KR100413646B1 - 온도검출소자 - Google Patents
온도검출소자 Download PDFInfo
- Publication number
- KR100413646B1 KR100413646B1 KR10-2001-0003707A KR20010003707A KR100413646B1 KR 100413646 B1 KR100413646 B1 KR 100413646B1 KR 20010003707 A KR20010003707 A KR 20010003707A KR 100413646 B1 KR100413646 B1 KR 100413646B1
- Authority
- KR
- South Korea
- Prior art keywords
- temperature
- workpiece
- silicon wafer
- wafer
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000010453 quartz Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 239000012634 fragment Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 210000005239 tubule Anatomy 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 235000002597 Solanum melongena Nutrition 0.000 claims 1
- 244000061458 Solanum melongena Species 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 58
- 238000010438 heat treatment Methods 0.000 description 12
- 238000001514 detection method Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013095 identification testing Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20977 | 2000-01-28 | ||
| JP2000020977A JP2001208616A (ja) | 2000-01-28 | 2000-01-28 | 温度検出素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010078070A KR20010078070A (ko) | 2001-08-20 |
| KR100413646B1 true KR100413646B1 (ko) | 2003-12-31 |
Family
ID=18547446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0003707A Expired - Lifetime KR100413646B1 (ko) | 2000-01-28 | 2001-01-26 | 온도검출소자 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20010022803A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2001208616A (cg-RX-API-DMAC7.html) |
| KR (1) | KR100413646B1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW486564B (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030231698A1 (en) * | 2002-03-29 | 2003-12-18 | Takatomo Yamaguchi | Apparatus and method for fabricating a semiconductor device and a heat treatment apparatus |
| JP2014211922A (ja) * | 2011-08-29 | 2014-11-13 | 三洋電機株式会社 | 光ピックアップ装置および温度検出装置 |
| JP5451793B2 (ja) * | 2012-02-10 | 2014-03-26 | 東京エレクトロン株式会社 | 温度センサ及び熱処理装置 |
| JP5644007B2 (ja) | 2012-02-10 | 2014-12-24 | 東京エレクトロン株式会社 | 温度センサ及び熱処理装置 |
| CN104568196B (zh) * | 2015-01-04 | 2019-06-11 | 安徽蓝德仪表有限公司 | 一种铂铑热电偶 |
| DE102018102600A1 (de) * | 2018-02-06 | 2019-08-08 | Tdk Electronics Ag | Temperatursensor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2605297B2 (ja) * | 1987-09-04 | 1997-04-30 | 株式会社村田製作所 | 白金温度センサおよびその製造方法 |
| JPH0563054A (ja) * | 1991-08-29 | 1993-03-12 | Nippon Steel Corp | ウエハ温度測定方法及び装置 |
| JPH07273057A (ja) * | 1994-03-30 | 1995-10-20 | Kokusai Electric Co Ltd | 半導体製造装置 |
| JPH08285699A (ja) * | 1995-04-14 | 1996-11-01 | Matsushita Electric Ind Co Ltd | 加熱容器内温度センサ |
-
2000
- 2000-01-28 JP JP2000020977A patent/JP2001208616A/ja active Pending
-
2001
- 2001-01-19 TW TW090101301A patent/TW486564B/zh not_active IP Right Cessation
- 2001-01-25 US US09/769,919 patent/US20010022803A1/en not_active Abandoned
- 2001-01-26 KR KR10-2001-0003707A patent/KR100413646B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW486564B (en) | 2002-05-11 |
| JP2001208616A (ja) | 2001-08-03 |
| US20010022803A1 (en) | 2001-09-20 |
| KR20010078070A (ko) | 2001-08-20 |
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| JPWO2020120510A5 (cg-RX-API-DMAC7.html) | ||
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| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20010126 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20010305 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20010126 Comment text: Patent Application |
|
| PG1501 | Laying open of application | ||
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Comment text: Notification of reason for refusal Patent event date: 20030530 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20031029 |
|
| GRNT | Written decision to grant | ||
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