KR100438876B1 - 칩모듈 - Google Patents

칩모듈 Download PDF

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Publication number
KR100438876B1
KR100438876B1 KR10-1998-0702027A KR19980702027A KR100438876B1 KR 100438876 B1 KR100438876 B1 KR 100438876B1 KR 19980702027 A KR19980702027 A KR 19980702027A KR 100438876 B1 KR100438876 B1 KR 100438876B1
Authority
KR
South Korea
Prior art keywords
chip
carrier tape
chip module
module
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-1998-0702027A
Other languages
English (en)
Korean (ko)
Other versions
KR19990063588A (ko
Inventor
데틀레프 호우데아우
요제프 키르쉬바우어
한스-게오르크 멘쉬
페터 스탐프카
한스-힌네르크 슈테칸
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7773352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100438876(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Publication of KR19990063588A publication Critical patent/KR19990063588A/ko
Application granted granted Critical
Publication of KR100438876B1 publication Critical patent/KR100438876B1/ko
Assigned to 인피니언 테크놀로지스 아게 reassignment 인피니언 테크놀로지스 아게 권리의 전부이전등록 Assignors: 지멘스 악티엔게젤샤프트
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
KR10-1998-0702027A 1995-09-27 1996-09-12 칩모듈 Expired - Lifetime KR100438876B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19535989A DE19535989C3 (de) 1995-09-27 1995-09-27 Chipmodul
DE19535989.5 1995-09-27

Publications (2)

Publication Number Publication Date
KR19990063588A KR19990063588A (ko) 1999-07-26
KR100438876B1 true KR100438876B1 (ko) 2004-07-16

Family

ID=7773352

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0702027A Expired - Lifetime KR100438876B1 (ko) 1995-09-27 1996-09-12 칩모듈

Country Status (11)

Country Link
EP (1) EP0852774B1 (enExample)
JP (1) JP3199747B2 (enExample)
KR (1) KR100438876B1 (enExample)
CN (1) CN1153174C (enExample)
AT (1) ATE176537T1 (enExample)
DE (2) DE19535989C3 (enExample)
ES (1) ES2128872T3 (enExample)
IN (1) IN188648B (enExample)
RU (1) RU2145732C1 (enExample)
UA (1) UA44809C2 (enExample)
WO (1) WO1997012341A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19602436B4 (de) * 1996-01-24 2006-09-14 Infineon Technologies Ag Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens
DE19731737A1 (de) * 1997-07-23 1998-09-17 Siemens Ag Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper
RU2242798C2 (ru) * 2001-07-03 2004-12-20 Блинов Геннадий Андреевич Идентификационное устройство
DE102005032489B3 (de) * 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
DE102006060411B3 (de) 2006-12-20 2008-07-10 Infineon Technologies Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE102007048237A1 (de) * 2007-10-08 2009-04-09 Giesecke & Devrient Gmbh Chipmodul für Chipkarte
DE102013106181A1 (de) * 2013-06-13 2014-12-18 Bundesdruckerei Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
CN112216622B (zh) * 2019-07-10 2022-09-30 广东精毅科技股份有限公司 一种用冷胶粘贴芯片的装置及其工作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
SU1251138A1 (ru) * 1984-12-27 1986-08-15 Рижское Ордена Ленина Производственное Объединение "Вэф" Им.В.И.Ленина Идентификационна карта
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2617668B1 (fr) * 1987-07-03 1995-07-07 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
FR2626846B1 (fr) * 1988-02-04 1990-06-15 Saint Gobain Vitrage Dispositif de manutention d'articles en feuilles
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
DE4232625A1 (de) * 1992-09-29 1994-03-31 Siemens Ag Verfahren zur Montage von integrierten Halbleiterschaltkreisen
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
DE4325712C2 (de) * 1993-07-30 1996-03-21 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul

Also Published As

Publication number Publication date
CN1198229A (zh) 1998-11-04
JPH10512380A (ja) 1998-11-24
DE59601281D1 (de) 1999-03-18
RU2145732C1 (ru) 2000-02-20
ATE176537T1 (de) 1999-02-15
ES2128872T3 (es) 1999-05-16
DE19535989C2 (de) 1997-07-17
CN1153174C (zh) 2004-06-09
KR19990063588A (ko) 1999-07-26
DE19535989A1 (de) 1997-04-03
EP0852774B1 (de) 1999-02-03
IN188648B (enExample) 2002-10-26
EP0852774A1 (de) 1998-07-15
WO1997012341A1 (de) 1997-04-03
DE19535989C3 (de) 2003-03-27
JP3199747B2 (ja) 2001-08-20
UA44809C2 (uk) 2002-03-15

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