクス基板と表示装置
JP3580092B2 (ja) * 1997-08-21 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス型表示装置
DE69829458T2 (de) * 1997-08-21 2005-09-29 Seiko Epson Corp. Anzeigevorrichtung mit aktiver matrix
US6473220B1 (en) 1998-01-22 2002-10-29 Trivium Technologies, Inc. Film having transmissive and reflective properties
JP3524424B2 (ja) 1999-04-01 2004-05-10 キヤノン株式会社 マイクロ構造体アレイ用金型又は金型マスター、及びその作製方法
US6272275B1 (en) 1999-06-25 2001-08-07 Corning Incorporated Print-molding for process for planar waveguides
US6752966B1 (en) * 1999-09-10 2004-06-22 Caliper Life Sciences, Inc. Microfabrication methods and devices
US6670607B2 (en) * 2000-01-05 2003-12-30 The Research Foundation Of State University Of New York Conductive polymer coated nano-electrospray emitter
US6337122B1 (en) 2000-01-11 2002-01-08 Micron Technology, Inc. Stereolithographically marked semiconductors devices and methods
US6749813B1 (en) 2000-03-05 2004-06-15 3M Innovative Properties Company Fluid handling devices with diamond-like films
US6677868B2 (en) * 2001-03-16 2004-01-13 Sharp Laboratories Of America, Inc. Entropy coding with adaptive syntax to replace high probability symbols with lower probabilities symbols
US6620542B2 (en) * 2001-05-30 2003-09-16 Hewlett-Packard Development Company, L.P. Flex based fuel cell
US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
US20030038105A1 (en) * 2001-08-27 2003-02-27 Harker Alan B. Tool for embossing high aspect ratio microstructures
GB0207134D0 (en) 2002-03-27 2002-05-08 Cambridge Display Tech Ltd Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained
JP2006503969A (ja) * 2002-08-20 2006-02-02 ザ リージェンツ オブ ザ ユニヴァーシティ オブ コロラド ポリマー誘導セラミック材料
JP2006502269A (ja) * 2002-10-09 2006-01-19 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド キャリア物質を着色する方法
US6742456B1 (en) * 2002-11-14 2004-06-01 Hewlett-Packard Development Company, L.P. Rapid prototyping material systems
US7070406B2 (en) * 2003-04-29 2006-07-04 Hewlett-Packard Development Company, L.P. Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US6808646B1 (en) 2003-04-29 2004-10-26 Hewlett-Packard Development Company, L.P. Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
US6950157B2 (en) * 2003-06-05 2005-09-27 Eastman Kodak Company Reflective cholesteric liquid crystal display with complementary light-absorbing layer
US7296592B2 (en) * 2003-09-16 2007-11-20 Eksigent Technologies, Llc Composite polymer microfluidic control device
CA2540035C (en) 2003-09-23 2012-11-20 University Of North Carolina At Chapel Hill Photocurable perfluoropolyethers for use as novel materials in microfluidic devices
EP1542074A1 (de) * 2003-12-11 2005-06-15 Heptagon OY Herstellung eines Werkzeugs zur Vervielfältigung
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
KR101376715B1 (ko) 2003-12-19 2014-03-27 더 유니버시티 오브 노쓰 캐롤라이나 엣 채플 힐 소프트 또는 임프린트 리소그래피를 이용하여 분리된 마이크로- 및 나노- 구조를 제작하는 방법
US20070275193A1 (en) * 2004-02-13 2007-11-29 Desimone Joseph M Functional Materials and Novel Methods for the Fabrication of Microfluidic Devices
US6967118B2 (en) * 2004-03-09 2005-11-22 Hewlett-Packard Development Company, L.P. Process for creating Metal-Insulator-Metal devices
JP4544913B2 (ja) * 2004-03-24 2010-09-15 富士フイルム株式会社 表面グラフト形成方法、導電性膜の形成方法、金属パターン形成方法、多層配線板の形成方法、表面グラフト材料、及び導電性材料
US7716823B2 (en) 2004-04-08 2010-05-18 Hewlett-Packard Development Company, L.P. Bonding an interconnect to a circuit device and related devices
US7470386B2 (en) * 2004-04-26 2008-12-30 Sipix Imaging, Inc. Roll-to-roll embossing tools and processes
US7419639B2 (en) * 2004-05-12 2008-09-02 The Board Of Trustees Of The Leland Stanford Junior University Multilayer microfluidic device
US7547978B2 (en) * 2004-06-14 2009-06-16 Micron Technology, Inc. Underfill and encapsulation of semiconductor assemblies with materials having differing properties
DE102004042111A1 (de) * 2004-08-30 2006-03-09 Ovd Kinegram Ag Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung
EP1635199A1 (de) * 2004-09-14 2006-03-15 LG Electronics Inc. Drahtgitter-Polarisator und Verfahren zu dessen Herstellung
US20060056024A1 (en) * 2004-09-15 2006-03-16 Ahn Seh W Wire grid polarizer and manufacturing method thereof
EP1820619A4 (de) * 2004-11-30 2010-07-07 Asahi Glass Co Ltd Formwerkzeug und verfahren zur herstellung von substraten mit übertragenen mikromustern darauf
US20090027603A1 (en) * 2005-02-03 2009-01-29 Samulski Edward T Low Surface Energy Polymeric Material for Use in Liquid Crystal Displays
WO2007007134A1 (en) * 2005-07-07 2007-01-18 Nokia Corporation Manufacturing of optical waveguides by embossing grooves by rolling
WO2007133235A2 (en) * 2005-08-08 2007-11-22 Liquidia Technologies, Inc. Micro and nano-structure metrology
EP1922364A4 (de) 2005-08-09 2010-04-21 Univ North Carolina Verfahren und materialien zur herstellung mikrofluidischer vorrichtungen
US7799885B2 (en) * 2005-11-30 2010-09-21 Corning Incorporated Photo or electron beam curable compositions
FR2897858B1 (fr) * 2006-02-27 2008-06-20 Commissariat Energie Atomique Procede de fabrication d'un reseau de capillaires d'une puce
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
CN101578520B (zh) 2006-10-18 2015-09-16 哈佛学院院长等 基于形成图案的多孔介质的横向流动和穿过生物测定装置、及其制备方法和使用方法
US20100151031A1 (en) * 2007-03-23 2010-06-17 Desimone Joseph M Discrete size and shape specific organic nanoparticles designed to elicit an immune response
US7923298B2 (en) * 2007-09-07 2011-04-12 Micron Technology, Inc. Imager die package and methods of packaging an imager die on a temporary carrier
TW200946775A (en) 2008-02-27 2009-11-16 Brilliant Film Llc Concentrators for solar power generating systems
AU2009228091B2 (en) 2008-03-27 2015-05-21 President And Fellows Of Harvard College Three-dimensional microfluidic devices
WO2009120963A2 (en) * 2008-03-27 2009-10-01 President And Fellows Of Harvard College Paper-based cellular arrays
CA2719800A1 (en) * 2008-03-27 2009-10-01 President And Fellows Of Harvard College Paper-based microfluidic systems
EP2257818B1 (de) * 2008-03-27 2017-05-10 President and Fellows of Harvard College Baumwollfaden als kostengünstige diagnoseplattform für mehrere assays
US8961858B2 (en) * 2008-04-14 2015-02-24 Rolls-Royce Corporation Manufacture of field activated components by stereolithography
KR20110023853A (ko) * 2008-05-06 2011-03-08 그라코 미네소타 인크. 세척 유체 카트리지
WO2010022324A2 (en) * 2008-08-22 2010-02-25 President And Fellows Of Harvard College Methods of patterning paper
MX366510B (es) * 2008-12-05 2019-07-11 Liquidia Tech Inc Metodo para producir materiales modelados.
WO2010102279A1 (en) 2009-03-06 2010-09-10 President And Fellows Of Harvard College Microfluidic, electromechanical devices
US20110138753A1 (en) * 2009-12-11 2011-06-16 International Paper Company Container with Repulpable Moisture Resistant Barrier
CN102821861B (zh) 2010-02-03 2015-03-25 哈佛大学校长及研究员协会 用于多重测定的装置和方法
GB2479150B (en) 2010-03-30 2013-05-15 Pragmatic Printing Ltd Transistor and its method of manufacture
KR101385086B1 (ko) * 2010-05-04 2014-04-14 유니-픽셀 디스플레이스, 인코포레이티드 전기 전도성 패턴을 가진 미세 구조 표면을 제조하는 방법
GB201007669D0 (en) 2010-05-07 2010-06-23 Epigem Ltd Composite electrode for molecular electronic devices and method of manufacture thereof
US9358576B2 (en) 2010-11-05 2016-06-07 International Paper Company Packaging material having moisture barrier and methods for preparing same
US9365980B2 (en) 2010-11-05 2016-06-14 International Paper Company Packaging material having moisture barrier and methods for preparing same
GB2492442B (en) 2011-06-27 2015-11-04 Pragmatic Printing Ltd Transistor and its method of manufacture
EP2872892B1 (de) 2012-07-10 2017-12-20 Lexogen GmbH Flexible dns sensor tragerform und verfahren zu dessen verwendung
US10040018B2 (en) 2013-01-09 2018-08-07 Imagine Tf, Llc Fluid filters and methods of use
US9861920B1 (en) 2015-05-01 2018-01-09 Imagine Tf, Llc Three dimensional nanometer filters and methods of use
US10730047B2 (en) 2014-06-24 2020-08-04 Imagine Tf, Llc Micro-channel fluid filters and methods of use
US10124275B2 (en) 2014-09-05 2018-11-13 Imagine Tf, Llc Microstructure separation filters
US10758849B2 (en) 2015-02-18 2020-09-01 Imagine Tf, Llc Three dimensional filter devices and apparatuses
US10118842B2 (en) 2015-07-09 2018-11-06 Imagine Tf, Llc Deionizing fluid filter devices and methods of use
US10479046B2 (en) 2015-08-19 2019-11-19 Imagine Tf, Llc Absorbent microstructure arrays and methods of use
US10707531B1 (en) 2016-09-27 2020-07-07 New Dominion Enterprises Inc. All-inorganic solvents for electrolytes
GB2561004B (en) 2017-03-31 2022-06-01 Pragmatic Printing Ltd Electronic structures and their methods of manufacture
CN110994167B (zh) * 2019-12-03 2022-05-06 浙江清华柔性电子技术研究院 耐高温柔性阵列天线及其制作方法
US11476128B2 (en) * 2020-08-25 2022-10-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661212A (en) * 1985-10-22 1987-04-28 Kernforschungszentrum Kalrsruhe Gmbh Method for producing a plurality of plate shaped microstructured metal bodies

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800476A1 (de) * 1977-01-07 1978-07-13 Instruments Sa Verfahren zur duplizierung einer optischen flaeche sowie so hergestelltes beugungsgitter
JPS55118823A (en) * 1979-03-07 1980-09-12 Tokyo Seat Kk Patern coloring and forming method
US4307165A (en) * 1980-10-02 1981-12-22 Eastman Kodak Company Plural imaging component microcellular arrays, processes for their fabrication, and electrographic compositions
DE3400557C1 (de) 1984-01-10 1985-08-29 Fa. Eduard Hueck, 5880 Lüdenscheid Verfahren zur Erzeugung von Praegegravuren auf impraegnierten Dekorpapieren
DE3524411A1 (de) * 1985-07-09 1987-01-15 Kernforschungsz Karlsruhe Verfahren zum herstellen von spinnduesenplatten
DE3529966C1 (de) * 1985-08-22 1987-01-15 Kernforschungsz Karlsruhe Verfahren zur Herstellung von Masken fuer die Roentgentiefenlithographie
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4702792A (en) * 1985-10-28 1987-10-27 International Business Machines Corporation Method of forming fine conductive lines, patterns and connectors
JPS636453A (ja) 1986-06-26 1988-01-12 Fuji Heavy Ind Ltd 排気ガス空燃比計測センサ
DE3926918A1 (de) 1989-08-16 1991-02-21 Wolfgang Wagner Vorrichtung zum praegen von reliefmustern auf einem kontinuierlich zufuehrbaren informationstraeger
DE4001399C1 (en) * 1990-01-19 1991-07-25 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De Metallic microstructures - formed on substrates, by putting poly:methyl methacrylate] between moulding tool and silicon substrate
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5318687A (en) * 1992-08-07 1994-06-07 International Business Machines Corporation Low stress electrodeposition of gold for X-ray mask fabrication
JPH06283863A (ja) * 1993-03-30 1994-10-07 Mitsubishi Electric Corp 多層配線基板の製造方法
JPH0735920A (ja) * 1993-07-26 1995-02-07 Sumitomo Chem Co Ltd 基板上に枠部の機能性塗膜等を形成する方法
GB9320326D0 (en) 1993-10-01 1993-11-17 Ici Plc Organic optical components and preparation thereof
US5514503A (en) * 1994-10-17 1996-05-07 Corning Incorporated Apparatus and method for printing a color filter
JPH07325392A (ja) * 1994-06-01 1995-12-12 Hoechst Japan Ltd カラーフィルター製造用感光性樹脂組成物
JP3571396B2 (ja) * 1995-01-17 2004-09-29 大日本印刷株式会社 カラーフィルタおよびカラーフィルタの製造方法
JPH10199993A (ja) 1997-01-07 1998-07-31 Mitsubishi Electric Corp 半導体回路装置及びその製造方法、半導体回路装置製造用マスク装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661212A (en) * 1985-10-22 1987-04-28 Kernforschungszentrum Kalrsruhe Gmbh Method for producing a plurality of plate shaped microstructured metal bodies

Also Published As

Publication number Publication date
EP0937280A1 (de) 1999-08-25
JP2001504043A (ja) 2001-03-27
WO1998021626A1 (en) 1998-05-22
KR20000053171A (ko) 2000-08-25
AU4954397A (en) 1998-06-03
GB9623185D0 (en) 1997-01-08
DK0937280T3 (da) 2013-09-02
EP0937280B1 (de) 2013-05-29
JP2009095971A (ja) 2009-05-07
US6284072B1 (en) 2001-09-04

Similar Documents

Publication Publication Date Title
KR100571353B1 (ko) 다기능 마이크로 구조(ｍｉｃｒｏｓｔｒｕｃｔｕｒｅ) 및 그생산 방법
JP3811108B2 (ja) プラスチック基板上の金属微細パターンの形成方法
EP0812434B1 (de) Oberflächenstrukturierung mittels mikrokontaktdruckverfahren, sowie damit erzeugte artikel
KR100562219B1 (ko) 나노프린트장치 및 미세구조 전사방법
EP1416303B1 (de) Verfahren zur Herstellung funktioneller Substrate, die kolumnare Mikrosäulen aufweisen
US5512131A (en) Formation of microstamped patterns on surfaces and derivative articles
US7875197B2 (en) Methods of etching articles via microcontact printing
CN101377618B (zh) 双面压印光刻系统
KR100618013B1 (ko) 마이크로 유체 제품 및 이를 제조하는 방법
US6518168B1 (en) Self-assembled monolayer directed patterning of surfaces
US7531120B2 (en) Method of making a product with a micro or nano sized structure and product
JP5197617B2 (ja) パターン指示層を有するドナーフィルム
JP2004288783A (ja) ナノプリント装置、及び微細構造転写方法
JP4090374B2 (ja) ナノプリント装置、及び微細構造転写方法
JP4539031B2 (ja) 光電気混載基板の製造方法
JP4220282B2 (ja) ナノプリント装置、及び微細構造転写方法
Perera et al. Recent progress in functionalized plastic 3D printing in creation of metallized architectures
JP4244207B2 (ja) 緩衝層付押圧転写用金型及び押圧転写方法
CN102781637B (zh) 使用流体射束开孔的方法
KR100836633B1 (ko) 스템퍼 제조방법
Schrauben et al. Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130328

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20140409

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee