KR100571344B1 - 와이어 본딩방법 - Google Patents

와이어 본딩방법 Download PDF

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Publication number
KR100571344B1
KR100571344B1 KR1020040052573A KR20040052573A KR100571344B1 KR 100571344 B1 KR100571344 B1 KR 100571344B1 KR 1020040052573 A KR1020040052573 A KR 1020040052573A KR 20040052573 A KR20040052573 A KR 20040052573A KR 100571344 B1 KR100571344 B1 KR 100571344B1
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KR
South Korea
Prior art keywords
wire
ball
neck
bond point
loop
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Expired - Fee Related
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KR1020040052573A
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English (en)
Korean (ko)
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KR20050013074A (ko
Inventor
미이다츠나리
세키네나오키
Original Assignee
가부시키가이샤 신가와
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Publication of KR20050013074A publication Critical patent/KR20050013074A/ko
Application granted granted Critical
Publication of KR100571344B1 publication Critical patent/KR100571344B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1020040052573A 2003-07-25 2004-07-07 와이어 본딩방법 Expired - Fee Related KR100571344B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00279556 2003-07-25
JP2003279556A JP4105996B2 (ja) 2003-07-25 2003-07-25 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
KR20050013074A KR20050013074A (ko) 2005-02-02
KR100571344B1 true KR100571344B1 (ko) 2006-04-14

Family

ID=34265628

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040052573A Expired - Fee Related KR100571344B1 (ko) 2003-07-25 2004-07-07 와이어 본딩방법

Country Status (3)

Country Link
JP (1) JP4105996B2 (enrdf_load_stackoverflow)
KR (1) KR100571344B1 (enrdf_load_stackoverflow)
TW (1) TW200504902A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0838127A (ja) * 1994-08-04 1996-02-13 Asahi Chem Ind Co Ltd 非コーヒー乳性飲料及びその製法
US8110931B2 (en) 2008-07-11 2012-02-07 Advanced Semiconductor Engineering, Inc. Wafer and semiconductor package
TWI372453B (en) 2008-09-01 2012-09-11 Advanced Semiconductor Eng Copper bonding wire, wire bonding structure and method for processing and bonding a wire
TWI415707B (zh) * 2008-09-01 2013-11-21 Advanced Semiconductor Eng 銅製銲線、銲線接合結構及銲線接合方法
JP2011054727A (ja) * 2009-09-01 2011-03-17 Oki Semiconductor Co Ltd 半導体装置、その製造方法、及びワイヤボンディング方法
CN102097317B (zh) * 2010-12-01 2015-04-29 佛山市南海区宏乾电子有限公司 一种全包封装开关电源三极管的生产方法
JP5890798B2 (ja) * 2013-05-27 2016-03-22 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
KR20160055100A (ko) 2014-10-03 2016-05-17 인텔 코포레이션 수직 기둥들을 갖는 오버랩핑 적층형 다이 패키지
JP6166769B2 (ja) * 2015-12-11 2017-07-19 ラピスセミコンダクタ株式会社 半導体装置

Also Published As

Publication number Publication date
JP4105996B2 (ja) 2008-06-25
TW200504902A (en) 2005-02-01
JP2005045135A (ja) 2005-02-17
TWI323013B (enrdf_load_stackoverflow) 2010-04-01
KR20050013074A (ko) 2005-02-02

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