KR100571344B1 - Wire bonding method - Google Patents

Wire bonding method Download PDF

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KR100571344B1
KR100571344B1 KR1020040052573A KR20040052573A KR100571344B1 KR 100571344 B1 KR100571344 B1 KR 100571344B1 KR 1020040052573 A KR1020040052573 A KR 1020040052573A KR 20040052573 A KR20040052573 A KR 20040052573A KR 100571344 B1 KR100571344 B1 KR 100571344B1
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South Korea
Prior art keywords
wire
ball
neck
bond point
loop
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KR1020040052573A
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Korean (ko)
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KR20050013074A (en
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미이다츠나리
세키네나오키
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가부시키가이샤 신가와
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Abstract

본 발명은 와이어 본딩방법에 관한 것이며, 압착볼 상의 목부분을 제거하여 저와이어 루프화를 도모함과 동시에, 와이어루프의 강도를 향상시키는 것을 목적으로 한다.

이를 위한 본 발명의 구성은, 제1 본드점(A)에 본딩된 압착볼(34)의 위에 상방으로 뻗은 목높이부(31)를 형성하여 제2 본드점(B)에 와이어(3)를 접속한 후, 캐필러리(4)의 하단으로 연장한 와이어(3)의 선단에 볼(5)을 형성하고, 이 볼(5)을 회로기판(1)에 눌러서 하면이 평탄하게 된 볼(5a)을 형성하고, 이어서 상기 하면이 평탄한 볼(5a)을 상기 목높이부(31)의 정상부에 눌러서 목높이부(31)을 밀어 내리는 것을 특징으로 한다.

Figure 112004029956728-pat00001

와이어 본딩방법, 압착볼, 목높이부, 와이어, 와이어 루프, 저와이어 루프, 고와이어 루프

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method, which aims to remove the neck on the crimping ball to achieve low wire looping and to improve the strength of the wire loop.

The configuration of the present invention for this purpose, by forming a neck height portion 31 extending upwards on the compression ball 34 bonded to the first bond point (A) to the wire (3) at the second bond point (B) After the connection, the ball 5 is formed at the tip of the wire 3 extending to the lower end of the capillary 4, and the ball 5 is pressed against the circuit board 1 so that the lower surface becomes flat ( 5a), and then the neck 5 is pushed down by pressing the ball 5a having the flat bottom surface to the top of the neck 31.

Figure 112004029956728-pat00001

Wire bonding method, crimp ball, neck height, wire, wire loop, low wire loop, high wire loop

Description

와이어 본딩방법{WIRE BONDING METHOD} Wire Bonding Method {WIRE BONDING METHOD}

도 1은 본 발명의 와이어 본딩방법의 일 실시예를 나타내는 공정도,1 is a process chart showing an embodiment of the wire bonding method of the present invention,

도 2는 도 1에 연속된 공정도, 2 is a process diagram continued from FIG. 1,

도 3은 본 발명의 와이어 본딩방법의 다른 실시예를 나타내는 공정도이다.3 is a process chart showing another embodiment of the wire bonding method of the present invention.

도면의 주요 부분에 대한 부호의 설명Explanation of symbols for the main parts of the drawings

(A) 제1 본드점 (B) 제2 본드점(A) First bond point (B) Second bond point

(1) 회로기판 (2) 다이 (1) circuit board (2) die

(2a) 전극패드 (3) 와이어(2a) electrode pad (3) wire

(31) 목높이부 (32) 사다리꼴 길이부 (31) Neck Height (32) Trapezoid Length

(34) 압착볼 (3a)(3b) 굴절부(34) Crimp Ball (3a) (3b) Refractor

(4) 캐필러리 (5) 볼(4) capillary (5) ball

(5a) 하면 평탄볼 (6) 와이어 가압툴(5a) Bottom flat ball (6) Wire pressing tool

본 발명은, 제1 본드점과 제2 본드점의 사이를 와이어로 접속하는 와이어 본 딩방법에 관한 것으로서, 특히 저(低)와이어 루프를 형성하는 방법에 관한 것이다.The present invention relates to a wire bonding method for connecting wires between a first bond point and a second bond point, and more particularly to a method for forming a low wire loop.

(배경기술)(Background)

제1 본드점과 제2 본드점의 사이를 접속한 와이어가 늘어지게 되면, 와이어가 다이에 접촉하여 전기적으로 쇼트 불량으로 된다. 이것을 방지하기 위하여, 종래에는, 제1 본드점에 볼을 압착하여 압착볼을 형성한 후, 압착볼의 위에 상방으로 뻗은 목높이부를 형성하고, 이 목높이부의 상단에 굴절부(구부림부)를 형성하고 있다. 예컨대, 일본국 공개특허공보 특개평 10―189641호 공보(이하, 특허문헌 1이라고 한다)를 참조하기 바란다. When the wire which connected between the 1st bond point and the 2nd bond point becomes long, a wire will contact a die | dye, and it will become an electrical short defect. In order to prevent this, conventionally, after compressing the ball at the first bond point to form a compressed ball, a neck height portion extending upward is formed on the compressed ball, and a bend portion (bending portion) is formed at the upper end of the neck height portion. Forming. For example, refer to JP-A-10-189641 (hereinafter referred to as Patent Document 1).

그러나, 상술한 바와 같은 종래 기술의 방법은, 압착볼 위에 목높이부를 형성하기 때문에, 필연적으로 고(高)와이어 루프의 형상으로 된다. 최근, 반도체장치는 소형화 및 박형화의 경향이 있지만, 종래 기술의 방법에서는 이 요망을 충분하게 만족시킬 수가 없었다. However, in the above-described prior art method, since the neck height is formed on the crimping ball, it is inevitably in the shape of a high wire loop. In recent years, semiconductor devices tend to be miniaturized and thinned, but the method of the prior art has not been able to sufficiently satisfy this demand.

본 발명의 과제는, 압착볼 위의 목높이부를 제거하여 저와이어 루프화를 도모함과 동시에, 와이어 루프 강도의 향상이 도모되는 와이어 본딩방법을 제공하는 것이다.An object of the present invention is to provide a wire bonding method in which the neck height portion on the crimping ball is removed to achieve low wire looping and at the same time improve the wire loop strength.

(과제를 해결하기 위한 수단)(Means to solve the task)

상술한 과제를 해결하기 위한 본 발명의 청구항 1은, 제1 본드점에 본딩된 압착볼의 위에 상방으로 뻗은 목높이부를 형성하여 제2 본드점에 와이어를 접속한 후, 캐필러리의 하단으로 연장한 와이어의 선단에 볼을 형성하고, 이 볼을 회로기판에 눌러서 하면이 평탄하게 된 볼을 형성하고, 이어서 상기 하면이 평탄한 볼을 상기 목높이부의 정상부에 눌러서 목높이부를 밀어 내리는 것을 특징으로 한다. Claim 1 of the present invention for solving the above-mentioned problem, after forming a neck height portion extending upward on the bonding ball bonded to the first bond point, and after connecting the wire to the second bond point, it extends to the lower end of the capillary A ball is formed at the tip of a wire, and the ball is pressed against a circuit board to form a ball having a flat bottom surface, and then the ball having a flat bottom surface is pushed to the top of the neck height portion to push down the neck height portion. .

상술한 과제를 해결하기 위한 본 발명의 청구항 2는, 제1 본드점에 본딩된 압착볼의 위에 상방으로 뻗은 목높이부를 형성하여 제2 본드점에 와이어를 접속한 후, 와이어 가압툴을 상기 목높이부의 정상부에 눌러서 목높이부를 밀어 내리는 것을 특징으로 한다. Claim 2 of the present invention for solving the above problems, after forming a neck height portion extending upwards on the pressing ball bonded to the first bond point to connect the wire to the second bond point, the wire pressing tool to the neck Press down on the top of the height characterized in that the push down the neck.

(발명을 실시하기 위한 최선의 형태)(The best mode for carrying out the invention)

본 발명의 와이어 본딩방법의 일 실시예를 도 1 및 도 2를 참조하면서 설명한다. 도 1(a)에 나타나 있는 바와 같이, 세라믹 기판이나 프린트 기판 등의 기판 또는 리드프레임 등으로 이루어지는 회로기판(1)의 위에는, 전극패드(2a)가 형성된 다이(2)가 마운팅되어 있다. 전극패드(2a)의 제1 본드점(A)과 회로기판(1)의 배선 또는 리드 등의 제2 본드점(B)의 사이는 와이어(3)에 의해 전기적으로 접속되어 있다. An embodiment of the wire bonding method of the present invention will be described with reference to FIGS. 1 and 2. As shown in Fig. 1A, a die 2 on which an electrode pad 2a is formed is mounted on a circuit board 1 made of a substrate such as a ceramic substrate, a printed substrate, a lead frame, or the like. The wire 3 is electrically connected between the first bond point A of the electrode pad 2a and the second bond point B such as a wiring or a lead of the circuit board 1.

도 1(a)에 도시된 와이어(3)의 루프형상은, 일반적으로 사다리꼴 루프라고 불리워지며, 상술한 특허문헌1의 도 5(a)와 같은 것으로서 동 특허문헌1의 도 6에 제시된 공정에 의해 형성되므로, 그 상세한 설명은 생략한다. 제1 본드점(A)과 제2 본드점(B)에 접속한 와이어루프의 형상은, 목높이부(31), 사다리꼴 길이부(32) 및 경사부(33)로 이루어져 있고, 사다리꼴 길이부(32)의 양단에 굴절부(3a, 3b)가 형성되어 있다. 또, 참조부호(34)는 와이어(3)의 선단에 형성된 볼을 전극패드 (2a)에 본딩하여 형성된 압착볼을 나타낸다. 이러한 사다리꼴 루프는, 다이(2)의 각 제1 본드점(A)과 이 제1 본드점(A)에 대응하는 각 제2 본드점(B)에 각각 형성된다. 이상은 종래 기술과 같다. The loop shape of the wire 3 shown in FIG. 1 (a) is generally called a trapezoidal loop and is the same as that of FIG. 5 (a) of Patent Document 1 described above in the process shown in FIG. It is formed by, so that detailed description thereof will be omitted. The shape of the wire loop connected to the first bond point (A) and the second bond point (B) consists of a neck portion 31, a trapezoidal length portion 32, and an inclined portion 33. Refractive parts 3a and 3b are formed at both ends of (32). Reference numeral 34 denotes a compressed ball formed by bonding the ball formed at the tip of the wire 3 to the electrode pad 2a. Such a trapezoidal loop is formed in each 1st bond point A of the die | dye 2, and each 2nd bond point B corresponding to this 1st bond point A, respectively. The above is the same as the prior art.

다음에 도 1(b)에 도시된 바와 같이, 캐필러리(4)에 삽입통과된 와이어(3)의 선단에 볼(5)을 형성한다. 그 후, 도1(c)에 나타난 바와 같이 캐필러리(4)을 하강시켜서 회로기판(1)의 전기적인 접속부분 이외의 부분(전기적으로 영향을 주지 않는 부분)에 눌러서 하단이 평탄하게 된 하면 평탄볼(5a)을 형성한다. Next, as shown in Fig. 1 (b), the ball 5 is formed at the tip of the wire 3 inserted into the capillary 4. Thereafter, as shown in Fig. 1 (c), the capillary 4 is lowered, and the lower end is flattened by pressing on a portion other than the electrical connection portion of the circuit board 1 (the portion not electrically affected). The lower surface of the flat ball (5a) is formed.

다음에 도 1(d)에 도시된 바와 같이, 캐필러리(4)을 상승시키고 XY축 방향으로 이동시켜서, 하면 평탄볼(5a)을 첫번째 와이어루프의 목높이부(31)의 정상부분, 즉 굴절부(3a)의 윗쪽에 위치시킨다. 이어서, 도 1(e)에 나타난 바와 같이, 캐필러리(4)를 하강시켜서 하면 평탄볼(5a)로 굴절부(3a)를 아래쪽으로 누른다. 이에 따라 굴절부(3a)가 제거되고, 목높이부(31)는 거의 수평으로 절곡되어서 사다리꼴 길이부(32)와 거의 같은 수평형상으로 된다. 그후, 도 2에 도시된 바와 같이 캐필러리(4)은 상승한다. Next, as shown in Fig. 1 (d), the capillary 4 is raised and moved in the XY axis direction so that the lower surface flat ball 5a is the top of the neck height 31 of the first wire loop, That is, it is located above the refracting portion 3a. Subsequently, as shown in FIG. 1 (e), when the capillary 4 is lowered, the refracting portion 3a is pushed downward by the flat ball 5a. As a result, the refraction portion 3a is removed, and the neck portion 31 is bent almost horizontally to have a horizontal shape substantially the same as that of the trapezoidal length portion 32. The capillary 4 then rises as shown in FIG. 2.

다음의 두번째 와이어루프의 목높이부(31)의 윗쪽에 위치하여, 상술한 바와 같은 동작을 행한다. 이 동작은 3번째 이후의 와이어루프에 관해서도 마찬가지로 행한다. 미리 결정되어 있는 갯수의 와이어루프에 관하여 목높이부(31)를 누르는 동작을 행한 후, 하면 평탄볼(5a)을 회로기판(1)의 전기적으로 영향을 주지 않는 부분에 스티치본드하여서 제거하고, 하면 평탄볼(5a)을 새로 형성하여 상술한 동작을 행한다. It is located above the neck height part 31 of the next second wire loop and performs the operation as described above. This operation is similarly performed for the third and subsequent wire loops. After pressing the neck portion 31 with respect to the predetermined number of wire loops, the lower surface flat ball 5a is stitch-bonded to a portion which is not electrically affected by the circuit board 1, and then removed. When the flat ball 5a is newly formed, the above-described operation is performed.

다음에 도 1(a)에 도시된 사다리꼴 루프(이하, 종래예라고 한다 )와 도 2에 도시된 저와이어 루프(이하, 본 실시예라고 한다)와의 인장강도시험을 행한 결과에 관하여 설명한다. 와이어(3)는 스미토모 킨조쿠 코잔 가부시키가이샤제의 형식 「SGL(2)」의 금선 25μm을 사용하고, 종래예 및 본 실시예를 각각 40가닥의 와이어(3)에 대해서 시험을 행하였다. 또, 와이어루프의 길이는 평균 0.97mm이었다. 제1 본드점(A)으로부터 제2 본드점(B)의 방향으로 200μm 떨어진 와이어(3)의 부분을 위쪽에 인장하중을 가하여 와이어(3)의 파단을 조사한 결과, 표1과 같은 결과를 얻을 수 있었다. Next, the results of the tensile strength test of the trapezoidal loop (hereinafter referred to as a conventional example) shown in FIG. 1A and the low-wire loop (hereinafter referred to as this embodiment) shown in FIG. 2 will be described. As for the wire 3, 25 micrometers of gold wires of the form "SGL (2)" by Sumitomo Kinzoku Kozan Co., Ltd. were used, and the conventional example and the present Example were each tested about 40 strands of wire 3, respectively. The length of the wire loop was 0.97 mm on average. As a result of investigating the fracture of the wire 3 by applying a tensile load on the portion of the wire 3 200 μm away from the first bond point A in the direction of the second bond point B, the results shown in Table 1 were obtained. Could.

종래 예Conventional example 본 실시예Example 최대maximum 최소at least 평균Average 최대maximum 최소at least 평균Average 루프 높이(μm)Loop height (μm) 9292 6969 77.377.3 5252 4040 47.347.3 인장강도 (g)Tensile strength (g) 10.110.1 5.15.1 7.717.71 10.810.8 8.98.9 10.110.1

표 1에서 명백한 바와 같이, 본 실시예에서는 종래 예보다, 루프의 높이는 평균 30.0μm 낮아지게 되고 인장강도는 2.39g 증대하였다. 또, 종래 예에서는 압착볼(34)의 상단부에서 와이어(3)가 파단되었지만, 본 실시예에서는 인장하중을 가한 개소에서 와이어(3)가 파단되었다. As is apparent from Table 1, in the present embodiment, the height of the loop is lowered by an average of 30.0 µm and the tensile strength is increased by 2.39 g than the conventional example. In the conventional example, the wire 3 was broken at the upper end of the crimping ball 34, but in the present embodiment, the wire 3 was broken at the place where the tensile load was applied.

이와 같이, 본 실시예에서는 압착볼(34)의 상단에서는 파단하지 않고 인장하중을 가한 부분에서 파단하였으며, 또 인장강도가 증대함으로써 압착볼(34)의 상단 부의 강도가 증대하여 이 압착볼(34)의 상단부로부터의 늘어지는 현상이 발생하지 않으며, 또 하면 평탄볼(5a)에 의하여 목높이부(31)를 눌러서 굴절부(3a)의 굴절이 제거되어 목높이부(31)와 사다리꼴 길이부(32)가 거의 수평으로 형성된 것이라고 생각된다. 이와 같이, 목높이부(31)가 없어져서 극히 낮은 와이어루프가 형성되었다. As described above, in the present embodiment, the upper end of the crimping ball 34 is not broken, but it is broken at the portion to which the tensile load is applied, and the tensile strength is increased, so that the strength of the upper end of the crimping ball 34 is increased and the crimping ball 34 is increased. The phenomenon of sagging from the upper end of the c) does not occur, and then the neck portion 31 is pressed by the flat ball 5a to remove the deflection of the refraction portion 3a, so that the neck portion 31 and the trapezoidal length portion are removed. It is thought that 32 is formed almost horizontally. In this way, the neck height part 31 was missing and an extremely low wire loop was formed.

또, 상기 실시예에서는 도 1(a)의 와이어루프를 전부 혹은 다수 가닥으로 형성한 후에 도 1(b) 내지 도 1(e) 및 도 2의 공정을 행하였으나, 1가닥의 와이어루프를 형성한 후에 도 1(b) 내지 도 1(e) 및 도 2의 공정을 행하여도 좋다. 그러나, 이 방법에 의하면 도 1(c)의 공정 및 하면 평탄볼(5a)을 제거하는 스티치 공정을 매회 행할 필요가 있으므로 생산성이 나쁘다. 또, 상기 실시예에서는 도 1(c)와 같이 하면 평탄볼(5a)을 형성한 후에 이 하면 평탄볼(5a)을 도 1(d) 및 도 1(e)에 도시한 바와 같이 목높이부(31)에 눌렀지만, 이 하면 평탄볼(5a)을 형성하지 않고, 도 1(b)에 도시된 볼(5)을 직접 목높이부(31)에 눌러서 도 1(d) 및 도 1(e)에 도시된 공정을 행하여도 좋다. 그러나, 이 경우에는 볼(5)과 와이어(3)와의 위치가 어긋나는 일이 발생하여 한 쪽이 빠져나가게 되기 쉬우므로 주의가 필요하다.In the above embodiment, the wire loop of FIG. 1 (a) is formed in all or a plurality of strands, and then the steps of FIGS. 1 (b) to 1 (e) and 2 are performed, but one wire loop is formed. After that, the steps of Figs. 1 (b) to 1 (e) and Fig. 2 may be performed. However, according to this method, it is necessary to perform the process of FIG. 1 (c) and the stitch process of removing the lower surface flat ball 5a each time, resulting in poor productivity. In the above embodiment, as shown in Fig. 1 (c), the flat ball 5a is formed, and then the bottom flat ball 5a is shown in Figs. 1 (d) and 1 (e). (31), but the lower surface does not form the flat ball (5a), and directly presses the ball (5) shown in Fig. 1 (b) to the neck portion 31, and shows Figs. 1 (d) and 1 ( You may perform the process shown by e). However, in this case, care must be taken because the position between the ball 5 and the wire 3 is shifted and one side is likely to come out.

본 발명의 와이어 본딩방법의 제2 실시예를 도 3을 참조하면서 설명한다. 상술한 실시예에서는, 와이어 본딩을 행하는 캐필러리(4)을 이용하고, 하면 평탄볼(5a)을 형성하여 목높이부(31)의 정상부를 누르는 것이었다. 본 실시예에서는, 도 1(a) 및 도 3(a)에 도시한 바와 같이 사다리꼴 루프를 형성한 후, 하면이 평탄한 와이어 가압툴(6)로 도 3(b) 및 도 3(c)에 도시한 바와 같이 굴절부(3a)를 아래쪽 으로 누른다. 그 후, 도 3(d)에 나타난 바와 같이 와이어 가압툴(6)을 상승시켜서, 다음의 2번째 와이어루프의 목높이부(31)의 위쪽에 위치시켜 상기와 같은 동작을 행한다. 이와 같이 형성하여도, 상기와 같은 효과를 얻을 수 있다. 또, 본 실시예에서는 상술한 실시예에서와 같이 볼(5)을 형성할 필요가 없으므로, 생산성이 우수하다. A second embodiment of the wire bonding method of the present invention will be described with reference to FIG. In the above-mentioned embodiment, the capillary 4 which performs wire bonding was used, and the lower surface flat ball 5a was formed and the top part of the neck height part 31 was pressed. In this embodiment, after forming a trapezoidal loop as shown in Figs. 1 (a) and 3 (a), the wire pressing tool 6 having a flat lower surface is shown in Figs. 3 (b) and 3 (c). As shown, the refraction portion 3a is pushed downward. Thereafter, as shown in Fig. 3 (d), the wire pressing tool 6 is raised and positioned above the neck height portion 31 of the next second wire loop to perform the above operation. Even if it forms in this way, the above effects can be acquired. Moreover, in this embodiment, since it is not necessary to form the ball 5 as in the above-mentioned embodiment, productivity is excellent.

또, 상기 각 실시예는, 사다리꼴 루프에 적용한 경우에 관하여 설명하였으나, 상술한 특허문헌1의 도 5(b)의 삼각 루프, 도 1에서와 같은 사다리꼴 길이부(32)의 오목부가 형성된 루프에도 적용할 수 있음은 물론이다.Moreover, although each said Example demonstrated the case where it applied to the trapezoid loop, the triangular loop of FIG. 5 (b) of the above-mentioned patent document 1, the loop in which the recessed part of the trapezoid length part 32 like FIG. Of course, it can be applied.

본 발명에 의하면, 목높이부의 정상부를 밀어 내리므로, 압착볼의 상단부의 강도가 증대하여 이 압착볼의 상단부로부터 늘어지는 현상이 발생하지 않고, 또 목높이부를 밀어내림에 의하여 목높이부가 없어지게 되어 극히 낮은 와이어 루프가 형성된다.
According to the present invention, since the top of the neck height portion is pushed down, the strength of the upper end portion of the compression ball is increased so that the phenomenon of sagging from the upper end portion of the compression ball does not occur, and the neck height portion is removed by pushing down the neck height portion. This results in an extremely low wire loop.

Claims (2)

제1 본드점에 본딩된 압착볼의 위에 상방으로 뻗은 목높이부를 형성하여 제2 본드점에 와이어를 접속한 후, 캐필러리의 하단으로 연장한 와이어의 선단에 볼을 형성하고, 이 볼을 회로기판에 눌러서 하면이 평탄한 볼을 형성하고, 이어서 상기 하면이 평탄한 볼을 상기 목높이부의 정상부에 눌러서 목높이부를 밀어 내리는 것을 특징으로 하는 와이어 본딩방법. After forming a neck extending upwardly on the compressed ball bonded to the first bond point to connect the wire to the second bond point, a ball is formed at the tip of the wire extending to the lower end of the capillary, and the ball is And a lower surface having a flat bottom surface pressed against the substrate, and then pressing the ball having a flat bottom surface to the top of the neck height portion to push down the neck height portion. 제1 본드점에 본딩된 압착볼의 위에 상방으로 뻗은 목높이부를 형성하여 제2 본드점에 와이어를 접속한 후, 와이어 가압툴을 상기 목높이부의 정상부에 눌러서 목높이부를 밀어 내리는 것을 특징으로 하는 와이어 본딩방법. After connecting the wire to the second bond point by forming a neck height extending upward on the bonding ball bonded to the first bond point, by pressing the wire pressing tool on the top of the neck height portion, characterized in that for pushing down the neck height portion. Wire bonding method.
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