KR100537897B1 - 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 - Google Patents

광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 Download PDF

Info

Publication number
KR100537897B1
KR100537897B1 KR10-2003-7013880A KR20037013880A KR100537897B1 KR 100537897 B1 KR100537897 B1 KR 100537897B1 KR 20037013880 A KR20037013880 A KR 20037013880A KR 100537897 B1 KR100537897 B1 KR 100537897B1
Authority
KR
South Korea
Prior art keywords
light source
patterned conductor
pair
connection
led
Prior art date
Application number
KR10-2003-7013880A
Other languages
English (en)
Korean (ko)
Other versions
KR20030095400A (ko
Inventor
히데오 모리야마
무네히코 야나기타
Original Assignee
모리야마 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리야마 산교 가부시키가이샤 filed Critical 모리야마 산교 가부시키가이샤
Publication of KR20030095400A publication Critical patent/KR20030095400A/ko
Application granted granted Critical
Publication of KR100537897B1 publication Critical patent/KR100537897B1/ko

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR10-2003-7013880A 2001-04-26 2002-04-24 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 KR100537897B1 (ko)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2001129579 2001-04-26
JPJP-P-2001-00129579 2001-04-26
JP2001201418 2001-07-02
JP2001201436 2001-07-02
JPJP-P-2001-00201436 2001-07-02
JPJP-P-2001-00201418 2001-07-02
JPJP-P-2001-00289290 2001-09-21
JP2001289290 2001-09-21
JP2002001666 2002-01-08
JPJP-P-2002-00001666 2002-01-08
PCT/JP2002/004100 WO2002089222A1 (fr) 2001-04-26 2002-04-24 Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses

Publications (2)

Publication Number Publication Date
KR20030095400A KR20030095400A (ko) 2003-12-18
KR100537897B1 true KR100537897B1 (ko) 2005-12-20

Family

ID=27531879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7013880A KR100537897B1 (ko) 2001-04-26 2002-04-24 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법

Country Status (4)

Country Link
JP (1) JP3880522B2 (fr)
KR (1) KR100537897B1 (fr)
CN (1) CN1306621C (fr)
WO (1) WO2002089222A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101300907B1 (ko) * 2010-10-01 2013-08-27 소닉스자펜 주식회사 반사갓연결장치, 이를 포함하는 반사갓결합모듈 및 등기구
KR20160024492A (ko) * 2014-08-26 2016-03-07 한국단자공업 주식회사 엘이디 모듈, 엘이디 모듈 어셈블리

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300884A (ja) * 2003-10-30 2008-12-11 Furukawa Electric Co Ltd:The Ｌｅｄ並びにｌｅｄとフラットケーブルの接続構造及びｌｅｄ接続回路構造体
JP4507062B2 (ja) * 2003-11-20 2010-07-21 オムロン株式会社 面光源装置及び当該装置を用いた機器
JP3851911B2 (ja) * 2004-05-26 2006-11-29 株式会社アドバネクス 発光ダイオードの固定装置及び固定構造
JP4556166B2 (ja) * 2004-07-29 2010-10-06 ライツ・アドバンスト・テクノロジー株式会社 光源装置
JP4654639B2 (ja) * 2004-09-09 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP3802910B2 (ja) * 2004-09-13 2006-08-02 ローム株式会社 半導体発光装置
WO2006033297A1 (fr) * 2004-09-21 2006-03-30 Intellectual Property Bank Corp. Procede de fabrication d'une unite sur laquelle une del est montee, douille de del et substrat de circuit electronique pour montage de del
GB0421772D0 (en) * 2004-09-30 2004-11-03 Crescent Lighting Ltd Electrical circuit and connection method
JP4913459B2 (ja) * 2006-03-28 2012-04-11 電気化学工業株式会社 金属ベース回路基板およびその製法、ならびにｌｅｄモジュール
JP5239138B2 (ja) * 2005-08-31 2013-07-17 東芝ライテック株式会社 Ｌｅｄ点灯装置
WO2007122566A1 (fr) * 2006-04-25 2007-11-01 Koninklijke Philips Electronics N.V. Grille à réseau de diodes électroluminescentes et dispositif de fabrication de cette grille et composant de diode électroluminescente destiné à être utilisé dans celle-ci
US7918702B2 (en) * 2006-04-25 2011-04-05 Koninklijke Philips Electronics N.V. Large area LED array and method for its manufacture
US7988332B2 (en) * 2006-09-12 2011-08-02 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire
JP4840067B2 (ja) * 2006-10-11 2011-12-21 豊田合成株式会社 Ｌｅｄランプ装置
TW200824142A (en) * 2006-11-22 2008-06-01 Lighthouse Technology Co Ltd High power diode holder and thereof package is described
JP5297592B2 (ja) * 2007-02-15 2013-09-25 矢崎総業株式会社 Ｌｅｄ発光装置
WO2009038071A1 (fr) * 2007-09-21 2009-03-26 Showa Denko K.K. Dispositif d'affichage, raccord de source lumineuse, illuminateur et procédé de fabrication dudit raccord
US20100254119A1 (en) * 2007-11-20 2010-10-07 Showa Denko K.K. Light source connection member, light emitting device and display device
JP2010034369A (ja) * 2008-07-30 2010-02-12 Kyocera Corp 太陽電池ユニットおよび太陽電池ユニット用パッケージ
DE102008038778A1 (de) 2008-08-12 2010-02-25 Bega Gantenbrink-Leuchten Kg Farb-LED-Strahler
CN101806439B (zh) * 2009-02-18 2013-04-17 黄嘉宾 一种led的散热结构
KR101020992B1 (ko) * 2009-03-02 2011-03-09 엘지이노텍 주식회사 발광 모듈 및 이를 구비한 라이트 유닛
JP5323668B2 (ja) 2009-12-24 2013-10-23 日本メクトロン株式会社 照明装置及びその製造方法
JP2011253967A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
TW201235609A (en) * 2010-07-13 2012-09-01 Koninkl Philips Electronics Nv Low cost mounting of LEDs in TL-retrofit tubes
JP2012028412A (ja) * 2010-07-20 2012-02-09 Furukawa Electric Co Ltd:The ２次元面発光レーザアレイ素子、面発光レーザ装置および光源
JP2012049367A (ja) * 2010-08-27 2012-03-08 Kyocera Elco Corp 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法
JP5303579B2 (ja) * 2011-01-11 2013-10-02 京セラコネクタプロダクツ株式会社 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール
JP5750297B2 (ja) 2011-04-19 2015-07-15 日本メクトロン株式会社 基板組立体および照明装置
CN102200230A (zh) * 2011-05-18 2011-09-28 陈建伟 Led灯泡
CN102974907A (zh) * 2011-09-06 2013-03-20 苏州世鼎电子有限公司 Led组件的焊接工艺方法
CN103017108B (zh) * 2011-09-27 2017-04-19 欧司朗股份有限公司 基座、圆管形壳体以及包括基座和圆管形壳体的灯
CN102509760B (zh) * 2011-11-21 2014-04-02 上海大溥实业有限公司 一种线条型led及其生产方法和应用
WO2013144858A1 (fr) 2012-03-30 2013-10-03 Koninklijke Philips N.V. Lentille d'étalement bidirectionnelle surmoulée prétournée destinée à une architecture de grille de connexion étirée
US10680383B2 (en) 2013-03-14 2020-06-09 Apex Technologies, Inc. Linear electrode systems for module attachment with non-uniform axial spacing
CN105276534A (zh) * 2015-09-25 2016-01-27 吴少健 一种led线路板
CN105161602B (zh) * 2015-09-25 2018-03-16 临安市新三联照明电器有限公司 一种带加强筋的led线路板
CN106382609B (zh) * 2016-10-18 2023-05-30 南昌大学 一种led灯丝条
JP6934180B2 (ja) * 2017-05-17 2021-09-15 アイリスオーヤマ株式会社 Ｌｅｄランプ
DE102017131063A1 (de) * 2017-12-22 2019-06-27 Ledvance Gmbh LED-Modul mit einem stabilisierten Leadframe
CN110808242B (zh) * 2019-11-20 2020-12-08 博兴战新产业发展有限公司 一种led灯串及其制造方法
TWI772098B (zh) * 2021-07-09 2022-07-21 聯嘉光電股份有限公司 長條狀發光二極體及其應用裝置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582080A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ
JPH0642564B2 (ja) * 1983-02-15 1994-06-01 日本デンヨ−株式会社 Ｌｅｄランプ
JPS6132483A (ja) * 1984-07-24 1986-02-15 Kimura Denki Kk Ｌｅｄを用いた球状発光体
JPH0220728Y2 (fr) * 1984-10-16 1990-06-06
JPH0414945Y2 (fr) * 1985-07-29 1992-04-03
JPH0445257Y2 (fr) * 1986-05-15 1992-10-23
JPH0226272U (fr) * 1988-08-08 1990-02-21
JPH0235187U (fr) * 1988-08-31 1990-03-07
JPH0399450U (fr) * 1990-01-31 1991-10-17
JPH05235413A (ja) * 1992-02-21 1993-09-10 Tokai Tsushin Kogyo Kk 発光体
JPH0715045A (ja) * 1992-05-11 1995-01-17 Susumu Kurokawa 面発光照明装置
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
US5519596A (en) * 1995-05-16 1996-05-21 Hewlett-Packard Company Moldable nesting frame for light emitting diode array
JP3260593B2 (ja) * 1995-06-09 2002-02-25 株式会社小糸製作所 自動車用信号灯
JP3618534B2 (ja) * 1997-11-28 2005-02-09 同和鉱業株式会社 光通信用ランプ装置とその製造方法
JP4510947B2 (ja) * 1999-03-09 2010-07-28 スタンレー電気株式会社 発光素子モジュールの製造方法
JP3910319B2 (ja) * 1999-09-13 2007-04-25 株式会社小糸製作所 自動車用灯具
JP2002057371A (ja) * 2000-08-15 2002-02-22 Hukuyo Denkyu Kk 連鎖ｌｅｄ光源構造
JP3075996U (ja) * 2000-08-30 2001-03-16 舶用電球株式会社 チューブ型ｌｅｄランプ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101300907B1 (ko) * 2010-10-01 2013-08-27 소닉스자펜 주식회사 반사갓연결장치, 이를 포함하는 반사갓결합모듈 및 등기구
KR20160024492A (ko) * 2014-08-26 2016-03-07 한국단자공업 주식회사 엘이디 모듈, 엘이디 모듈 어셈블리
KR101647953B1 (ko) 2014-08-26 2016-08-12 한국단자공업 주식회사 엘이디 모듈, 엘이디 모듈 어셈블리

Also Published As

Publication number Publication date
WO2002089222A1 (fr) 2002-11-07
CN1306621C (zh) 2007-03-21
JP3880522B2 (ja) 2007-02-14
CN1529914A (zh) 2004-09-15
JPWO2002089222A1 (ja) 2004-08-19
KR20030095400A (ko) 2003-12-18

Similar Documents

Publication Publication Date Title
KR100537897B1 (ko) 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법
US7380961B2 (en) Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
KR100674786B1 (ko) 발광 모듈
US7290911B2 (en) Vehicular lamp
CN102121599B (zh) 发光二极管照明组件
KR101131070B1 (ko) 발광 장치의 두께를 감소시키는데 기여하고 고범용성을 갖는 배선판
EP3669118B1 (fr) Support pour éléments lumineux et dispositif d'éclairage
KR20100047339A (ko) Ｌｅｄ 하우징
EP3014657B1 (fr) Puces de leds liés à des bandes de grille de connexion
CN109973837B (zh) 具有稳定的引线框架的led模块
WO2013124601A1 (fr) Lampes électriques et procédés de fabrication de dispositifs électriques
US11248758B2 (en) Surface light source LED device
US11009224B2 (en) Lighting device
WO2011071515A1 (fr) Ensemble douille de diode électroluminescente
CN204922861U (zh) 照明用光源以及照明装置
EP2978031A1 (fr) Dispositif électroluminescent monté en surface
EP1482241B1 (fr) Appareil d'éclairage pour véhicules et procédé de montage
US11274819B2 (en) Support for light-emitting elements and lighting device
JP2003167540A (ja) 発光体装置、光源連結体及び光源連結体の製造方法
KR101278835B1 (ko) 엘이디용 회로기판원판, 회로기판, 엘이디유닛, 조명기구 및 제조방법
CN113167463A (zh) 电路基板及车辆用灯具
CN210950836U (zh) 一种舞台灯用的模块化光源
KR101937196B1 (ko) 엘이디 전구용 엘이디 모듈, 엘이디 모듈 어레이 및 그 제조방법
CN215956714U (zh) 电路板及电子面板
JPH10208515A (ja) 車輌用灯具

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121206

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20131205

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee