KR100367112B1 - 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 - Google Patents

프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 Download PDF

Info

Publication number
KR100367112B1
KR100367112B1 KR10-2000-7007395A KR20007007395A KR100367112B1 KR 100367112 B1 KR100367112 B1 KR 100367112B1 KR 20007007395 A KR20007007395 A KR 20007007395A KR 100367112 B1 KR100367112 B1 KR 100367112B1
Authority
KR
South Korea
Prior art keywords
probing
composition
feature
lead
probing feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-7007395A
Other languages
English (en)
Korean (ko)
Other versions
KR20010033836A (ko
Inventor
쉘멜리사케이
요시모토리차드에스
Original Assignee
인텔 코오퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010033836A publication Critical patent/KR20010033836A/ko
Application granted granted Critical
Publication of KR100367112B1 publication Critical patent/KR100367112B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
KR10-2000-7007395A 1998-01-02 1998-12-21 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 Expired - Fee Related KR100367112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/002,479 1998-01-02
US09/002,479 US6121058A (en) 1998-01-02 1998-01-02 Method for removing accumulated solder from probe card probing features

Publications (2)

Publication Number Publication Date
KR20010033836A KR20010033836A (ko) 2001-04-25
KR100367112B1 true KR100367112B1 (ko) 2003-01-09

Family

ID=21700971

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7007395A Expired - Fee Related KR100367112B1 (ko) 1998-01-02 1998-12-21 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법

Country Status (5)

Country Link
US (1) US6121058A (https=)
JP (1) JP2002501177A (https=)
KR (1) KR100367112B1 (https=)
AU (1) AU2092099A (https=)
WO (1) WO1999035505A2 (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747247C5 (de) * 1997-10-25 2004-10-07 Man B & W Diesel A/S Dieselmotor
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
US20040020514A1 (en) * 2002-07-18 2004-02-05 Orsillo James E. Probe device cleaner and method
US6778280B2 (en) * 2001-07-06 2004-08-17 Zygo Corporation Interferometry system and method employing an angular difference in propagation between orthogonally polarized input beam components
EP2290071B1 (en) 2004-05-28 2014-12-31 Asuragen, Inc. Methods and compositions involving microRNA
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US20060065290A1 (en) * 2004-09-28 2006-03-30 Jerry Broz Working surface cleaning system and method
DE102004047730B4 (de) * 2004-09-30 2017-06-22 Advanced Micro Devices, Inc. Ein Verfahren zum Dünnen von Halbleitersubstraten zur Herstellung von dünnen Halbleiterplättchen
CA2857881A1 (en) 2004-11-12 2006-12-28 Asuragen, Inc. Methods and compositions involving mirna and mirna inhibitor molecules
US7362116B1 (en) 2005-11-09 2008-04-22 Electroglas, Inc. Method for probing impact sensitive and thin layered substrate
WO2008036765A2 (en) 2006-09-19 2008-03-27 Asuragen, Inc. Micrornas differentially expressed in pancreatic diseases and uses thereof
JP2010510964A (ja) 2006-09-19 2010-04-08 アシュラジェン インコーポレイテッド 治療的介入の標的としての、miR−15、miR−26、miR−31、miR−145、miR−147、miR−188、miR−215、miR−216、miR−331、mmu−miR−292−3pによって調節される遺伝子および経路
KR101368139B1 (ko) * 2007-07-16 2014-03-12 어드밴티스트 아메리카, 인크. 마이크로 전기 기계 시스템을 수리하기 위한 장치 및 방법
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
US8258111B2 (en) 2008-05-08 2012-09-04 The Johns Hopkins University Compositions and methods related to miRNA modulation of neovascularization or angiogenesis
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
ES2631458T3 (es) 2010-03-04 2017-08-31 Interna Technologies B.V. Molécula de ARNmi definida por su fuente y sus usos terapéuticos en el cáncer asociado a la EMT
NZ704322A (en) 2010-07-06 2016-07-29 Interna Technologies Bv Mirna and its diagnostic and therapeutic uses in diseases or conditions associated with melanoma, or in diseases or conditions associated with activated braf pathway
EP2772550B1 (en) 2010-11-17 2017-03-29 Interpace Diagnostics, LLC Mirnas as biomarkers for distinguishing benign from malignant thyroid neoplasms
EP2474617A1 (en) 2011-01-11 2012-07-11 InteRNA Technologies BV Mir for treating neo-angiogenesis
EP2681566A2 (en) 2011-02-28 2014-01-08 University of Iowa Research Foundation Anti-müllerian hormone changes in pregnancy and prediction ofadverse pregnancy outcomes and gender
WO2013040251A2 (en) 2011-09-13 2013-03-21 Asurgen, Inc. Methods and compositions involving mir-135b for distinguishing pancreatic cancer from benign pancreatic disease
WO2013063519A1 (en) 2011-10-26 2013-05-02 Asuragen, Inc. Methods and compositions involving mirna expression levels for distinguishing pancreatic cysts
WO2013063544A1 (en) 2011-10-27 2013-05-02 Asuragen, Inc. Mirnas as diagnostic biomarkers to distinguish benign from malignant thyroid tumors
US20150008950A1 (en) 2011-12-31 2015-01-08 Roy E. Swart Manufacturing advanced test probes
WO2013101238A1 (en) 2011-12-31 2013-07-04 Intel Corporation Test probes
EP2870263A1 (en) 2012-07-03 2015-05-13 InteRNA Technologies B.V. Diagnostic portfolio and its uses
WO2014055117A1 (en) 2012-10-04 2014-04-10 Asuragen, Inc. Diagnostic mirnas for differential diagnosis of incidental pancreatic cystic lesions
EP2971149B1 (en) 2013-03-15 2018-05-09 Baylor Research Institute Ulcerative colitis (uc)-associated colorectal neoplasia markers
EP2971132B1 (en) 2013-03-15 2020-05-06 Baylor Research Institute Tissue and blood-based mirna biomarkers for the diagnosis, prognosis and metastasis-predictive potential in colorectal cancer
WO2014144666A2 (en) 2013-03-15 2014-09-18 The University Of Chicago Methods and compositions related to t-cell activity
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US11497762B2 (en) 2017-11-03 2022-11-15 Interna Technologies B.V. MiRNA molecule, equivalent, antagomir, or source thereof for treating and/or diagnosing a condition and/or a disease associated with neuronal deficiency or for neuronal (re)generation
EP3714053B1 (en) 2017-11-22 2025-12-31 The University of Chicago CHEMICALLY DEPENDENT PROBE EVALUATION OF PROTEIN ACTIVITY AND ITS USES
JP2021514827A (ja) 2018-02-23 2021-06-17 インターナショナル テスト ソリューションズ, インコーポレイテッド フレキシブル電子回路ウェブロールを自動的に清浄化するための新規材料及びハードウエア
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード
CN114174532A (zh) 2019-04-05 2022-03-11 德克萨斯大学系统董事会 细胞条形码编码的方法和应用
WO2020210521A2 (en) 2019-04-12 2020-10-15 The Regents Of The University Of California Compositions and methods for increasing muscle mass and oxidative metabolism
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
WO2024028794A1 (en) 2022-08-02 2024-02-08 Temple Therapeutics BV Methods for treating endometrial and ovarian hyperproliferative disorders
WO2025248505A1 (en) 2024-05-31 2025-12-04 Wayne State University Methods for treating endometrial and ovarian hyperproliferative disorders

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (https=) * 1968-04-19 1969-12-12
US4314855A (en) * 1979-12-17 1982-02-09 Bell Telephone Laboratories, Incorporated Method of cleaning test probes
JPH0244746A (ja) * 1988-08-04 1990-02-14 Hitachi Ltd ウエハプローバ
JPH03257185A (ja) * 1990-03-07 1991-11-15 Neos Co Ltd モリブデン製マスクの洗浄法
US5521518A (en) * 1990-09-20 1996-05-28 Higgins; H. Dan Probe card apparatus
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
JPH0827297B2 (ja) * 1993-10-29 1996-03-21 日本電子材料株式会社 プローブカード用プローブの洗浄液及びそれを用いた洗浄装置
JPH07234262A (ja) * 1994-02-22 1995-09-05 Sony Corp Icソケットの洗浄方法及び洗浄装置
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置
DE69625020T2 (de) * 1995-04-19 2003-07-24 Koninklijke Philips Electronics N.V., Eindhoven Verfahren zum reinigen von nadelkartenprüfspitzen
JPH11230989A (ja) * 1997-12-10 1999-08-27 Mitsubishi Electric Corp プローブカード用プローブ針のクリーニング方法およびクリーニング装置とそれに用いる洗浄液

Also Published As

Publication number Publication date
KR20010033836A (ko) 2001-04-25
JP2002501177A (ja) 2002-01-15
US6121058A (en) 2000-09-19
AU2092099A (en) 1999-07-26
WO1999035505A3 (en) 2000-04-06
WO1999035505A2 (en) 1999-07-15

Similar Documents

Publication Publication Date Title
KR100367112B1 (ko) 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법
US7142000B2 (en) Mounting spring elements on semiconductor devices, and wafer-level testing methodology
JP3123483B2 (ja) プローブカード及びプローブカード形成方法
US5914614A (en) High density cantilevered probe for electronic devices
US6722032B2 (en) Method of forming a structure for electronic devices contact locations
US6441320B2 (en) Electrically conductive projections having conductive coverings
US7517707B2 (en) Manufacturing method of semiconductor integrated circuit device and probe card
US6329827B1 (en) High density cantilevered probe for electronic devices
KR100278093B1 (ko) 반도체장치에탄성접촉구조물을장착하는방법
US7363694B2 (en) Method of testing using compliant contact structures, contactor cards and test system
KR100580008B1 (ko) 콘택터, 콘택터의 제조 방법 및 콘택터를 사용한 프로브 카드
US20080024155A1 (en) High density cantilevered probe for electronic devices
KR20050085387A (ko) 집적 회로의 검사를 수행하기 위한 소켓을 제조하는 방법및 제조된 소켓
JP2007101373A (ja) プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法
US6784556B2 (en) Design of interconnection pads with separated probing and wire bonding regions
US20030222668A1 (en) Method for producing micro probe tips
JP3703794B2 (ja) プローブおよびプローブカード
KR100214162B1 (ko) 마이크로 팁 상부에 수직형 프로브를 가지는 웨이퍼프로브카드 및 그 제조방법
JP3340060B2 (ja) 半導体検査装置
US20070024303A1 (en) Method of electrical testing
KR102820676B1 (ko) 필름형 프로브 유닛 및 그 제조 방법
JP3446636B2 (ja) コンタクトプローブ及びプローブ装置
KR20010051757A (ko) 반도체 장치 멀티-프로브 테스트의 초음파 어시스트
JP3848568B2 (ja) コンタクトプローブおよびコンタクトプローブの製造方法
JP3128200B2 (ja) 電子回路基板の検査方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20091209

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20101221

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20101221

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000