TWI323013B - - Google Patents

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Publication number
TWI323013B
TWI323013B TW093115630A TW93115630A TWI323013B TW I323013 B TWI323013 B TW I323013B TW 093115630 A TW093115630 A TW 093115630A TW 93115630 A TW93115630 A TW 93115630A TW I323013 B TWI323013 B TW I323013B
Authority
TW
Taiwan
Prior art keywords
ball
lead
neck
wire
depressed
Prior art date
Application number
TW093115630A
Other languages
Chinese (zh)
Other versions
TW200504902A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200504902A publication Critical patent/TW200504902A/en
Application granted granted Critical
Publication of TWI323013B publication Critical patent/TWI323013B/zh

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: A wire bonding method is provided to form a wire loop of extremely low height and high strength by removing a neck height portion of wire loop on a depressed ball. CONSTITUTION: A neck height portion(31) extending upwardly is formed on the top of a depressed ball(34) bonded to a first bonding point(A). After joining a wire(3) to a second bonding point(B), a ball(5) is formed at the lower end of the wire extending downwardly in a capillary(4). The ball is transformed into a depressed ball(5a) having a flat lower surface by being depressed on the circuit substrate(1). And then, the depressed ball having a flat lower surface is pressed downwardly toward the top of the neck height portion.

Description

玫、發明說明： 【發明所屬之技術領域】 .本發明，係關於將第1接合點與第2接合點間以引線 連接之4了綠、4« 、.’裏方法，特別係關於低引線環形成方法。 【先前技術】 連接第1接合點與第2接合點間之引線若產生下垂， 引線則會接n教而造成短路不良。為了要防止該不 形，習4 士 第1接合點壓接球體來形成壓接球後，在壓 形成向上方延伸之頸高部，在頸高部之上方形成曲 折部（彎曲）。例如參閱專利文獻1。 (專利文獻1)日本專利特開平1〇-189641號公報 【發明内容】 上述習知技術之方法， ’必然地會成為高引線環形 型化及薄型化之趨勢，但以 足此要求。 由於係在壓接球上形成頸高部 狀。近年來’半導體裝置有小 習知技術之方法，不能充分滿 士發明在於提供：除去壓接球上之頸高部而能謀求低 引線％化，並且能獲得引線環強度之提高的打線方法。 為了要解決上述問題，本發明之幸請專利範圍第！項 ，其特徵在於：在帛1接合點所接合之麼接球上形成向上 方延件_高部，絲引，㈣接在第2接合 官下端所延伸之引線前端形成 在毛，屈 基板來形成下面平坦球，接著將：下：：球於電路 高部之頂部使頸高㈣低該下面平坦球緊屋於該頸 為了要解決上述問題，本 ，其特徵在於：將向上方延#之申'專利範圍第2項 接人點之汽^ 方延伸之帛高部形成於接合於第i 接。點之料球上而將⑽連接 緊壓工具緊壓於咳1古加 接口點後，將引線 於。亥“部之頂部使頸高部壓低。 由於將頸高部之頂部愿低· 妗士 . ^ , 使&接球之上端部之強度 曰大故不會從該壓接球之上端部 A 挪丨屋生垂下，又，藉由頸 南。P之>1低’使頸高部消失， 夭而形成極低之引線環。 【實施方式】 藉由圖1及圖2說明本發明 。如圖1(a)所示，在 ^線方法之一貫施形態 由導線牟I^ 電路基板等之基板或 田等綠糸#所構成之電路某拓 板1上’載置形成有電極墊2a 或::粒Γ電極塾2a之第1接合點A與電路基板1之配線 5腳等之第2接合點β間藉由引線3作電氣連接。 圖1(a)所示之引線3之環路形狀，一般被稱為梯形環 新因與專散獻H 5(a)㈣，且藉㈣讀丨之圖6 之步驟形成’故省略其詳細說明。連接第】接合點A 惠第2接合點B之引線環形狀，係由頸高冑3i '梯形部長 部分32、及傾斜部33所構成’在梯形部長邊部分32之 兩端設置曲折部3a、3b。又’ 34係表示壓接球，將形成於 4 3刖端之球體接合於電極墊來形成。此種梯形環， 分別形成於晶粒2之各第i接合點A與對應該第i接合點 A之各第2接合點B。以上係與習知技術相同。 其次如圖1⑻所示’將球體5形成於插通在毛細管4 之引線3前端。此後，如圓1(c)所示，使毛細管4下降， :=路基板1之電氣連接部分以外之部分(電氣上不受 -曰之U，來形成下端為平垣之下面平坦球5a。 其久如圖1(d)所示，借革么这 銘叙管4上升且沿χΥ軸方向 移動，使下面平坦球5a位於第 π第1支引線環之頸高部31之 頂部，即曲折部3a之上方。桩 ^ . 接者如圖He)所示，使毛細 官4下降且使下面平扫破 风七 , 衣5a向下方壓低。藉此除去曲折部 a，頬尚部31則成大致水平彎 〇9 , ZA ^ <曲而成為與梯形部長邊部分 ^大致相同之水平形狀。 升。 1欠戈圆Z所不，使毛細管4上 移動且位於第2支引線環之頸高部3ι之頂部 ， 進行與前述同樣之動作。對 行……動作對第3支以後之引線環亦同樣進 仃此動作。對預定之支數 ， 之引線裱進行頸高部31之壓低後 將下面平坦球5a針腳接人 〇 ( tltch bond)於電路基板1 之電氣上不党影響的部分再 …行前述之動作 其除去’形成新下面平坦球 引線Ka)所示之梯形環(以下，稱為習知例)與低 加以說明。…使二Λ 伸強度試驗之結果 式「SGL⑵Μ 礦山有限公司製之金線（型 ，分別使用4G支引線3對習知例及本 :=Γ試驗。又，引線環長度，係平均。.97" 攸第1接&點Α向第2接合點Β 3部分朝上方加上拉伸負朽來二2°°"之引線 獲得如(表-)之結果。 之斷裂的結果， 1323013 (表一） 習知例 本實施形態 最大 最小 平均 最大 最小 平均 環路高度（#m) 92 69 77.3 52 40 ΪΓ3^ 拉伸強度(g) 10.1 5.1 7.71 10.8 8.9 irp~~ 從（表1)可知’本實施形態比習知例，環路高度係平 均低30. 0 # m，拉伸強度係增加2· 39g。又，習知例在壓接 球34之上端部引線3斷裂，但本實施形態在加上拉伸負荷 處引線3斷裂》 如此，本實施形態被認為··不會在壓接球34之上端斷 裂’而在加上拉伸負荷處斷裂，又藉由拉伸強度增大，使 壓接球34之上端部之強度增大，從該壓接球34之上端部 不產生垂下’又藉由下面平坦球5a壓低頸高部31，除去 曲折部3a之曲折’使頸高部31與梯形部長邊部分32形成 為大致水平形狀。如此頸高部31則消失，而能形成極低引 線環。 又，上述實施形態，雖將圖丨所示之引線環形成全 部或複數支後進行圖1(1；))至（6)及圖2之步驟，但是亦可 在形成1支引線環後進行圖1(b)至及圖2之步驟。然 而，此方法因每次需要施加圖〗（c)之步驟及去除下面平坦 球5a之.針腳接合步驟，故致生產力不良。又上述實施形態 ，如圖1(c)形成下面平坦球5a後，雖如圖】（d)(e)所示將 肩下面平坦球5a緊壓於頸高部31，但亦可不形成此下面 平坦球5a，而將圖1(b)之球體5直接壓於頸高部31來進 订圖（d)(e)所示之步驟。但是，若是使用球體5 ,則會產 1323013 生球體5與引線3之偏位’因—方容易脫離故要注意。 以圖3說明本發明之打線方法之第2實施形態。上述 實施形態，係使用進行打線之毛細管4，來形成下面平坦 球5a而壓低頸高部31之頂部。本實施形態，如圖iu)及 圖3(a)所示形成梯形環路後，使用下面係平坦之引線緊壓 工具6如冑3⑻〜(c)所示將曲折部％向下方壓低。其後 如圖3(d)所示引線緊壓工具6則上升，移位至下一第2支 之引線環之頸高部31之上方，進行與前述同樣之動作。即 使如此形成，亦能獲得與前述同樣之效果。又本實施形態 因不需要如前述實施形態形成球體5，故生產性優越。 圖 =’前述各實施形態’雖對適用於梯形環路之情形說 明，當然亦能適用於專利文獻之圖5(b)之三角環(在如 1之梯形部長邊部分32之中央形成凹處）。 【圖式簡單說明】 (—)圖式部分 的步^⑷七）’係表示本發明之打線方法之-實施形態 圖2 ’係接續於圖1之步驟圖。 方法之另 一實施形[Technical Fields of the Invention] The present invention relates to a method of connecting green wires, 4«, and .', which are connected by a lead between a first joint and a second joint, and particularly relates to a low lead. Ring formation method. [Prior Art] When the lead wire connecting the first bonding point and the second bonding point is drooped, the lead wire is connected to the n-lead to cause a short-circuit defect. In order to prevent this inconsistency, the first joint is crimped to the ball to form a crimping ball, and a neck portion extending upward is formed by pressing, and a bent portion (bending) is formed above the neck portion. See, for example, Patent Document 1. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei-189641. SUMMARY OF THE INVENTION The above-described method of the prior art is inevitably a tendency to form a high-lead ring shape and a thinner shape, but it is sufficient. Due to the formation of a neck-high portion on the crimp ball. In recent years, there has been a method of small-sized semiconductor devices, and it has not been sufficiently invented to provide a wire bonding method capable of reducing the strength of the lead wire by removing the neck portion on the crimp ball and reducing the lead wire. In order to solve the above problems, the patent scope of the present invention is fortunate! The item is characterized in that: the upper extension member is formed on the catching ball of the 帛1 joint, the upper portion is extended, the wire guide is formed, and (4) the leading end of the lead wire extending from the lower end of the second joint member is formed on the hair, and the substrate is bent. Forming a flat ball below, and then: lower:: the ball is at the top of the high portion of the circuit to make the neck height (four) low. The lower flat ball is tightly attached to the neck. In order to solve the above problem, the present invention is characterized in that it will be extended upwards. The upper part of the steam extension of the second entry point of the patent scope is formed to be joined to the i-th joint. Click on the material ball and connect the (10) pressing tool to the cough 1 Gujia interface point and then lead it. At the top of the section, the neck is lowered. Because the top of the neck is lower than the gentleman. ^, the strength of the upper end of the ball is so large that it does not come from the upper end of the crimping ball. The 丨 丨 生 生 , , , , , , , , 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生 生As shown in Fig. 1(a), the electrode pad 2a is placed on a certain plate 1 of a circuit such as a substrate or a substrate such as a substrate such as a circuit board or the like. The first junction A of the trench electrode 2a and the second junction β of the wiring 5 of the circuit board 1 are electrically connected by the lead 3. The loop of the lead 3 shown in Fig. 1(a) The shape, generally referred to as the trapezoidal ring new factor and the special dispersion H 5 (a) (four), and by the (four) read 丨 Figure 6 steps formed 'so a detailed description is omitted. Connections】 junction A Hui second joint The shape of the lead ring of B is formed by the neck squat 3i 'the trapezoidal portion 32 and the inclined portion 33. 'The bent portions 3a and 3b are provided at both ends of the trapezoidal side portion 32. The crimp ball is formed by bonding a ball formed at the end of the 4 3 end to the electrode pad. The trapezoidal ring is formed at each of the i-th joint A of the die 2 and the corresponding i-th joint A. 2 joint point B. The above is the same as the prior art. Next, as shown in Fig. 1 (8), the sphere 5 is formed in the front end of the lead 3 inserted through the capillary 4. Thereafter, as shown by the circle 1 (c), the capillary 4 is lowered. , := The part other than the electrical connection part of the circuit board 1 (electrically not subject to the U-shaped, the lower end is a flat ball 5a below the flat side. It is shown in Figure 1(d) for a long time. The tube 4 is raised and moved in the z-axis direction so that the lower flat ball 5a is located at the top of the neck height portion 31 of the πth first lead ring, that is, above the meandering portion 3a. The pile is shown in Figure He) , the capillary officer 4 is lowered and the lower surface is swept below the wind, and the garment 5a is lowered downward. By this, the meandering portion a is removed, and the squatting portion 31 is substantially horizontally curved, 9 ZA ^ < The edge portion ^ is substantially the same horizontal shape. l. 1 owing to the circle Z, the capillary 4 is moved and located at the neck of the second lead ring The same operation as described above is performed on the top of the portion 3i. The operation of the third step is also performed for the lead ring of the third branch. After the predetermined number of leads, the lead turns are depressed by the neck portion 31. The lower flat ball 5a is connected to the electrically non-party-affected portion of the circuit board 1 and the above-described action is performed to remove the trapezoidal ring (formed as a new lower flat ball lead Ka). For the conventional example, the description is given below.... The result of the two-strength tensile test is "SGL(2)Μ Gold wire made by Mining Co., Ltd. (type, 4G branch wire 3 respectively used for the conventional example and this: = Γ test. Also, the lead ring length is average. .97" 攸1nd & point Α to the 2nd joint Β 3 part of the top and the extension of the negative to the 2nd ° ° ° lead to obtain the result as (Table -). The result of the fracture, 1323013 (Table 1) Conventional Example Maximum and minimum average maximum and minimum mean loop height (#m) 92 69 77.3 52 40 ΪΓ3^ Tensile strength (g) 10.1 5.1 7.71 10.8 8.9 irp~~ It can be seen from (Table 1) that the present embodiment has an average lower loop height of 30. 0 # m and a tensile strength of 2.39 g. Further, in the conventional example, the lead wire 3 is broken at the end of the crimping ball 34. However, in the present embodiment, the lead wire 3 is broken at the time of applying the tensile load. Thus, the present embodiment is considered to be not at the upper end of the crimping ball 34. Fracture' breaks at the tensile load, and the tensile strength increases, so that the strength of the upper end portion of the crimping ball 34 increases, and no drop occurs from the upper end of the crimping ball 34. The lower flat ball 5a lowers the neck height portion 31, and the meandering portion of the meandering portion 3a is removed, so that the neck height portion 31 and the trapezoidal side portion 32 are formed in a substantially horizontal shape. Thus, the neck portion 31 disappears and a very low lead ring can be formed. Further, in the above-described embodiment, the lead rings shown in FIG. 1 are formed in whole or in multiple portions, and then the steps of FIGS. 1(1)) to (6) and FIG. 2 are performed, but may be performed after forming one lead ring. The steps of Figures 1(b) through 2 are shown. However, this method causes a poor productivity due to the step of applying the drawing (c) and removing the stitching step of the lower flat ball 5a each time. Further, in the above embodiment, after the lower flat ball 5a is formed as shown in Fig. 1(c), the shoulder lower flat ball 5a is pressed against the neck height portion 31 as shown in (d) and (e), but the lower surface portion 31 may not be formed. The ball 5a is flattened, and the ball 5 of Fig. 1(b) is directly pressed against the neck portion 31 to advance the steps shown in the figure (d) (e). However, if the sphere 5 is used, the 1323013 green sphere 5 and the lead 3 will be produced. A second embodiment of the wire bonding method of the present invention will be described with reference to Fig. 3 . In the above embodiment, the capillary 4 for wire bonding is used to form the lower flat ball 5a to lower the top of the neck portion 31. In the present embodiment, after the trapezoidal loop is formed as shown in Fig. iu) and Fig. 3(a), the meandering portion % is lowered downward as shown by 胄3 (8) to (c) by using the flat pressing tool 6 below. Thereafter, the lead pressing tool 6 ascends as shown in Fig. 3(d), and is displaced to the upper side of the neck height portion 31 of the next second lead ring, and the same operation as described above is performed. Even in such a manner, the same effects as described above can be obtained. Further, in the present embodiment, since it is not necessary to form the spherical body 5 as in the above embodiment, the productivity is excellent. Fig. = 'The foregoing embodiments' are described as being applicable to the case of a trapezoidal loop, and of course, can also be applied to the triangular ring of Fig. 5 (b) of the patent document (in the center of the trapezoidal side portion 32 such as 1 to form a recess ). [Brief Description of the Drawings] (-) Steps of the Drawing Section ^(4)7)' indicates the wire bonding method of the present invention - Embodiment FIG. 2' is a step diagram of FIG. Another embodiment of the method

圖3(a)〜（d)，係表示本發明之打線 態的步驟圖。 (二）元件代表符號 A第1接合點 B第2接合點 1 電路基板 10 1323013 2a 電極墊 3 引線 31 頸高部 32 梯形部長邊部分 33 壓接球 3a、3b 曲折部 4 毛細管 5 球體 5a 下面平坦球 6 引線緊.壓工具Fig. 3 (a) to (d) are diagrams showing the steps of the wire bonding state of the present invention. (2) Component symbol A first joint B second joint 1 circuit board 10 1323013 2a electrode pad 3 lead 31 neck height portion 32 trapezoidal side portion 33 crimping ball 3a, 3b meandering portion 4 capillary 5 sphere 5a Flat ball 6 wire tight pressing tool

1111

Claims (1)

1·ί_諸專利範圍替換頁98年12月 拾、申請專利範圍： 1 · 一種打線方法，其特徵在於：在第1接合點所接合 之壓接球上形成向上方延伸的頸高部，並將引線連接在第 2接合點後’在毛細管下端所延伸之引線前端形成球體’ 將:亥球體緊壓於電路基板來形成下面平坦球’ &著將該下 面平坦球緊壓於該頸高部之頂部使頸高部壓低。 拾壹、圖式： 如次頁 121· ί _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ After connecting the lead wire to the second bonding point, 'the front end of the lead wire extending at the lower end of the capillary tube forms a sphere'. The hemisphere is pressed against the circuit substrate to form a lower flat ball. & the lower flat ball is pressed against the neck The top of the high part lowers the neck height. Pick up, pattern: as the next page 12
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