AU2092099A - Method for removing accumulated solder from probe card probing features - Google Patents

Method for removing accumulated solder from probe card probing features

Info

Publication number
AU2092099A
AU2092099A AU20920/99A AU2092099A AU2092099A AU 2092099 A AU2092099 A AU 2092099A AU 20920/99 A AU20920/99 A AU 20920/99A AU 2092099 A AU2092099 A AU 2092099A AU 2092099 A AU2092099 A AU 2092099A
Authority
AU
Australia
Prior art keywords
probe card
removing accumulated
accumulated solder
probing features
card probing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU20920/99A
Other languages
English (en)
Inventor
Melissa K. Shell
Richard S. Yoshimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2092099A publication Critical patent/AU2092099A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AU20920/99A 1998-01-02 1998-12-21 Method for removing accumulated solder from probe card probing features Abandoned AU2092099A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09002479 1998-01-02
US09/002,479 US6121058A (en) 1998-01-02 1998-01-02 Method for removing accumulated solder from probe card probing features
PCT/US1998/027393 WO1999035505A2 (en) 1998-01-02 1998-12-21 Method for removing accumulated solder from probe card probing features

Publications (1)

Publication Number Publication Date
AU2092099A true AU2092099A (en) 1999-07-26

Family

ID=21700971

Family Applications (1)

Application Number Title Priority Date Filing Date
AU20920/99A Abandoned AU2092099A (en) 1998-01-02 1998-12-21 Method for removing accumulated solder from probe card probing features

Country Status (5)

Country Link
US (1) US6121058A (https=)
JP (1) JP2002501177A (https=)
KR (1) KR100367112B1 (https=)
AU (1) AU2092099A (https=)
WO (1) WO1999035505A2 (https=)

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JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード
CN114174532A (zh) 2019-04-05 2022-03-11 德克萨斯大学系统董事会 细胞条形码编码的方法和应用
WO2020210521A2 (en) 2019-04-12 2020-10-15 The Regents Of The University Of California Compositions and methods for increasing muscle mass and oxidative metabolism
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US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
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Also Published As

Publication number Publication date
KR20010033836A (ko) 2001-04-25
JP2002501177A (ja) 2002-01-15
US6121058A (en) 2000-09-19
KR100367112B1 (ko) 2003-01-09
WO1999035505A3 (en) 2000-04-06
WO1999035505A2 (en) 1999-07-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase