DE19535989C3 - Chipmodul - Google Patents

Chipmodul

Info

Publication number
DE19535989C3
DE19535989C3 DE19535989A DE19535989A DE19535989C3 DE 19535989 C3 DE19535989 C3 DE 19535989C3 DE 19535989 A DE19535989 A DE 19535989A DE 19535989 A DE19535989 A DE 19535989A DE 19535989 C3 DE19535989 C3 DE 19535989C3
Authority
DE
Germany
Prior art keywords
chip
chip module
carrier tape
contacts
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19535989A
Other languages
German (de)
English (en)
Other versions
DE19535989C2 (de
DE19535989A1 (de
Inventor
Detlef Houdeau
Josef Kirschbauer
Hans Mensch
Hans Steckhan
Peter Stampka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7773352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE19535989(C3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19535989A priority Critical patent/DE19535989C3/de
Priority to IN1524CA1996 priority patent/IN188648B/en
Priority to JP51305497A priority patent/JP3199747B2/ja
Priority to ES96929186T priority patent/ES2128872T3/es
Priority to EP96929186A priority patent/EP0852774B1/de
Priority to CNB961972394A priority patent/CN1153174C/zh
Priority to AT96929186T priority patent/ATE176537T1/de
Priority to DE59601281T priority patent/DE59601281D1/de
Priority to RU98107842A priority patent/RU2145732C1/ru
Priority to UA98031575A priority patent/UA44809C2/uk
Priority to KR10-1998-0702027A priority patent/KR100438876B1/ko
Priority to PCT/DE1996/001725 priority patent/WO1997012341A1/de
Publication of DE19535989A1 publication Critical patent/DE19535989A1/de
Publication of DE19535989C2 publication Critical patent/DE19535989C2/de
Priority to US09/049,559 priority patent/US6072698A/en
Publication of DE19535989C3 publication Critical patent/DE19535989C3/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE19535989A 1995-09-27 1995-09-27 Chipmodul Expired - Fee Related DE19535989C3 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
DE19535989A DE19535989C3 (de) 1995-09-27 1995-09-27 Chipmodul
IN1524CA1996 IN188648B (enExample) 1995-09-27 1996-08-27
RU98107842A RU2145732C1 (ru) 1995-09-27 1996-09-12 Модуль интегральной схемы
PCT/DE1996/001725 WO1997012341A1 (de) 1995-09-27 1996-09-12 Chipmodul
EP96929186A EP0852774B1 (de) 1995-09-27 1996-09-12 Chipmodul
CNB961972394A CN1153174C (zh) 1995-09-27 1996-09-12 芯片模块
AT96929186T ATE176537T1 (de) 1995-09-27 1996-09-12 Chipmodul
DE59601281T DE59601281D1 (de) 1995-09-27 1996-09-12 Chipmodul
JP51305497A JP3199747B2 (ja) 1995-09-27 1996-09-12 チップモジュール
UA98031575A UA44809C2 (uk) 1995-09-27 1996-09-12 Модуль з чіпом
KR10-1998-0702027A KR100438876B1 (ko) 1995-09-27 1996-09-12 칩모듈
ES96929186T ES2128872T3 (es) 1995-09-27 1996-09-12 Modulo de chip.
US09/049,559 US6072698A (en) 1995-09-27 1998-03-27 Chip module with heat insulation for incorporation into a chip card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19535989A DE19535989C3 (de) 1995-09-27 1995-09-27 Chipmodul

Publications (3)

Publication Number Publication Date
DE19535989A1 DE19535989A1 (de) 1997-04-03
DE19535989C2 DE19535989C2 (de) 1997-07-17
DE19535989C3 true DE19535989C3 (de) 2003-03-27

Family

ID=7773352

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19535989A Expired - Fee Related DE19535989C3 (de) 1995-09-27 1995-09-27 Chipmodul
DE59601281T Expired - Lifetime DE59601281D1 (de) 1995-09-27 1996-09-12 Chipmodul

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59601281T Expired - Lifetime DE59601281D1 (de) 1995-09-27 1996-09-12 Chipmodul

Country Status (11)

Country Link
EP (1) EP0852774B1 (enExample)
JP (1) JP3199747B2 (enExample)
KR (1) KR100438876B1 (enExample)
CN (1) CN1153174C (enExample)
AT (1) ATE176537T1 (enExample)
DE (2) DE19535989C3 (enExample)
ES (1) ES2128872T3 (enExample)
IN (1) IN188648B (enExample)
RU (1) RU2145732C1 (enExample)
UA (1) UA44809C2 (enExample)
WO (1) WO1997012341A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19602436B4 (de) * 1996-01-24 2006-09-14 Infineon Technologies Ag Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens
DE102006060411B3 (de) * 2006-12-20 2008-07-10 Infineon Technologies Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19731737A1 (de) * 1997-07-23 1998-09-17 Siemens Ag Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper
RU2242798C2 (ru) * 2001-07-03 2004-12-20 Блинов Геннадий Андреевич Идентификационное устройство
DE102005032489B3 (de) * 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
DE102007048237A1 (de) * 2007-10-08 2009-04-09 Giesecke & Devrient Gmbh Chipmodul für Chipkarte
DE102013106181A1 (de) * 2013-06-13 2014-12-18 Bundesdruckerei Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
CN112216622B (zh) * 2019-07-10 2022-09-30 广东精毅科技股份有限公司 一种用冷胶粘贴芯片的装置及其工作方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625102A (en) * 1983-06-09 1986-11-25 Flonic Memory card manufacturing method and cards thus obtained
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0327438A1 (fr) * 1988-02-04 1989-08-09 Saint-Gobain Vitrage International Dispositif de manutention d'articles en feuilles
FR2639763A1 (fr) * 1988-11-29 1990-06-01 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
DE4232625A1 (de) * 1992-09-29 1994-03-31 Siemens Ag Verfahren zur Montage von integrierten Halbleiterschaltkreisen
DE4325712A1 (de) * 1993-07-30 1995-02-02 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1251138A1 (ru) * 1984-12-27 1986-08-15 Рижское Ордена Ленина Производственное Объединение "Вэф" Им.В.И.Ленина Идентификационна карта
FR2617668B1 (fr) * 1987-07-03 1995-07-07 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625102A (en) * 1983-06-09 1986-11-25 Flonic Memory card manufacturing method and cards thus obtained
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0327438A1 (fr) * 1988-02-04 1989-08-09 Saint-Gobain Vitrage International Dispositif de manutention d'articles en feuilles
FR2639763A1 (fr) * 1988-11-29 1990-06-01 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
US5057460A (en) * 1988-11-29 1991-10-15 Schlumberger Industries Method of making an electronic module, for insertion into an electronic memory-card body
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
DE4232625A1 (de) * 1992-09-29 1994-03-31 Siemens Ag Verfahren zur Montage von integrierten Halbleiterschaltkreisen
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
DE4325712A1 (de) * 1993-07-30 1995-02-02 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19602436B4 (de) * 1996-01-24 2006-09-14 Infineon Technologies Ag Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens
DE102006060411B3 (de) * 2006-12-20 2008-07-10 Infineon Technologies Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls

Also Published As

Publication number Publication date
CN1198229A (zh) 1998-11-04
JPH10512380A (ja) 1998-11-24
DE59601281D1 (de) 1999-03-18
RU2145732C1 (ru) 2000-02-20
ATE176537T1 (de) 1999-02-15
ES2128872T3 (es) 1999-05-16
KR100438876B1 (ko) 2004-07-16
DE19535989C2 (de) 1997-07-17
CN1153174C (zh) 2004-06-09
KR19990063588A (ko) 1999-07-26
DE19535989A1 (de) 1997-04-03
EP0852774B1 (de) 1999-02-03
IN188648B (enExample) 2002-10-26
EP0852774A1 (de) 1998-07-15
WO1997012341A1 (de) 1997-04-03
JP3199747B2 (ja) 2001-08-20
UA44809C2 (uk) 2002-03-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
8327 Change in the person/name/address of the patent owner

Owner name: INFINEON TECHNOLOGIES AG, 81669 MUENCHEN, DE

8339 Ceased/non-payment of the annual fee