KR100537897B1 - 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 - Google Patents
광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 Download PDFInfo
- Publication number
- KR100537897B1 KR100537897B1 KR10-2003-7013880A KR20037013880A KR100537897B1 KR 100537897 B1 KR100537897 B1 KR 100537897B1 KR 20037013880 A KR20037013880 A KR 20037013880A KR 100537897 B1 KR100537897 B1 KR 100537897B1
- Authority
- KR
- South Korea
- Prior art keywords
- light source
- patterned conductor
- pair
- connection
- led
- Prior art date
Links
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
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- 229910052804 chromium Inorganic materials 0.000 description 1
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- VLPFTAMPNXLGLX-UHFFFAOYSA-N trioctanoin Chemical compound CCCCCCCC(=O)OCC(OC(=O)CCCCCCC)COC(=O)CCCCCCC VLPFTAMPNXLGLX-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00129579 | 2001-04-26 | ||
JP2001129579 | 2001-04-26 | ||
JPJP-P-2001-00201436 | 2001-07-02 | ||
JPJP-P-2001-00201418 | 2001-07-02 | ||
JP2001201418 | 2001-07-02 | ||
JP2001201436 | 2001-07-02 | ||
JPJP-P-2001-00289290 | 2001-09-21 | ||
JP2001289290 | 2001-09-21 | ||
JP2002001666 | 2002-01-08 | ||
JPJP-P-2002-00001666 | 2002-01-08 | ||
PCT/JP2002/004100 WO2002089222A1 (fr) | 2001-04-26 | 2002-04-24 | Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030095400A KR20030095400A (ko) | 2003-12-18 |
KR100537897B1 true KR100537897B1 (ko) | 2005-12-20 |
Family
ID=27531879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-7013880A KR100537897B1 (ko) | 2001-04-26 | 2002-04-24 | 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3880522B2 (ja) |
KR (1) | KR100537897B1 (ja) |
CN (1) | CN1306621C (ja) |
WO (1) | WO2002089222A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101300907B1 (ko) * | 2010-10-01 | 2013-08-27 | 소닉스자펜 주식회사 | 반사갓연결장치, 이를 포함하는 반사갓결합모듈 및 등기구 |
KR20160024492A (ko) * | 2014-08-26 | 2016-03-07 | 한국단자공업 주식회사 | 엘이디 모듈, 엘이디 모듈 어셈블리 |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008300884A (ja) * | 2003-10-30 | 2008-12-11 | Furukawa Electric Co Ltd:The | Led並びにledとフラットケーブルの接続構造及びled接続回路構造体 |
JP4507062B2 (ja) * | 2003-11-20 | 2010-07-21 | オムロン株式会社 | 面光源装置及び当該装置を用いた機器 |
JP3851911B2 (ja) * | 2004-05-26 | 2006-11-29 | 株式会社アドバネクス | 発光ダイオードの固定装置及び固定構造 |
JP4556166B2 (ja) * | 2004-07-29 | 2010-10-06 | ライツ・アドバンスト・テクノロジー株式会社 | 光源装置 |
JP4654639B2 (ja) * | 2004-09-09 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP3802910B2 (ja) | 2004-09-13 | 2006-08-02 | ローム株式会社 | 半導体発光装置 |
WO2006033297A1 (ja) * | 2004-09-21 | 2006-03-30 | Intellectual Property Bank Corp. | Ledを実装したユニットの製造方法、ledソケット、led実装用電子回路基板 |
GB0421772D0 (en) * | 2004-09-30 | 2004-11-03 | Crescent Lighting Ltd | Electrical circuit and connection method |
JP4913459B2 (ja) * | 2006-03-28 | 2012-04-11 | 電気化学工業株式会社 | 金属ベース回路基板およびその製法、ならびにledモジュール |
JP5239138B2 (ja) * | 2005-08-31 | 2013-07-17 | 東芝ライテック株式会社 | Led点灯装置 |
WO2007122566A1 (en) * | 2006-04-25 | 2007-11-01 | Koninklijke Philips Electronics N.V. | Led array grid, method and device for manufacturing said grid and led component for use in the same |
KR20090007765A (ko) * | 2006-04-25 | 2009-01-20 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 대면적 led 어레이 및 그 제조 방법, 시트 소자, 및 led 어셈블리 |
WO2008031580A1 (en) * | 2006-09-12 | 2008-03-20 | Paul Lo | Integrally formed single piece light emitting diode light wire |
JP4840067B2 (ja) * | 2006-10-11 | 2011-12-21 | 豊田合成株式会社 | Ledランプ装置 |
TW200824142A (en) * | 2006-11-22 | 2008-06-01 | Lighthouse Technology Co Ltd | High power diode holder and thereof package is described |
JP5297592B2 (ja) * | 2007-02-15 | 2013-09-25 | 矢崎総業株式会社 | Led発光装置 |
WO2009038071A1 (ja) * | 2007-09-21 | 2009-03-26 | Showa Denko K.K. | 表示装置、光源連結体、照明装置、光源連結体の製造方法 |
JPWO2009066646A1 (ja) * | 2007-11-20 | 2011-04-07 | 昭和電工株式会社 | 光源連結体、発光装置、表示装置 |
JP2010034369A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池ユニットおよび太陽電池ユニット用パッケージ |
DE102008038778A1 (de) | 2008-08-12 | 2010-02-25 | Bega Gantenbrink-Leuchten Kg | Farb-LED-Strahler |
CN101806439B (zh) * | 2009-02-18 | 2013-04-17 | 黄嘉宾 | 一种led的散热结构 |
KR101020992B1 (ko) * | 2009-03-02 | 2011-03-09 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 구비한 라이트 유닛 |
JP5323668B2 (ja) | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | 照明装置及びその製造方法 |
JP2011253967A (ja) * | 2010-06-02 | 2011-12-15 | Chichibu Fuji Co Ltd | 半導体レーザ素子用エージングボード |
TW201235609A (en) * | 2010-07-13 | 2012-09-01 | Koninkl Philips Electronics Nv | Low cost mounting of LEDs in TL-retrofit tubes |
JP2012028412A (ja) * | 2010-07-20 | 2012-02-09 | Furukawa Electric Co Ltd:The | 2次元面発光レーザアレイ素子、面発光レーザ装置および光源 |
JP2012049367A (ja) * | 2010-08-27 | 2012-03-08 | Kyocera Elco Corp | 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法 |
JP5303579B2 (ja) * | 2011-01-11 | 2013-10-02 | 京セラコネクタプロダクツ株式会社 | 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール |
JP5750297B2 (ja) | 2011-04-19 | 2015-07-15 | 日本メクトロン株式会社 | 基板組立体および照明装置 |
CN102200230A (zh) * | 2011-05-18 | 2011-09-28 | 陈建伟 | Led灯泡 |
CN102974907A (zh) * | 2011-09-06 | 2013-03-20 | 苏州世鼎电子有限公司 | Led组件的焊接工艺方法 |
CN103017108B (zh) * | 2011-09-27 | 2017-04-19 | 欧司朗股份有限公司 | 基座、圆管形壳体以及包括基座和圆管形壳体的灯 |
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WO2013144858A1 (en) * | 2012-03-30 | 2013-10-03 | Koninklijke Philips N.V. | Pre-rotated overmolded bidirectional spreading lens for stretched leadframe architecture |
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CN105161602B (zh) * | 2015-09-25 | 2018-03-16 | 临安市新三联照明电器有限公司 | 一种带加强筋的led线路板 |
CN105276534A (zh) * | 2015-09-25 | 2016-01-27 | 吴少健 | 一种led线路板 |
CN106382609B (zh) * | 2016-10-18 | 2023-05-30 | 南昌大学 | 一种led灯丝条 |
JP6934180B2 (ja) * | 2017-05-17 | 2021-09-15 | アイリスオーヤマ株式会社 | Ledランプ |
DE102017131063A1 (de) * | 2017-12-22 | 2019-06-27 | Ledvance Gmbh | LED-Modul mit einem stabilisierten Leadframe |
CN110808242B (zh) * | 2019-11-20 | 2020-12-08 | 博兴战新产业发展有限公司 | 一种led灯串及其制造方法 |
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2002
- 2002-04-24 KR KR10-2003-7013880A patent/KR100537897B1/ko not_active IP Right Cessation
- 2002-04-24 CN CNB028088506A patent/CN1306621C/zh not_active Expired - Fee Related
- 2002-04-24 WO PCT/JP2002/004100 patent/WO2002089222A1/ja active Application Filing
- 2002-04-24 JP JP2002586413A patent/JP3880522B2/ja not_active Expired - Fee Related
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KR101300907B1 (ko) * | 2010-10-01 | 2013-08-27 | 소닉스자펜 주식회사 | 반사갓연결장치, 이를 포함하는 반사갓결합모듈 및 등기구 |
KR20160024492A (ko) * | 2014-08-26 | 2016-03-07 | 한국단자공업 주식회사 | 엘이디 모듈, 엘이디 모듈 어셈블리 |
KR101647953B1 (ko) | 2014-08-26 | 2016-08-12 | 한국단자공업 주식회사 | 엘이디 모듈, 엘이디 모듈 어셈블리 |
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JP3880522B2 (ja) | 2007-02-14 |
CN1306621C (zh) | 2007-03-21 |
JPWO2002089222A1 (ja) | 2004-08-19 |
WO2002089222A1 (fr) | 2002-11-07 |
CN1529914A (zh) | 2004-09-15 |
KR20030095400A (ko) | 2003-12-18 |
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