JP3851911B2 - 発光ダイオードの固定装置及び固定構造 - Google Patents
発光ダイオードの固定装置及び固定構造 Download PDFInfo
- Publication number
- JP3851911B2 JP3851911B2 JP2004156294A JP2004156294A JP3851911B2 JP 3851911 B2 JP3851911 B2 JP 3851911B2 JP 2004156294 A JP2004156294 A JP 2004156294A JP 2004156294 A JP2004156294 A JP 2004156294A JP 3851911 B2 JP3851911 B2 JP 3851911B2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- main body
- lead
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Description
そこでこの発明は、部品点数の増加を抑えた上で発光ダイオードの固定及び交換作業を容易にできる発光ダイオードの固定装置及び固定構造を提供する。
しかも、リード端子を挟持する切り出し片が装置本体と一体的に設けられることで、当該固定装置の部品点数の増加を抑えることが可能となる。
請求項2に記載した発明によれば、発光ダイオードの放熱性及び接点信頼性を向上できる。
請求項3に記載した発明によれば、発光ダイオードのベース部品への固定作業を容易にできると共に、発光ダイオードの脱落や当該固定装置との接点不良をより効果的に防止できる。
請求項4に記載した発明によれば、多数の発光ダイオードが各種の振動にさらされるような車両の灯火器等においても、発光ダイオードの固定及び交換作業工数を削減できると共に、発光ダイオードの脱落や接点不良を防止できる。
図1,2において、符号11,12は例えば銅板等の導電性材料からなるアノード側及びカソード側のリードフレーム(固定装置)を示し、これら各リードフレーム11,12を介してLED(Light Emitting Diode;発光ダイオード)30が樹脂等の絶縁性材料からなる不図示のベース部品に固定される。該ベース部品は例えば車両のテールランプ等の灯火器のハウジングであり、該ハウジング内にLED30が多数配列されることで所定の発光面積及び光量を確保している。
と共に、
13 フレーム本体(装置本体)
14a 切り出し片
16 弾性片
17 弾性係止片(係止片)
30 LED(発光ダイオード)
33,34 リード端子
38 ノッチ部
Claims (4)
- 板状のリード端子を有する発光ダイオードをベース部品に着脱可能に固定する固定装置において、装置本体に一体的に設けられる切り出し片を起立させ折り返すことでその先端が装置本体の表面に対向するように形成し、前記装置本体表面と切り出し片先端との間に差し込まれた前記リード端子を該装置本体と切り出し片の先端とで弾性的に挟持することを特徴とする発光ダイオードの固定装置。
- 前記装置本体に、これに前記リード端子を面接触させるべく該リード端子を付勢する弾性片を一体的に設けたことを特徴とする請求項1に記載の発光ダイオードの固定装置。
- 前記装置本体に、前記リード端子に設けられたノッチ部に係合する係止片を一体的に設けたことを特徴とする請求項1又は請求項2に記載の発光ダイオードの固定装置。
- 請求項1から請求項3の何れかに記載の固定装置を用いて発光ダイオードを固定することを特徴とする発光ダイオードの固定構造。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004156294A JP3851911B2 (ja) | 2004-05-26 | 2004-05-26 | 発光ダイオードの固定装置及び固定構造 |
PCT/JP2005/009059 WO2005117149A1 (ja) | 2004-05-26 | 2005-05-18 | 発光ダイオードの固定装置及び固定構造 |
EP05741530A EP1758179A1 (en) | 2004-05-26 | 2005-05-18 | Fixing device and fixing structure for light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004156294A JP3851911B2 (ja) | 2004-05-26 | 2004-05-26 | 発光ダイオードの固定装置及び固定構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005340454A JP2005340454A (ja) | 2005-12-08 |
JP3851911B2 true JP3851911B2 (ja) | 2006-11-29 |
Family
ID=35451167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004156294A Expired - Fee Related JP3851911B2 (ja) | 2004-05-26 | 2004-05-26 | 発光ダイオードの固定装置及び固定構造 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1758179A1 (ja) |
JP (1) | JP3851911B2 (ja) |
WO (1) | WO2005117149A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4582087B2 (ja) * | 2006-12-18 | 2010-11-17 | 市光工業株式会社 | 発光ダイオードの固定構造 |
US7952114B2 (en) | 2008-09-23 | 2011-05-31 | Tyco Electronics Corporation | LED interconnect assembly |
FR2936678B1 (fr) * | 2008-09-29 | 2010-11-05 | Cemm Thome | Lampe a diode electroluminescente |
JP5195678B2 (ja) * | 2009-07-29 | 2013-05-08 | 豊田合成株式会社 | 発光装置の搭載構造及び搭載方法 |
CN102052590A (zh) * | 2009-11-02 | 2011-05-11 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管灯具 |
JP5517239B2 (ja) * | 2009-11-10 | 2014-06-11 | 日本航空電子工業株式会社 | コネクタ |
KR101719693B1 (ko) * | 2010-05-11 | 2017-03-27 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 포함하는 표시 장치 |
CN103635743B (zh) * | 2011-06-17 | 2017-04-12 | 飞利浦照明控股有限公司 | 固定装置和组装结构 |
WO2013072812A1 (en) * | 2011-11-14 | 2013-05-23 | Koninklijke Philips Electronics N.V. | Led spring clamp & retainer |
CN103753446B (zh) * | 2013-12-27 | 2016-08-24 | 广东威创视讯科技股份有限公司 | Led灯夹具 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984874U (ja) * | 1982-11-30 | 1984-06-08 | クラリオン株式会社 | インジケ−タの取付装置 |
JPS62163977U (ja) * | 1986-04-09 | 1987-10-17 | ||
JPH0219184U (ja) * | 1988-07-22 | 1990-02-08 | ||
JPH0434751A (ja) * | 1990-05-31 | 1992-02-05 | Fujitsu Ltd | 磁気テープ装置 |
JP2928634B2 (ja) * | 1990-11-30 | 1999-08-03 | トキコーポレーション株式会社 | 帯状電線に対する導線露出穴加工具および加工方法 |
US5404282A (en) * | 1993-09-17 | 1995-04-04 | Hewlett-Packard Company | Multiple light emitting diode module |
US5519596A (en) * | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
JP3910319B2 (ja) * | 1999-09-13 | 2007-04-25 | 株式会社小糸製作所 | 自動車用灯具 |
WO2002089222A1 (fr) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses |
JP2003101072A (ja) * | 2001-09-26 | 2003-04-04 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
JP2003331635A (ja) * | 2002-05-08 | 2003-11-21 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
-
2004
- 2004-05-26 JP JP2004156294A patent/JP3851911B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-18 EP EP05741530A patent/EP1758179A1/en not_active Withdrawn
- 2005-05-18 WO PCT/JP2005/009059 patent/WO2005117149A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2005340454A (ja) | 2005-12-08 |
WO2005117149A1 (ja) | 2005-12-08 |
EP1758179A1 (en) | 2007-02-28 |
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