CN105161602B - 一种带加强筋的led线路板 - Google Patents
一种带加强筋的led线路板 Download PDFInfo
- Publication number
- CN105161602B CN105161602B CN201510627589.2A CN201510627589A CN105161602B CN 105161602 B CN105161602 B CN 105161602B CN 201510627589 A CN201510627589 A CN 201510627589A CN 105161602 B CN105161602 B CN 105161602B
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- Prior art keywords
- wire
- thermoelectric
- reinforcement
- circuit board
- led circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510627589.2A CN105161602B (zh) | 2015-09-25 | 2015-09-25 | 一种带加强筋的led线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510627589.2A CN105161602B (zh) | 2015-09-25 | 2015-09-25 | 一种带加强筋的led线路板 |
Publications (2)
Publication Number | Publication Date |
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CN105161602A CN105161602A (zh) | 2015-12-16 |
CN105161602B true CN105161602B (zh) | 2018-03-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510627589.2A Active CN105161602B (zh) | 2015-09-25 | 2015-09-25 | 一种带加强筋的led线路板 |
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CN (1) | CN105161602B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106972094A (zh) * | 2017-04-14 | 2017-07-21 | 欧文 | 一种一体式led带状光源支架及制备方法 |
CN108541198B (zh) * | 2018-06-25 | 2023-12-12 | 江苏卓宝智造科技有限公司 | 一种智能散热多层线路板 |
CN109599472A (zh) * | 2018-11-29 | 2019-04-09 | 江门市三兴照明科技有限公司 | 一种led芯片封装结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1529914A (zh) * | 2001-04-26 | 2004-09-15 | 森山产业株式会社 | 光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法 |
CN104930476A (zh) * | 2015-06-11 | 2015-09-23 | 吴少健 | 一种led灯五金支架 |
CN205050866U (zh) * | 2015-09-25 | 2016-02-24 | 吴少健 | 一种带加强筋的led线路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6132192B2 (ja) * | 2013-03-28 | 2017-05-24 | パナソニックIpマネジメント株式会社 | キャビネット |
-
2015
- 2015-09-25 CN CN201510627589.2A patent/CN105161602B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1529914A (zh) * | 2001-04-26 | 2004-09-15 | 森山产业株式会社 | 光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法 |
CN104930476A (zh) * | 2015-06-11 | 2015-09-23 | 吴少健 | 一种led灯五金支架 |
CN205050866U (zh) * | 2015-09-25 | 2016-02-24 | 吴少健 | 一种带加强筋的led线路板 |
Also Published As
Publication number | Publication date |
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CN105161602A (zh) | 2015-12-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161026 Address after: 311300, Zhejiang Province, Hangzhou City, Ling'an Qingshan Lake Street Chuen mouth village Applicant after: Linan New Sanlian Lighting Electric Co., Ltd. Address before: 528400 two dragon First Street, Cao Zhen, 5 ancient town, Guangdong, Zhongshan Applicant before: Wu Shaojian |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 311300 Quankou Village, Qingshan Lake Street, Linan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou New Triple Lighting Electrical Appliances Co., Ltd. Address before: 311300 Quankou Village, Qingshan Lake Street, Linan City, Hangzhou City, Zhejiang Province Patentee before: Linan New Sanlian Lighting Electric Co., Ltd. |