KR100510762B1 - 웨이퍼 건조기 - Google Patents

웨이퍼 건조기 Download PDF

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Publication number
KR100510762B1
KR100510762B1 KR10-2001-0004970A KR20010004970A KR100510762B1 KR 100510762 B1 KR100510762 B1 KR 100510762B1 KR 20010004970 A KR20010004970 A KR 20010004970A KR 100510762 B1 KR100510762 B1 KR 100510762B1
Authority
KR
South Korea
Prior art keywords
wafer
pure water
zone
chamber
vapor
Prior art date
Application number
KR10-2001-0004970A
Other languages
English (en)
Korean (ko)
Other versions
KR20020064479A (ko
Inventor
김대희
김경진
김덕호
안종팔
Original Assignee
에이펫(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이펫(주) filed Critical 에이펫(주)
Priority to KR10-2001-0004970A priority Critical patent/KR100510762B1/ko
Priority to JP2001046815A priority patent/JP2002231687A/ja
Publication of KR20020064479A publication Critical patent/KR20020064479A/ko
Application granted granted Critical
Publication of KR100510762B1 publication Critical patent/KR100510762B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR10-2001-0004970A 2001-02-01 2001-02-01 웨이퍼 건조기 KR100510762B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR10-2001-0004970A KR100510762B1 (ko) 2001-02-01 2001-02-01 웨이퍼 건조기
JP2001046815A JP2002231687A (ja) 2001-02-01 2001-02-22 ウェーハ乾燥機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0004970A KR100510762B1 (ko) 2001-02-01 2001-02-01 웨이퍼 건조기

Publications (2)

Publication Number Publication Date
KR20020064479A KR20020064479A (ko) 2002-08-09
KR100510762B1 true KR100510762B1 (ko) 2005-08-30

Family

ID=19705239

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0004970A KR100510762B1 (ko) 2001-02-01 2001-02-01 웨이퍼 건조기

Country Status (2)

Country Link
JP (1) JP2002231687A (ja)
KR (1) KR100510762B1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486258B1 (ko) * 2002-09-06 2005-05-03 삼성전자주식회사 증기 건조 방식의 반도체 웨이퍼 건조 장치
JP2006080420A (ja) * 2004-09-13 2006-03-23 Ses Co Ltd 基板処理法及び基板処理装置
KR20200053096A (ko) * 2018-11-08 2020-05-18 삼성전자주식회사 반도체 칩의 세정 방법 및 이를 수행하기 위한 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102118A (ja) * 1991-10-07 1993-04-23 Mitsubishi Electric Corp 半導体ウエハの水洗方法および水洗槽
JPH07130699A (ja) * 1993-10-29 1995-05-19 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
JPH1022256A (ja) * 1996-07-05 1998-01-23 Tokyo Electron Ltd 洗浄・乾燥処理装置及び洗浄・乾燥処理方法
KR19990007018A (ko) * 1997-06-17 1999-01-25 히가시 테쯔로우 세정 건조처리 방법 및 그 장치
KR19990023477A (ko) * 1997-08-08 1999-03-25 가네꼬 히사시 웨이퍼 세정 및 건조 방법
US5934299A (en) * 1997-09-29 1999-08-10 Siemens Aktiengesellschaft Apparatus and method for improved washing and drying of semiconductor wafers
JP2000232088A (ja) * 1999-02-12 2000-08-22 Sony Corp 半導体ウェハの洗浄乾燥方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736399B2 (ja) * 1991-12-12 1995-04-19 孝夫 中澤 半導体ウエハ用洗浄リンス槽
JP3333830B2 (ja) * 1995-07-27 2002-10-15 株式会社タクマ 基板のリンス及び乾燥の方法及び装置
JP3979691B2 (ja) * 1997-01-10 2007-09-19 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP3892102B2 (ja) * 1997-04-14 2007-03-14 大日本スクリーン製造株式会社 基板処理方法及び同装置
JP3336223B2 (ja) * 1997-04-15 2002-10-21 東京エレクトロン株式会社 洗浄システム及び洗浄方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102118A (ja) * 1991-10-07 1993-04-23 Mitsubishi Electric Corp 半導体ウエハの水洗方法および水洗槽
JPH07130699A (ja) * 1993-10-29 1995-05-19 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
JPH1022256A (ja) * 1996-07-05 1998-01-23 Tokyo Electron Ltd 洗浄・乾燥処理装置及び洗浄・乾燥処理方法
KR19990007018A (ko) * 1997-06-17 1999-01-25 히가시 테쯔로우 세정 건조처리 방법 및 그 장치
KR19990023477A (ko) * 1997-08-08 1999-03-25 가네꼬 히사시 웨이퍼 세정 및 건조 방법
US5934299A (en) * 1997-09-29 1999-08-10 Siemens Aktiengesellschaft Apparatus and method for improved washing and drying of semiconductor wafers
JP2000232088A (ja) * 1999-02-12 2000-08-22 Sony Corp 半導体ウェハの洗浄乾燥方法

Also Published As

Publication number Publication date
JP2002231687A (ja) 2002-08-16
KR20020064479A (ko) 2002-08-09

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